Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "BGA packaging",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release FPGA devices come in smaller BGA packages from
QuickLogic, which we summarised at the time by saying "Advanced packaging meets the aggressive requirements of handheld electronics integrating storage, wireless, mobile TV and other emerging technologies".
The same day,
we featured the news release Audio codec takes dual-mode amp onboard from
Wolfson Microelectronics: "Audio codec features a dual mode, 1W speaker driver with the flexibility to switch between Class AB and Class D operation".
In February 2006, we covered the news from Texas Instruments (April 2001-March 2006)
concerning its TMS320F2802, C2801 and C2802
- take a look at DSP-based controllers boost PWM precision
which says: "Four new members of the TMS320C2000 platform are optimised for motor control, digital power conversion and intelligent sensor control".
Take a look also at the news release from Alpha Micro Components, Triband GSM modem shrinks into BGA packaging,
as well as BGA reed relays provide superior RF performance from Sequoia Technology,
and Optocoupler shrinks into BGA packaging from Fairchild Semiconductor.
See also:
Licence to proliferate BGA power packaging
(March 2004)
Fairchild Semiconductor has licensed Gem Services to offer one of Fairchild's most advanced MOSFET packaging technologies as open tooling for the power semiconductor market
BGA package shrinks microcontroller footprint
(October 2003)
A new 144-ball BGA package reduces the size of the eZ80Acclaim! eZ80F91 by 65%, freeing precious PCB real estate for applications in which space is a critical constraint
BGA packaging boosts RF relay performance
(October 2003)
A new range of ball-grid-array (BGA) reed relays uses patented technology to provide leadless relay packages with enhanced RF performance
Schottky shrinks into BGA packaging
(September 2003)
The FlipKY is billed as the smallest Schottky diode in the industry
Buffers provide full JTAG test access
(June 2003)
Two new integrated circuits provide easy, cost-effective testability in basestations, switchers, multiplexers and other low-voltage telecommunications systems
Display controllers dash to multimedia
(February 2003)
The new Coral family of graphics display controllers from Fujitsu Microelectronics offers major enhancements to the company's successful Cremson family
Bluetooth modules handle audio signals
(December 2002)
Two GenBlue modules each features a Bluetooth 1.1 implementation with integrated RF, Flash and crystal within a compact form factor
Military databus shrinks into BGA
(September 2002)
A new option offers the smallest footprint of any MIL-STD-1553 integrated terminal in the industry and is the first of its kind offered in a BGA package
Dual MOSFETs shrink to protect
(July 2002)
Fairchild Semiconductor has two new dual N-channel and two new dual P-channel 20V MOSFET BGA products with physical and electrical characteristics ideal for Li-ion battery pack protection
Even smaller package for lov-voltage logic family
(May 2002)
Texas Instruments has released its Advanced Ultra-Low Voltage CMOS (AUC) logic technology
Networked microprocessors shrink to BGA
(March 2002)
New from Solid State Supplies, the NET+20M and NET+50M networked microprocessors feature BGA packaging to reduce their footprint from 28 to 15mm2
BGA-packaged MOSFETs save space and resistance
(March 2002)
Fairchild has come out with 11 more high-performance small-footprint BGA-packaged MOSFETs, including single and common-drain dual devices in both N- and P-channel versions
Speedy 5ns performance from 768-cell CPLD
(January 2002)
Lattice Semiconductor has released the ispMACH 5768VG, featuring 768 high-performance logic macrocells, the smallest member of the ispMACH 5000VG SuperBIG CPLD family
Video codec covers standard and high definitions
(January 2002)
Philips Semiconductors reckons it is the first manufacturer to ship a multistandard high-definition (HD) video codec to the mass market
Approval for 184-pin FBGA-based DDR DIMMs
(October 2001)
Prototype 184-pin PC2700 registered FBGA-based DDR DIMMs from SMART Modular Technologies have been successfully tested and conform to the new JEDEC DDR333 standard
GTLP backplane transceivers in BGA packages
(September 2001)
Fairchild Semiconductor has released a line of Gunning transceiver logic plus (GTLP) transceivers in BGA packaging, beginning with 18 and 36bit wide universal bus transceivers