Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Crosstalk",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Speedy access to latest Molex lines from
RS Components UK, which we summarised at the time by saying "All the latest connectors from Molex are now available from RS Components".
Earlier in the week,
we featured the news release Software spots EMC issues in PCBs and cables from
CST - Computer Simulation Technology: "New additions to simulation suite aim to expose EMC issues early in the design process, reducing the number of expensive cut and try iterations".
In February 2008, we covered the news from Molex UK
concerning its Copper Flex assembly with PCBeam interposer
- take a look at Alliance creates high-speed board-flex link
which says: "Copper Flex assembly with HS and S PC Beam interposer enables unparalleled design flexibility and true position accuracy".
Take a look also at the news release from Molex UK, Connectors support next-generation mezzanine cards,
as well as Test helps improve optical efficiency from Anritsu (UK),
and Audio analyser brings manufacturer into line from Prism Sound.
See also:
Backplane connectors are easy on dughtercards
(December 2007)
The Z-Pack TinMan connector design offers a fully protected right-angle receptacle for use on daughtercards where handling damage can be a concern
Protection devices combine for HDMI interfaces
(November 2007)
ESD and overcurrent protection reference layout meets or exceeds the HDMI 1.3 specifications for operation at 3.4Gbit/s for impedance, data eye and far end crosstalk
Compact connectors bring PCIe onboard
(November 2007)
Connectors combine cable-mount plugs and PCB-mount receptacles featuring through-hole pin termination
Shielded cabling protects against crosstalk
(October 2007)
The TX6 10Gig shielded copper cabling system suits use in data centre server links and high-end workstations where suppression of electromagnetic/radio frequency interference is critical
Device provides an extra voltage regulator
(October 2007)
XC6415 devices are ideal for portable applications where space is at a premium such as mobile phones, portable games, cameras, portable AV equipment and PDAs
SBCs handle high voltages
(October 2007)
The Smartis high-voltage BCD-on-SOI technology and the SO8 power package allow the devices to operate at supply voltages of up to 40V
Filters double testing speed
(October 2007)
BrightLine FISH filters perform faster analysis more conveniently, ensure more accurate diagnoses and give the user more reliable and repeatable measurements
Hybrid patch cords prepare for future standards
(October 2007)
10Gbit/s capable cords feature a standards-recognised TERA interface on one end and a newly redesigned version of Siemon's RJ45-style MC plug on the other
Connector system retains Mini Card
(September 2007)
To hold the entire module securely, the connector and latch are positioned at either end of the card and operate together to enable module ejection
Filter array reduces noise on high-speed lines
(September 2007)
The TCM2010H is the industry's first array product to incorporate two filter elements into a single chip
Optical switch expands testing options
(August 2007)
The AQ2200-641 expands the flexibility of the AQ200 series multi-application test system and reduces the total measurement time for both active and passive multiport component tests
Universal contactor packs more punch
(August 2007)
Fully sealed 225A single-pole/single-throw normally open universal contactor can power switch both DC and AC up to 750V
EMC conference is major attraction
(July 2007)
EMCUK 2007 will feature an international two-day five-session conference for design engineers who are required to meet high frequency EMC compliance requirements
LIN devices claim new EMI benchmarks
(July 2007)
LIN system basis chips integrate transceivers with system protection measures to save space in automotive applications
Active cables solve HDMI performance limitations
(July 2007)
High-performance HDMI cable assemblies incorporate RedMere's RM1689 active equaliser cable booster
Backshells banish EMI problems
(July 2007)
Miniature metal connectors add sealed backshells and braided cable shielding to reduce crosstalk and EMI problems in high-density electronic assemblies
Cable analyser adds extended fibre coverage
(June 2007)
Full-featured optical time domain reflectometer module snaps onto any DTX CableAnalyzer
Signal generators test MIMO in one
(June 2007)
New options add MIMO test capabilities to the SMU200A and AMU200A signal generators
Shrinking pixels enable higher resolution cameras
(May 2007)
Third-generation pixel design is among the smallest currently available and will deliver sensors with higher resolution, enhanced performance and improved image quality
Multiport enhancements for signal-integrity tester
(May 2007)
PLTS version 4.0 simplifies multiple-aggressor differential crosstalk measurements in high-speed backplanes, allows easy importation of 12-port S-parameter data and pinpoints the location of problems
copper cables for 10Gbit/s Ethernet
(May 2007)
Two reliable, easy-to-install and standard compliant Class E cabling systems based on copper technology enable 10Gbit/s connectivity
Chip layout tool adds 3D RC extraction
(April 2007)
Tool reduces design errors and shortens the design verification process, particularly for deep submicron technologies where interconnect delays start to play a dominant role
FPGAs work with high-speed ADCs
(April 2007)
FPGA reference design deserialises data streams from TI's ADS6000 ADC family
Nanno-WiN and Nanno-CaL link to Windows
(April 2007)
Ssoftware products, Nanno-WiN and Nanno-CaL, now interface to the Windows-based design environment from MyCAD as well as run on workstations running Unix or Sun OS
Microwave components are shielded onboard
(March 2007)
Combination of microwave absorber with board level shield absorbs or suppresses high frequency interference, enabling the board to be more effective at high frequencies
DRAMs packaged in DDR2 modules
(March 2007)
DRAM modules have best-of-breed electrical characteristics and an advanced thermal design, using more efficient materials and innovative technologies to keep up with speed demands
LINbus transceiver keeps automotive signals clean
(March 2007)
Stand-alone LINbus transceiver IC claims new benchmark in EMI performance for reduced RF interference
FET switches have inherently low video leakage
(March 2007)
Low video leakage, high isolation and an industry-leading settling time make solid-state switches especially well suited for semiconductor manufacturing system test and R and D
Controller enables full range 10Gbit/s Ethernet
(February 2007)
Demonstration in demanding alien crosstalk environment shows the robustness of 10 Gigabit Ethernet to 100m on unshielded twisted pair cabling
Standards-compliant PHY aids 10Gbit/s testing
(January 2007)
Ixia, a leading, global provider of IP performance test systems, is using the Solarflare 10Xpress PHY products for a 10 Gigabit Ethernet test module
Audio codec takes dual-mode amp onboard
(January 2007)
Audio codec features a dual mode, 1W speaker driver with the flexibility to switch between Class AB and Class D operation
Sonet transceivers promise best-in-class jitter
(January 2007)
Exar Corp has launched two 8bit Sonet/SDH OC-12/3 devices for industry standard optical transceiver solutions
Copper cabling passes 10GBase-T parameters
(January 2007)
Siemon's 10G 6A UTP, 10G 6A F/UTP and Category 7/Class F Tera copper cabling systems meet or exceed all 10GBase-T performance parameters dictated by the now ratified IEEE802.3an-2006 standard
Backplane hosts micro-TCA development
(December 2006)
Molex has released a micro-TCA backplane and development chassis to allow developers to build and debug micro-TCA designs before going to production