Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Automotive industry",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release WiFi accessory offers an easy upgrade from
Telit Wireless Solutions, which we summarised at the time by saying "The WA100-Dual is a versatile addition to any GE863-PRO3-based design, instantly adding the power of WiFi communications and the versatility of the SDIO interface".
A couple of weeks before,
we featured the news release Software meets updated automotive standards from
LDRA: "As a long-standing MISRA committee member, LDRA has been closely involved with the development of the new MISRA-C++:2008 standard, facilitating its early support in the LDRA tool suite".
In January 2008, we covered the news from Xilinx
concerning its XA Spartan-3A FPGAs
- take a look at Low-cost FPGAs offer dense logic and memory
which says: "XA Spartan-3A FPGAs offer the highest number of I/O per logic cell with broad connectivity support, providing flexibility and scalability for I/O-intensive display and LED backlight applications".
Take a look also at the news release from Ansoft Europe, Simulation software runs German automotive models,
as well as Socket speeds automotive upgrades from ODU UK,
and Fine-pitch connectors bring ribbons onboard from TTI Europe.
See also:
Flash-based FPGAs qualify under the bonnet
(August 2007)
AEC-Q100 Grade 2 and Grade 1 qualification for FPGAs ensures their quality, reliability and endurance in automotive applications
Encapsulants suit lead-free soldering
(August 2007)
ME-532 flip chip underfill is specifically formulated to achieve high reliability for in-package or chip-on-board applications where fast flow under large chips is required
Interface eases automotive testing
(August 2007)
Smartcar is a universal, modular and portable hardware interface that eases access to CAN, LIN and K-line communications interfaces
Model-based design supports Autosar
(July 2007)
Volkswagen has demonstrated to the automotive industry how the Autosar standard can be put into practice and integrated into next-generation vehicle design and development
Springs bring superior electrical performance
(June 2007)
Spring-loaded contacts improve signal integrity, raise reliability and current density, and deliver improved parametric stability over time
Virtual processor speeds Freescale development
(June 2007)
A new virtual processor model of Freescale's e200z6 core delivers both high performance and timing accuracy
Display technology upgrades handheld video
(June 2007)
Displays are engineered for the mobile phone and automotive industries to enable operators/manufacturers to maximise revenue potential and increase customer satisfaction
USB instrument exercises automotive sensors
(June 2007)
Goepel Electronic has extended its range of USB modules for automotive test applications with a high-density resistance simulator card
Workbench standardises automotive design
(May 2007)
Tools package allows developers to use a C/C++ compiler for Renesas R32C designs, with advanced features particularly suited to automotive applications
Linux platform set for automotive standard
(May 2007)
Platform is chosen for developing vehicle onboard equipment for proof-of-concept activities
CPU board speeds FlexRay development
(May 2007)
CPU board is based on Fujitsu's MB91F465XA with an integrated FlexRay communication controller
EMC lab gains accreditation from car makers
(May 2007)
Shanghai-based lab is certified as an A2LA (American Association for Laboratory Accreditation) accredited laboratory under AEMCLRP program for EMC testing
Working group to standardise Bluetooth interface
(April 2007)
CSR is helping to develop a standard interface/API for designers to quickly and easily bring Bluetooth products to embedded and automotive markets
MEMS process innovation wins Europe-wide award
(April 2007)
Two Bosch Group researchers have been named 'European Inventors of the Year'
Ceramic capacitor with conformal coating
(April 2007)
An automotive-grade conformally coated ceramic radial leaded capacitor can work at temperatures up to 150C, making it suitable for a variety of automotive and industrial applications
Automotive electronics standard discussed
(April 2007)
More than 100 representatives of the partners and members contributing to MOST came to Frankfurt on March 27th, 2007, to present experiences and solutions during the conference and at the exhibition
Digital and mixed-signal scopes get battery power
(April 2007)
The 6000 Series of digital storage oscilloscopes and mixed-signal oscilloscopes now have battery options for use in field applications where line power is unavailable
Power Architecture core available to license
(April 2007)
Freescale is to license its e200 cores through an agreement with semiconductor intellectual property licensing specialist IPextreme
FlexRay controller works with several buses
(March 2007)
32bit controller enables implementation of the FlexRay protocol without the need for companion devices
Semiconductor packages for high temperatures
(March 2007)
At a workshop, new packaging and manufacturing techniques for the use of semiconductors at high temperatures was demonstrated
Miniature antennas are made for telematics
(March 2007)
Full line of miniature antenna systems for the telematics market includes tri-, quad- and penta-band cellular products compatible with the latest generation of GSM and 3G modules
Goeschel brings automotive expertise
(February 2007)
Former BMW executive, Prof Burkhard Goeschel has been appointed to Maxwell's board of directors
Update for safety-critical application development
(February 2007)
Unified Modelling Style enables embedded systems and software developers to freely combine and nest arrayed data flow elements and state machines in a single, fully integrated environment
Programming system is made for automotive duties
(February 2007)
Automotive programming system, based on the PS Series platform, is tailored for OEM and Tier 1 and 2 manufacturers of automotive electronics systems
Thick film heater stops fluid from freezing
(January 2007)
Module combines IRC's anodised aluminium substrate technology with a thick film resistive element to produce a tubular instant fluid heater
Chinese plant to expand PCB materials production
(January 2007)
Huntsman Corp has expanded production capacity for its printed circuit board materials by investing in new production facilities at its site in Panyu, China
eCall system benefits confirmed
(January 2007)
Research report verifies the socioeconomic profitability of the eCall system, proposed by the European Commission
Optimising tool for electronic control units
(December 2006)
TTAutomotive, TTTech's subsidiary for FlexRay solutions, has released TTX-Build for Autosar standard software configuration
Lattice receives ISO/TS 16949 certification
(December 2006)
Lattice Semiconductor has achieved certification of its quality systems to Automotive Industry Quality Standard ISO/TS 16949
FlexRay transceiver enters volume production
(November 2006)
NXP has announced the availability of the world's first FlexRay transceiver, the TJA1080, now in volume production
Distribution agreement expands over Europe
(November 2006)
Rutronik and Infineon Technologies are to extend their distribution agreement to include the UK, Ireland, Spain and Portugal, along with South Africa
FRAM devices set for automotive qualification
(November 2006)
Ramtron International Corp has begun an AEC-Q100 automotive qualification programme for its FRAM devices
DaVinci processors are tuned for specific markets
(November 2006)
Continuing to expand the availability of digital video, Texas Instruments is sampling four new DSP-based digital media processors priced as low as US $9.95
EDA tools lead to SiGe:C BiCMOS process
(November 2006)
Users of Tanner EDA tools are to get economical access to an analogue and mixed-signal 0.25um SiGe:C BiCMOS process through a new collaboration with IHP's pilot line in Frankfurt