Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "BGA packages",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Microprocessor helps boost battery life from
Renesas Technology Europe, which we summarised at the time by saying "The SH7721 microprocessor integrates a TFT controller with up to 1024 x 1024 resolution and with an associated, dedicated 2.4Kbyte line-buffer RAM to prevent flickering".
A couple of weeks before,
we featured the news release Express switches are optimised for communications from
IDT: "Switches enable communications system architects to leverage PCIe's power savings, scalability and cost advantages as a primary system or backplane interconnect".
In November 2007, we covered the news from Atheros Communications
concerning its AR3031
- take a look at Bluetooth system suits wireless headsets
which says: "The AR3031 also features an integrated, high-density read-only memory, which provides greater cost-efficiencies over higher-priced, competitive Flash-based solutions".
Take a look also at the news release from Integrated Silicon Solution, Automotive SDRAMs expand temperature range,
as well as IC extends mobile device battery lives from Atheros Communications,
and Interposers ease BGA device transitions from Advanced Interconnections Corp.
See also:
Evaluation board puts 2D graphics IC on trial
(January 2007)
Design engineers working on applications involving displays will benefit from a new low cost development tool from Glyn
Bluetooth chip to enhance desktop datarates
(January 2007)
Bluetooth 2.1 + EDR IC is the smallest and enables the lowest-cost Bluetooth design to date, intended to drive adoption of Bluetooth technology in laptops and desktops
FPGA devices come in smaller BGA packages
(January 2007)
Advanced packaging meets the aggressive requirements of handheld electronics integrating storage, wireless, mobile TV and other emerging technologies
USB controller rises to high speed
(June 2006)
USB controller provides portable consumer electronics designers with the means to enhance product connectivity and significantly increase data throughput
Single-chip receiver tracks weak GPS signals
(June 2006)
Single-chip device integrates a complete Antaris 4 GPS receiver including ROM-based SuperSense software in a 96-pin BGA package
16bit MCU integrates more in less space
(April 2006)
A low power 16bit microcontroller combines 24MHz CPU performance with 256Kbyte Flash and USB in a compact 10 x 10mm CSP package
Programmable logic meets automotive standard
(April 2006)
Automotive programmable logic devices have been characterised and qualified to meet the certification requirements of the AEC-Q100 standard as defined by the Automotive Electronics Council
Track-and-hold amps boast ultrawide bandwidth
(April 2006)
Inphi is claiming a new industry standard with the launch of its GigaTrack family of 2Gsample/s track-and-hold amplifiers that deliver ultrawide 18GHz analogue bandwidth
Underfill cures rapidly at low temperatures
(February 2006)
Loctite 3549 is a high flow underfill formulated specifically for use with today's advanced CSP and BGA packages
Controllers put 3D graphics on the road
(February 2006)
Two graphics display controllers designed for the embedded automotive market include the world's first controller for this sector to be fabricated in 90nm technology
Complete GPS receiver shrinks into 96-pin BGA
(February 2006)
The new single-chip ATR0630 measures just 7 x 10mm and integrates a complete Antaris 4 GPS receiver, including ROM-based software in a 96-pin BGA package
PCI Express switches offer design flexibility
(November 2005)
Two new IDT three-port PCI Express switches combine high performance and an architecture that permits numerous configuration options for design flexibility
Resistor networks available in four package styles
(November 2005)
Providing design engineers with an economical means of creating precision voltage dividers, TT Electronics BI Technologies is offering its series of precision thin-film resistor networks
High-speed PCI bridge fits in limited space
(April 2005)
The PLX FastLane PCI 6466 is billed as the industry's smallest 64bit, 66MHz PCI bridge
Chip cuts design time for video switching
(March 2005)
Intersil has developed a new triple 16x5 video switch ideal for high bandwidth RGB (red, green, blue) switching applications
Processors package up to four circuits
(October 2004)
Following the launch of three low-density CES-over-packet processors, Zarlink Semiconductor now offers the industry's only end-to-end portfolio of circuit-to-packet devices
Single-chip solution brings pen sensing onboard
(September 2004)
A new mixed-signal IC allows the easy integration of Wacom's proven inductive pen sensing technology into mobile devices such as smartphones and personal digital assistants
Adapters speed programming and prototyping
(September 2004)
Two new adapters from Emulation Technology support the Atmel AT45DB011B/021B and AT45DB161B/321DC DataFlash devices in chip scale BGA packages
Thermal simulation optimises memory stack design
(September 2004)
Staktek, a leading supplier of high-density memory stacking solutions, is using Flotherm thermal simulation software to ensure that innovative new products meet thermal management requirements
Budget route to repair BGA packages
(June 2004)
The Practical Components BGA Reballing Kit features patented stencils and holders are used to manually rework BGA components to original condition
Slice brings more gates and memory to the platform
(April 2004)
LSI Logic continues to expand its RapidChip Integrator platform ASIC family with the release of the RC11Si250 slice, claimed to offer the highest logic and memory content of any 0.11um platform ASIC
Breakthrough pricing claim for performance DSPs
(April 2004)
The TMS320C6410 and TMS320C6413 are high-performance digital signal processors available at breakthrough price points
Wolfson scraps lead from new products
(April 2004)
Wolfson Microelectronics is to supply all its new products in lead-free format only, compatible both with conventional SnPb and Pb-free soldering processes
Echo cancellation chips target lower densities
(March 2004)
The OCT6100 Series carrier-grade echo cancellation solution is now available in 32 and 64 channels with pricing as low as US $1.20 per channel
Dual-output power blocks simplify DC/DC design
(February 2004)
International Rectifier has introduced the industry's first dual-output, two-phase DC/DC power blocks in single, easy-to-use BGA packages for synchronous buck applications
Custom boards speed BGA test throughput
(November 2003)
Custom-engineered microchip socketed test fixture boards electrically interface test equipment to BGA packages and eliminate the time-consuming need to solder the packages to adapters
Fast Ethernet switches show their intelligence
(August 2003)
A new family of small Fast Ethernet switching chips delivers advanced features to a switch segment traditionally served by devices with only limited functionality
World's first claim for single-chip switch
(July 2003)
Fujitsu Laboratories of America has developed the industry's first 10Gbit/s Ethernet switch chip developed for layer-2 functions in high-performance server designs
New generation DSPs boost speed and cut power
(March 2003)
The next-generation Blackfin processor family is claimed to deliver twice the performance at half the power consumption of conventional DSPs and embedded processors
Fast Ethernet switches add quality of service
(February 2003)
The ZL 50418 family of Ethernet switching chips comprises four devices that cost-effectively aggregate 16 ports of Fast Ethernet traffic
LCD controllers support mobile video
(February 2003)
As one of the worlds largest producers of LCD controllers and displays for the mobile phone market, Epson has developed the S1D13710 and S1D13712 LCD controllers
DSP provides more MMACS for your money
(November 2002)
Texas Instruments is sampling a DSP it claims offers the industry's most millions of multiply accumulates per dollar and per watt
Complex logic range goes even wider
(June 2002)
Lattice Semiconductor has released the first member of its 2.5V ispMACH 5000B family, the 256-macrocell ispMACH 5256B
HFSS adds integrity to ASAT's designs
(April 2002)
ASAT has chosen Ansoft's HFSS high-frequency structure simulator for its high-frequency 3D simulations and signal-integrity analysis