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"Automatic placement"...

Laurence Marchini

Laurence Marchini, Editor, writes:
 

We see from your search that you're looking for information on the term "Automatic placement", and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest. Let me be your guide.
 
Start with the news release Chip resistors are ten-times more accurate from Tyco Electronics UK, which we summarised at the time by saying "Ultra-high-stability precision chip resistors are now available with resistance tolerances down to 0.01%". A few weeks before, we featured the news release Voltage divider provides high stability from IRC Advanced Film Division: "The TaNFilm voltage divider is ideal for battery monitoring, voltage references, voltage conversion, voltage regulators, logic-level conversion, DC/DC convertors and power supplies".
 
In June 2007, we covered the news from Tyco Electronics UK concerning its SM series power resistors - take a look at Resistors are made for automated assembly which says: "Power resistors offer the user the ability to use true vacuum pick place heads for automatic placement".
 
Take a look also at the news release from NIC Components Europe, Chip capacitors handle the heat of reflow, as well as Electrolytics handle higher solder temperatures from NIC Components Europe, and RGB LEDs create a colourful display from Optek Technology.
 

See also:

Component placement cell chosen by Editors (July 2006)
Palomar Technologies has received an Editors' Choice Best Product Award for its Model 3500-II automatic component placement cell

IC design software adds advanced placement (April 2006)
Pulsic has launched its advanced placement technology with the roll out of the latest version of Lyric 4-10

Multichip LEDs provide high luminance (January 2006)
The OVTL09LGA Lednium series of high-luminance 10W LED sources was developed by Optek for applications in the automotive interior and exterior lighting, architectural lighting and signage markets

Electrolytic capacitors handle lead-free reflow (January 2006)
New extended temperature SMT electrolytic capacitors meet the market demand for components suited to the higher temperatures required by lead-free soldering

LEDs square up to boost brightness (November 2005)
A new range of high-brightness, square, visible LEDs is ideally suited to a wide variety of roles that include signage, automotive, traffic control, decorative and landscaping applications

Four-gantry machine boosts placement performance (November 2005)
The Quadris-S four-gantry placement machine uses advanced motion controls to achieve the highest throughput-per-machine-footprint in its class and boasts the widest part range without changing heads

Unit prepares SMDs for placement (May 2005)
The Dima Handytaper from Kaisertech provides a quick and reliable method of packaging low to medium volumes of SMD components ready for automatic placement

Pick and place machine absorbs production peaks (January 2005)
Flame detection equipment maker Talentum Developments has seen a big improvement in PCB quality and throughput since installing a TWS Quadra Laser pick and place machine

Precision chip resistors shrink and grow (January 2005)
The Holsworthy RN73 series of ultraprecision chip resistors has been extended to offer smaller sizes and greater resistance value ranges

Budget design package boasts high-end features (January 2005)
Easy-PC 8 is the latest version of the world famous windows-based software tool for printed circuit board design and schematics capture

Mini SD card connector saves more space (December 2004)
The Hirose DM2B is a push to insert and push to eject Mini SD card connector

Connector gives back 10% of PCB area to designers (November 2004)
JAE Europe has saved 10% of the PCB mounting space for an SD card connector with its new SG5 model, giving designers extra flexibility to optimise board layout

Novel technology shrinks MPEG2 codec chip die (July 2004)
To meet the low cost requirements of high volume markets, Toshiba turned to AFP technology to reduce the die size of its eight million gate design by 10.5%

Quad-beam system speeds high-volume placement (July 2004)
Universal Instruments is bolstering its high-speed chip placement offering with the introduction of the Quadris placement machine

Compact MLCs handle higher voltages (June 2004)
A new series of high-voltage ceramic chip capacitors supports up to 1000V in a tiny 0805 package for power supplies, high-voltage coupling and DC/DC convertors

Two wins for automatic placement system (January 2004)
Both Data Track Technology and ECM have selected the automatic Essemtec CLM9000 style of placement system with vision capabilities

Design framework cuts out manual analogue tasks (October 2003)
The latest release of the Lyric Physical Design Framework delivers enhanced tools for analogue and mixed-signal design, and significant design completion and reliability benefits

Automatic placement for novel plastic shield (February 2003)
DEK has combined with WL Gore and Associates to deliver a lightweight, easily removable EMI board-level shield for wireless communications devices

Holders simplify onboard fuse replacement (November 2002)
Two ranges of open fuseholders, designed to enable easy replacement of blown onboard miniature fuses, have been introduced by Wickmann Components

Crystals cut cost, size and weight (November 2002)
Advanced Crystal Technology has further reduced the size of surface mount crystals with the launch of the ACT711S

Surface-mount socket puts fuses onboard (October 2002)
Wickmann Components has a surface-mount fuse socket designed to accept radial leaded TR5 and TE5 subminiature fuses, providing cost savings of up to 50% compared with other solutions

Safety certified MLCCs are robust by design (April 2002)
Flint has two new families of ceramic multilayer chip capacitors that meet IEC safety standards for mains and line powered products such as modems, faxes, telephones, AC adapters or battery chargers

Inductor pair ideal for digital appliances (April 2002)
Available from Young ECC, the LE series of SMD inductors and LB wound chip inductors are manufactured by Taiyo Yuden and are aimed at digital applications

Piezoelectric sounder saves space in handhelds (February 2002)
TTI has an inexpensive surface-mount sounder from Murata

Ultralight SM coaxial connectors keep low profile (August 2001)
New SMT coaxial connectors from Flint Distribution enable 2.5mm-high PCB-mounted connections, and are among the lightest in the world

Slimmest wire-to-board connectors yet (July 2001)
Flint is offering customers its slimmest wire-to-board connectors yet, with the introduction of the DF19 from Hirose

Crystals shrink to the surface (July 2001)
Advanced Crystal Technology has further reduced the size of surface-mount crystals by introducing the ACT200

Low-profile FPC connectors offer greater density (June 2001)
The FB1 series from JAE is a 0.3mm pitch low profile connector for FPC (flexible printed circuits) designed for use in applications where size and weight are a premium

SMD light pipes with integrated LEDs (June 2001)
New from CTL Components is the world's first range of taped-and-reeled SMD light pipes featuring integrated LEDs

Ultra-fine-pitch connectors with up to 100 pins (May 2001)
Harwin's new MP6 range of surface-mount ultra-fine-pitch connectors are suitable for internal mounting where miniaturisation and light weight are paramount

Datamate comes to the surface (January 2001)
Following the recent successful launch of the male crimp series, Harwin's Datamate range is being extended further to include vertical surface mount connectors

 

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