Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Cellphones",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Chipsets enable connected mobile entertainment from
Qualcomm, which we summarised at the time by saying "Combined support for wireless connectivity; high-accuracy multimode GPS positioning; a high-performance applications processor; support for broadcast mobile TV; and rich multimedia".
A couple of weeks before,
we featured the news release Replica transistor celebrates 60th birthday from
LSI Europe: "LSI has donated a replica of the first transistor to the Computer History Museum in Mountain View, California".
In January 2008, we covered the news from Linear Technology Corp
concerning its LTC3672B-1 and LTC3672B-2
- take a look at Handset TV chipsets powered from a single IC
which says: "Three-output power ICs are ideal for digital media broadcasting and digital video broadcasting chipsets found in the latest generation of cellphones and PDAs".
Take a look also at the news release from Texas Instruments (April 2006-), Management IC is adapted to silver zinc batteries,
as well as Controller has universal appeal for IR remotes from Zilog,
and LED driver gains a fractional advantage from Catalyst Semiconductor.
See also:
Circuit protection lab opens in Shanghai
(December 2007)
Chinese lab to focus on overvoltage protection for portable consumer products and telecommunications equipment such as cellphones and DSL modems
Single-chip transcoder for consumer devices
(December 2007)
Device enables consumer electronics device manufacturers to add more features, provide portability and offer more flexible product offerings to their service provider customers
Korean memories come to Central Europe
(December 2007)
Memorysolution is taking over the distribution of the whole range of memory products manufactured by Hynix into Central European markets
CMOS image sensors made with smaller pixels
(November 2007)
The Tower platform is a very attractive option for customers seeking high resolution, low noise and small form factor
Supercapacitors tolerate high temperatures
(September 2007)
CAP-XX supercapacitors pack the highest energy and power densities into thin, lightweight, prismatic packages that will fit into slim portable devices
MOSFETs survive larger voltage spikes
(August 2007)
Low-on-resistance N-channel MOSFETs boost system efficiency and offer new levels of ESD prptection
New name in silver-zinc battery technology
(August 2007)
ZPower will continue to develop its award-winning rechargeable silver-zinc battery which provides a 30% increase in energy density over traditional lithium-ion batteries
Charger chip is flexible about its inputs
(August 2007)
Dual-input linear battery charger has all the circuitry required to charge single-cell Li-ion/polymer batteries from wall adapter or USB power sources
Low-voltage convertors are smallest yet
(July 2007)
High-performance step-down DC/DC convertors support low-power DSPs and microcontroller-based equipment, saving space in portable designs
LED driver is cost engineered for budget handsets
(July 2007)
Driver chip provides basic illumination for low-cost TFT-LCD panels in an extremely small footprint while requiring just two external components
Switch limits current dangers
(July 2007)
Current limit switch in a space saving SOT-23 package protects critical system circuitry by disconnecting the source on detecting a current greater than 800mA
Transatlantic accord to advance CMOS processes
(July 2007)
STMicroelectronics and IBM agree collaborate on the development of next-generation 32 and 22nm CMOS process technology
Driver dims multicolour LED lighting
(July 2007)
High-efficiency driver is designed to drive tricolour RGB LEDs for fun lighting or enhanced LCD backlighting in portable applications
Bluetooth module has PIC in control
(July 2007)
Transceiver module combines a PIC microcontroller with Bluetooth 2.0 radio
Slimline accelerometer aids handset integration
(June 2007)
Three-axis digital-output accelerometer is claimed to be 77% smaller than previous industry offerings
Copper process upgrades passives performance
(June 2007)
HighQ IPD process technology is ideal for the production of passive devices - such as baluns, couplers and filters
Report forecasts cellular market moves
(June 2007)
In-depth study of the worldwide cellphone market provides dozens of forecasts by technology and by region through 2011 of handsets, subscribers and chips of all types
OLED power IC integrates more functions
(May 2007)
Power device is billed as the industry's most complete boost regulation solution for passive matrix OLEDs
Power sensor links to PC via USB
(May 2007)
The MA24106A is a highly accurate power sensor that measures True-RMS power, regardless of the input signal or its bandwidth over 63 dB of dynamic range from 50MHz to 6GHz
Medical instrument company joins Continua Alliance
(May 2007)
A new member for the Continua Health Alliance, an industry body aimed at promoting interoperability across emerging technology-based health and wellness applications
Driver deal to accelerate display expansion
(April 2007)
Tomato LSI is to produce the world's first commercially available three-chip PenTile RGBW driver for amorphous silicon TFT widescreen VGA display panels up to 5in diagonal
Serialiser is made for camera sensor data
(April 2007)
MicroSerDes device is specifically designed for serialising high-speed signals from multi-megapixel-resolution CMOS and CCD image sensors in portable products
Source code checking is improved
(April 2007)
Tools enable software developers to easily create customised source code checkers that work with Coverity Prevent, the company's flagship analysis product
Radio SoC on the shortlist
(March 2007)
WirelessUSB LP radio SoC is a finalist for CMP Technology's EE Times third Annual Creativity in Electronics Awards for 2007
Memory subsystem marries Flash and RAM benefits
(March 2007)
Revolutionary memory subsystem blends key benefits of NOR, NAND and RAM in a unified architecture
Electronic compass shrinks to chip-size packaging
(March 2007)
AKM has completed development of the world's smallest and thinnest three-axis electronic compass with chip-size packaging of 2.5 x 2.5 x 0.5mm
Mobile comms continues to drive IC sales
(March 2007)
Continued demand for communications and portable computing devices with innovative new features will drive purchases this year and help boost sales of the semiconductors used in these products
Low-power wireless platform passes the test
(February 2007)
The highly integrated Sensium chip has met all the targeted accuracy and performance parameters in initial functional testing
Charger chips take adapter and USB inputs
(February 2007)
Stand-alone dual-input linear battery chargers replenish single-cell Li-ion/polymer batteries from wall adapter or USB power sources
OLEDs in displays and lighting applications
(February 2007)
The market for OLEDs used in displays and lighting applications is expected to reach US $10.9 billion by 2012 and grow to $15.5 billion by the year 2014
Customisable DC/DC convertor IC takes IEC award
(January 2007)
The International Engineering Consortium (IEC) has honoured National's highly integrated LM3370 DC/DC convertor with its prestigious DesignVision Award
CES 2007 demo combines DLP with OMAP
(January 2007)
Texas Instruments delivers portable access to personalised content, as well as the flexibility to share and view it with friends, family, colleagues and classmates
LDO boasts superior stability and low noise
(January 2007)
Low-dropout regulator combines superior power supply rejection ratio for stability, and low noise for integration, making it ideally suited for GSM portable wireless applications
HDMI ICs boost picture quality
(December 2006)
HDMI v1.3-compatible multiplexer, receiver and transmitter circuits help the HD video market achieve new levels of picture quality and power efficiency