Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Custom ASIC",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Convertors power up next-generation Intel CPUs from
Murata Power Solutions, which we summarised at the time by saying "The VRM11.X family of DC/DC convertors from C and D Technologies has been introduced to provide power to Intel's next generation processors".
A few weeks before,
we featured the news release Testbench doubles verification productivity from
Synopsys: "Enterasys Networks has selected the Synopsys VCS functional verification solution and its SystemVerilog Native Testbench following an extensive evaluation of available solutions".
In January 2006, we covered the news from LSI Europe
concerning its Zevio
- take a look at Processor architecture majors on 3D graphics
which says: "LSI Logic has developed a novel low-power 3D-capable application processor architecture".
Take a look also at the news release from Celoxica, C-based design and synthesis helps cut gridlock,
as well as Voltage controlled SAW cuts down jitter from Aspen Electronics,
and DSP-based synthesiser is music to the ears from Texas Instruments (April 2001-March 2006).
See also:
Xilinx signs up for nanometre-scale FPGAs
(October 2004)
Toshiba is to manufacture Xilinx high-performance field programmable gate array (FPGA) products under a new strategic foundry relationship
Geometry shrink pays dividends for FPGA users
(October 2003)
Xilinx reckons its investment in the industry's most advanced 90nm and 300mm chip-making technology is already paying off for customers
Faster control for I2C bus systems
(June 2003)
Available now is the world's first parallel to serial interface I2C bus controller to operate at 400kHz and at low voltages of 3.3 to 2.5V
New generation PHY enables Serial ATA II solution
(May 2003)
The 88SA8050 bridge chip is the industry's first 3Gbit/s Serial ATA II solution enabling the highest throughput SATA storage systems available
Chipset provides complete 3G basestation baseband
(February 2003)
A new programmable chipset enables cellular infrastructure manufacturers to create low-cost, differentiated channel cards for 3G basestations without the burden of developing their own custom ASICs
Tiny module combines MCU with SDRAM and Flash
(December 2002)
A novel family of system-in-package modules uses a three-layer stack structure to combine a high-performance microprocessor with multiple memory chips in a single package
Cadence and IBM ally to simplify chip design
(October 2002)
Cadence Design Systems and IBM have concluded a series of agreements intended to simplify the chip design process for their customers, while helping them tap the latest in chip technologies
Top-end network search engines aid infrastructure
(May 2002)
New from Cypress Semiconductor, the Ayama family of network search engines (NSEs) is optimised for multiprotocol packet classification and forwarding
High efficiency from low-profile quarter brick
(July 2001)
Lambda's latest DC/DC power module is claimed to offer the highest efficiency and lowest height of any quarter-brick unit on the market