Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Electroforming",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Deposition masks suit vacuum applications from
Tecan, which we summarised at the time by saying "Tecan's electroforming process produces tightly toleranced display masks with burr-free aperture edges and controllable draft angles to ensure optimum print definition".
Several months prior to that,
we featured the news release Stencils claim exceptional paste volume control from
Cookson Electronics: "Alphaform electroformed stencils are designed for ultra-fine-pitch tolerances in surface mount and microelectronics applications, and for high volume assemblers".
In July 2005, we covered the news from Precision Micro
- take a look at Alliance focuses nanotechnology resources
which says: "Precision Micro and the University of Birmingham have begun technical and commercial collaboration in the field of micro- and nanoscale structures and components".
Take a look also at the news release from DEK, Stork brings expertise in electroformed stencils,
as well as Vacuum deposition masks lead display advances from Tecan,
and Wafer producers see potential of microreplication from Tecan.
See also:
Interactive website ousts printed matter
(April 2003)
A wealth of data is now available from Tecan's new interactive website, in the form of quick and easy to download PDF files
Evaporation masks last longer
(January 2003)
Tecan has new surface plating options for its high-performance evaporation masks, delivering significant increases in operational life by virtually eradicating damage from current cleaning processes
Storage system keeps stencils in top condition
(December 2002)
A range of modular line-side storage systems offers space savings of 90% compared with traditional meshed or fixed-frame stencils to provide a clean and controlled holding environment
Multilevel solder stencils aid pin-in-hole reflow
(October 2002)
As the PCB manufacturing industry increasingly adopts the beneficial concept of pin-in-hole reflow, Tecan continues to boost its share of this developing new market
Royal assent for microstructure manufacturing
(October 2002)
His Royal Highness, The Prince of Wales, has performed the opening ceremony for a prestigious new GBP 2 million purpose-built microstructure manufacturing facility at Tecan's Weymouth
Evaporation masks minimise process costs
(July 2002)
Tecan has developed high-performance evaporation masks, for use across a wide range of selective vacuum chamber processes, such as the deposition of gold and silver on various substrates
High-spec leadframes from a single supplier
(April 2002)
High-tolerance manufacturing technology lies behind the production of exceptionally cost-effective semiconductor leadframes
Photo-electroforming provides precise components
(January 2002)
Micro-engineered electroformed metal parts are gaining rapid ground, where traditional machined components cannot compete
Wafer-bumping stencils deposit paste accurately
(November 2001)
New-generation wafer-bumping stencils from Tecan Stencils Limited (TSL), are high-tolerance production aids which ensure optimum solder paste release characteristics
Accuracy is key for shadow masks
(September 2001)
High-performance nickel shadow masks, developed by Tecan Components are subjected to computerised co-ordinate measuring as part of the company's rigorous statistical process control (SPC) system
Seminars promote advantages of pin-in-hole reflow
(August 2001)
Tecan Stencils (TSL) is to host a series of autumn seminars highlighting the advantages of pin-in-hole reflow (PIHR)
High-accuracy encoders produced to order
(July 2001)
Tecan Components claims to manufacture encoder disks to unprecedented levels of accuracy, at the same cost or less than standard parts
Electroformed leadframes are more economical
(May 2001)
Tecan Components has developed new manufacturing techniques for the production of semiconductor leadframes, offering significantly higher specifications than traditional techniques
Enhanced squeegee technology aids solder printing
(April 2001)
Tecan Stencils Limited (TSL) offers SMT board assemblers the most consistent performance possible from existing printing machines, using enhanced squeegee technology
Tighter tolerances for nickel evaporation masks
(February 2001)
Tecan has developed a range of high-performance nickel evaporation masks, for use in a range of selective vacuum chamber deposition processes, such as gold and silver plating on silicon
Prototype micro metal parts in five days
(January 2001)
A five-day prototype service has been launched by Tecan, offering design engineers cost-effective small sheet metal parts for a vast array of applications