Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Adhesives",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Silver-filled epoxy for flexible conductive bonds from
Eurobond Adhesives, which we summarised at the time by saying "The flexibility of Elecolit 3653 makes it ideal for applications that are subject to vibration or rapid temperature changes, thermal shock, twisting or buckling".
A few weeks before,
we featured the news release Adhesive suits automotive applications from
Rohm Electronics: "Robond Prohesion has the adhesive and humidity-resistance properties needed for door panels, interior pillars, instrument panels and ductwork".
In September 2007, we covered the news from Dow Corning
concerning its PV 6010, 7010 and 7020
- take a look at Encapsulant and potting agents are made for solar
which says: "Materials remain flexible and stable over wide temperature variations and offer easy reparability and global availability".
Take a look also at the news release from Huntsman Advanced Materials, Two-component adhesives bond RFID tags,
as well as Dispensing robot cleans up on coating from Intertronics,
and Inks aid medical sensor designs from Conductive Compounds.
See also:
Adhesive helps keep flip-chip BGAs cool
(May 2007)
High-performance thermal adhesive combines the proven reliability and flexibility of silicone-based chemistries with a silver filler to achieve high thermal conductivity
Distributors prove market expertise
(May 2007)
Lord Corporation has set up a new network to distribute its industrial electronics products and technologies
Expertise in adhesives spans several industries
(April 2007)
Expertise in the application of adhesives for crucial applications allows adhesive specialist to address special needs of medical sector
Soldering and reliability in the spotlight
(April 2007)
Dr Ning-Cheng Lee will lecture on metallurgical fundamentals and optimal processes at the International Conference on Soldering and Reliability in Toronto
Adhesives encapsulate, insulate and bond
(April 2007)
A comprehensive series of high-strength epoxy and polyurethane adhesives provides encapsulation, insulation and bonding of electronic components and PCBs
Adhesive answers Chinese electronics demands
(March 2007)
First controlled-volatility thermally conductive adhesive designed and developed specifically for customers in China and Taiwan
Electronic materials on show in Shanghai
(March 2007)
Huntsman Electronics has supported International Electronic Circuits Exhibition in Shanghai since 1999, and this year is presenting a range of advanced products
Troubleshooting and reliability in focus
(March 2007)
Lecture on lead-free electronics assembly at the SMT/Hybrid/Packaging Conference in Nuremberg, Germany, will emphasise troubleshooting and finished goods reliability
Adhesive films and preforms set for Nepcon launch
(March 2007)
Ellsworth Adhesives has confirmed plans to launch its new Techfilm product range at Nepcon 2007, where it will also showcase a range of established technologies
Range of assembly/rework systems at Nepcon
(March 2007)
A pre-heater Convection Tool and high performance DX-250 and DX-350 series of digital dispensers will be on dispaly at Nepcon at the Birmingham NEC in May
Nepcon stand to feature 14 systems
(February 2007)
Contax will demonstrate no fewer than 14 different systems at Nepcon 2007, covering a full range of processes
UV spotlamp is long-term cure for sealants
(February 2007)
Powerful UV spot curing system has intensity adjustment feature that allows users to take control of the desired intensity level and compensate for the decline due to aging
Adhesives focus for exhibition stand
(January 2007)
Intertronics reckons that Stand D37 at the Southern Manufacturing Show at Thorpe Park on 7th and 8th February is the place to go for anyone who specifies or uses adhesives
Customised labelling solutions explained
(January 2007)
Tyco Electronics offers a variety of labels ranging from blank labels to high specification customised labels
Potting and encapsulation gains full support
(January 2007)
RF Bright Enterprises has become the sole UK distributor for Sika resin products for the electronics and components industry and a main distributor for Sika assembly adhesives and sealants
Adhesives are made for mounting image sensors
(December 2006)
As the mobile handset image sensor market continues to expand at a rapid pace, new Loctite brand adhesive products meet the requirements of this significant high volume application
New product catalogue for 2007
(December 2006)
Anixter Components (formerly Heyco) celebrates the launch of its new 2007 product catalogue by offering 5% off all products ordered online by credit card
Cabinets keep sensitive substances dry
(November 2006)
Kaisertech has introduced a range of dry cabinets for the storage of moisture sensitive products such as electronic components, PCBs, solder pastes and adhesives
Membrane switch assemblies made to measure
(November 2006)
Miller Dial regularly conducts membrane switch projects that include custom design, PCBs, backplates, custom moulded boxes, precision colour matching and complete in-house circuit testing
Adhesives range answers electronics demands
(October 2006)
Specialist coatings, adhesives, encapsulants, potting, sealing and masking products are made for microelectronic and optoelectronic manufacture, rework and repair
Lee and Lasky to feature at lead-free workshop
(September 2006)
Ning-Cheng Lee and Ronald C Lasky will present at 'Implementing lead-free: a hands-on workshop', at the Rochester Institute of Technology this month
Parafix adds value to adhesive placement
(June 2006)
Parafix Tapes and Conversions has been confirmed as a value added reseller for AccuPlace's product line of film adhesive placement machines
Softer gap filler boosts thermal performance
(June 2006)
Material provides an industry-leading combination of specifications, including thermal conductivity, softness, robustness and ease of use, for demanding applications such as cooling laptop CPUs
Newsletter is dedicated to film adhesive world
(May 2006)
AccuPlace has launched a quarterly newsletter for customers and everybody being interested in the film adhesive world
Film adhesive solutions on show in Tokyo
(May 2006)
Accuplace will exhibit at the ISW show in Tokyo in June
Materials make light of bonding optics
(April 2006)
Two-part epoxy systems and other materials are specially designed for optical applications
Coating and cleaning in focus at Nepcon
(April 2006)
Concoat personnel will be available on Stand K77 at Nepcon UK to discuss significant advancements in both UV curable conformal coating materials and circuit board cleaning media
Novel materials absorb microwaves
(April 2006)
Microwave absorbers are increasingly being used to enhance shielding performance at higher frequencies
IEEE award for soldering expert Lee
(April 2006)
Dr Ning-Cheng Lee has been chosen to receive the 2006 Exceptional Technical Achievement Award IEEE Components, Packaging and Manufacturing Technology Society
Underfill technologies explained at symposium
(April 2006)
Materials expert Dr Brian Toleno will speak at the upcoming IMAPS Symposium on 26th April 2006 at the European Crystal Conference Centre in Algonquin Heights, Illinois
Imaging technology scoops Asian innovation award
(April 2006)
DEK has won the award for best entry in the dispensing systems/equipment category at the Electronics Manufacturing Asia Innovation Awards 2006
Mass imaging process improves die attach
(March 2006)
Processes for depositing silver epoxy and B-stage adhesives for die attach applications deliver higher throughput and repeatability as well as enhanced control over deposit characteristics
Hot designs need a stronger bond
(March 2006)
Heat-activated film answers many of the bonding challenges posed by design miniaturisation, but its efficient placement is a further challenge in itself
Piezo interfaces are environmentally sound
(March 2006)
The Everswitch piezo HMI product line complies with overall EU environmental policies and hence can contribute to the overall quality of products, reducing inefficiencies in overall lifecycle costs