Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "ASSP",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release RISC core covers full range of ASIC technologies from
Toshiba Electronics Europe, which we summarised at the time by saying "ARM Cortex-M3 core can be used in high-performance, low power consumption, minimum pin count ASICs, ASSPs and other system on chip solutions".
A couple of weeks before,
we featured the news release FPGAs take control of LCD panels from
Actel Europe: "Options appeal to designers of power-sensitive portable and handheld consumer, industrial, medical, automotive and military devices that use small- to medium-size LCDs".
In November 2007, we covered the news from AMI Semiconductor
concerning its Long-wire high-speed CAN transceivers
- take a look at CAN transceivers run over longer wires
which says: "Transceivers allow the use of CAN-enabled equipment in industrial applications requiring line lengths in excess of 500m".
Take a look also at the news release from Synplicity, ASIC prototyping board boasts biggest FPGA,
as well as One chip provides encoding and decoding from Xilinx,
and DC/DC convertor IP runs on standard CMOS process from Chipidea.
See also:
IP platform promises easy mixed-signal integration
(July 2007)
Platform offers an unprecedented level of analogue circuit integration and configurability for electronic communication and consumer applications
Programmable silicon is made for consumer designs
(July 2007)
Software Defined Silicon aims to provide consumer electronics system designers with the unit cost advantage of SoCs and the flexibility of FPGAs
Serdes board speeds ASIC prototyping
(May 2007)
High speed serial transceiver daughterboard accelerates verification and prototyping of ASIC based storage and communication systems
MCU is smart choice for card readers
(May 2007)
Single-chip microcontroller needs only a few passive external components to become a complete embedded smart-card reader solution
ASIC verification nears full device speed
(May 2007)
Software offers full visibility into FPGA-based ASIC and ASSP prototypes enabling designers to find, fix and verify functional errors at speeds approaching that of the final device
Reconfigurable logic IP cuts SoC design costs
(May 2007)
Standard cell based reconfigurable logic IP runs on TSMC's 90nm G, LP and GT logic processes
Design-led distributor expands into Germany
(May 2007)
A global distributor with annual sales of more than US $700 million, has entered the German market, and is seeking to carve out a niche as a design-led distributor
New VP of Sales for ASIC specialist
(April 2007)
Fred N Lancia II has been appointed Vice President of Sales for ASIC specialist eASIC
Power Architecture core available to license
(April 2007)
Freescale is to license its e200 cores through an agreement with semiconductor intellectual property licensing specialist IPextreme
Structured ASICs in ESC disruption
(March 2007)
eASIC Corp has been invited to present its structured ASIC products in the Disruption Zone at the Embedded Systems Conference Silicon Valley
Single chip drives three-phase brushless DC motors
(February 2007)
Driver IC brings together PWM sensorless motor control, protection functionality, an output power stage and an operational amplifier in a single 36-pin HSOP package
Tensilica audio/video processors at 3GSM Congress
(February 2007)
Tensilica will be showcasing mobile phones that use its audio and video processors at the 3GSM World Congress (Hall 2, Level 1, Booth 2.1A67) in Barcelona, Spain, February 12-15, 2007
Microcontrollers in embedded action
(January 2007)
Visitors to the Embedded World 2007 Exhibition and Conference in Nuremberg will be able to see Toshiba Electronics Europe's latest microcontrollers
Mixed-signal driver ASSP with protection
(December 2006)
AMI Semiconductor has expanded its family of high-side driver ASSPs with a new device designed specifically for the control of LEDs, relays, solenoids, transistor gates, valves and other loads
Automotive initiative bears fruit for Melexis
(November 2006)
Melexis has reported results for the third quarter of 2006, with revenues up 16% on the same quarter in 2005
Reference design at the point of sale
(November 2006)
The Zilog ECOSystem is a comprehensive POS reference design kit for the company's ZA9L ARM-9 ASSP family
Low-cost FPGAs gain PCI Express core support
(November 2006)
PCI Express core is optimised for the newly announced LatticeECP2M low-cost FPGA family
Lo takes on ASSP business
(November 2006)
Davy Lo has been appointed Chief Marketing Officer for Zetex Semiconductors' ASSP business group
Multichip initiative on automotive integration
(September 2006)
Freescale is working with Elmos Semiconductor to deliver innovative multichip products designed to embed a higher level of intelligence into next-generation automotive systems
Thorburn steps down at Zilog
(August 2006)
Zilog Chairman and CEO Jim Thorburn has resigned and has been replaced by CEO Robin Abrams who currently serves on the company's Board of Directors
Atmel opts for configurable video
(August 2006)
Atmel Corp has taken a licence for the ARC Video Subsystem
Simplified control of automotive loads
(July 2006)
Miniature ASSP integrates eight drivers, protection, microcontroller interface, charge pump and diagnostics into single SO28
FPGAs secure intellectual property investment
(June 2006)
An easy-to-implement Stratix II design security solution uses AES along with a 128bit nonvolatile key, and is ideal for applications requiring design flexibility and protection
ASICs and ASSPs come together in Nuremberg
(April 2006)
Prema Semiconductor is exhibiting for the first time at this year's PCIM Europe in Nuremberg from 30th May to 1st June 2006
Transceivers are fit for fieldbus protocols
(April 2006)
A fieldbus media attachment unit IC meets the specifications of the IEC61158-2, H1, and EN 50170 physical layer standard, including Foundation Fieldbus H1 and Profibus PA protocols
Antonopoulos has worldwide responsibility
(April 2006)
Nick Antonopoulos is the new Executive Vice President of Worldwide Sales at Zilog
Sound subsystem set for automotive duties
(April 2006)
Oki Electric is to use the ARC Sound Advanced Subsystem in an application specific standard product targeting next generation in-car audio applications
Vogel rises to senior European role
(March 2006)
Ronald Vogel, an 18-year veteran of LSI Logic Corporation, has been appointed Vice President of Sales and Marketing, Europe
IP subsystem is sound addition to SoC design
(March 2006)
The ARC Sound Advanced Subsystem is a configurable solution that is preverified to reduce component cost and power while accelerating design time for next-generation consumer products
Reconfigurable platform for automotive displays
(February 2006)
Altera and TES Electronic Solutions have developed a novel first cost-effective reconfigurable platform for automotive display applications
Renesas licenses SMSC technology
(November 2005)
SMSC and Renesas Technology have reached a licensing agreement enabling Renesas to use SMSC technology, providing Digital Transmission Content Protection (DTCP) for DVD audio and video
Motherboards master FPGA prototyping
(October 2005)
Hardi Electronics has used the ARM Developer's Conference to release a new series of motherboards it claims feature unmatched performance and capacity
PLDs cut the cost of consumer DSP functions
(September 2005)
LeapFrog Enterprises reduced costs and increased flexibility in the manufacturing process for its new Leapster L-MAX learning game system by integrating Altera MAX II CPLDs into the learning platform
First Silicon Solutions joins MIPS empire
(September 2005)
MIPS Technologies has acquired First Silicon Solutions (FS2), a Lake Oswego, Oregon company as a wholly owned subsidiary