Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "electromigration",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Multicore design optimises ARM performance from
Cadence Design Systems, which we summarised at the time by saying "Design success prompts NEC to standardise on the Encounter platform as its tapeout methodology of choice for ARM processor implementations".
A few weeks before,
we featured the news release EM simulator spreads coverage from
Ansoft Europe: "Electromagnetic field simulator gains finite-element-based DC solver optimised for extraction of power rail geometry in complex low-voltage/high-current PCB and package designs".
In May 2007, we covered the news from Intersil
concerning its 5962-0625501QHC etc
- take a look at Op amps meet military specifications
which says: "SMD op amps deliver high reliability and superior bandwidth performance for military avionics, navigations, weapons and control systems".
Take a look also at the news release from Apache Design Solutions, Analysis software supports UMC 90nm process,
as well as System shows timing, signal integrity and power from Cadence Design Systems,
and UMC adopts thermal verification from Gradient Design Automation.
See also:
Analysis software finds hotspots inside IC designs
(May 2006)
CircuitFire is billed as the first software product to provide detailed 3D temperature analysis integrated directly into the integrated circuit design flow
Integrated flow speeds WiMAX chip to signoff
(May 2006)
Beceem Communications has achieved first-pass silicon success on a multi-million-gate low-power mobile WiMAX design in record time using Magma's RTL-to-GDSII flow
Wave solder flux is environmentally friendly
(April 2006)
Alpha EF-6100 low-solids wave solder flux is the latest addition to the EF Series of environmentally friendly fluxes
Integrated design flow enhances design services
(November 2005)
eInfochips has strengthened its IC design and verification capabilities by adopting Blast Create, Blast Fusion, Blast Power, Blast Rail and Blast Noise software
Reference flow speeds Chinese IC design
(July 2005)
Synopsys has jointly developed reference design flow 2.0 with Semiconductor Manufacturing International Corp, the largest foundry in China
Front-end tools are successfully installed
(July 2005)
IMEC has successfully completed the installation of its front-end-of-line tools by processing the first pathfinder lots
Conference papers divulge Pb-free advances
(June 2005)
IMEC reported advances in identification of lead-free (Pb-free) solder materials in four papers at the recent 2005 IMAPS European Microelectronics and Packaging Conference (EMPC)
Gradient stresses thermal integrity
(June 2005)
Gradient Design Automation has revealed its strategy to deliver thermal integrity to integrated circuit designs for portable devices, high-end graphics processors, automotive electronics and memories
Software provides full-chip temperature map in 3D
(June 2005)
Gradient Design Automation reckons it has launched the first product in electronic design automation (EDA) history that brings temperature awareness to existing design flows for integrated circuits
Flexible flux keeps it clean
(March 2005)
A new no-clean resin-free halide-free sustained activity flux provides maximum process window, boasts good through-hole penetration and reduces costs
Pb-free paste keeps it clean
(February 2005)
Multicore WS300 is a high-activity water-washable lead-free solder paste with superior cleaning characteristics and suitable for fine-pitch high-speed printing applications
CD explains semiconductor reliability testing
(January 2005)
Keithley Instruments has released an interactive, tutorial CD on reliability testing for semiconductor test engineers
Lead-free paste is cool choice for Motorola
(October 2004)
After undergoing intense evaluation and technical analysis Multicore LF320 lead-free solder paste has been qualified for use by Motorola
New engines improve nanometre parasitic extraction
(September 2004)
New resistance and capacitance engines for Calibre xRC enable the industry's most accurate simulation of nanometre technology
Software addresses core power issues
(June 2004)
Galaxy Power is billed as offering the industry's first comprehensive low-power solution for today's most advanced, high-performance 90nm designs
Characterisation package goes further
(December 2003)
New from Keithley Instruments is the Model 4200-SCS semiconductor characterisation system with its integral Keithley Test Environment-Interactive (KTEI) v5.0 software
ARM design software takes signal integrity onboard
(September 2003)
The ARM-Synopsys Reference Methodology, first introduced in 2001, now supports Galaxy SI, a comprehensive signal integrity (SI) solution within the Galaxy Design Platform
Design platform maintains nanometre-scale accuracy
(September 2003)
The Virtuoso custom design platform is claimed to be the world's first comprehensive platform for fast, silicon-accurate custom, analogue, RF and mixed-signal design
Tools form basis of TSMC Reference Flow
(June 2003)
The Galaxy Design Platform and other Synopsys tools have been integrated into TSMC's advanced Reference Flow 4.0
Design platform takes on signal integrity tool
(June 2003)
Galaxy SI is a new and complete signal integrity solution within the Galaxy Design Platform that addresses crosstalk delay, noise (glitch), IR (voltage) drop and electromigration
Hybrid power analyser speeds digital TV IC signoff
(June 2003)
LG has selected Acad's FinePower IR drop and electromigration analysis tool for the design and verification of a complex full chip used in its latest digital TV
Hands-on tutorials feature again at DAC
(March 2003)
The Design Automation Conference has revealed the lineup for this year's hands-on tutorials, a key element of the conference's diverse programme
Cadence completes Simplex acquisition
(July 2002)
Cadence Design Systems has completed its acquisition of Simplex Solutions, following its agreement of 24th April 2002
Synplicity set to acquire Iota's power technology
(June 2002)
Synplicity is set to acquire key products and core signal integrity and power analysis technology that will be used in the development of advanced synthesis tools for next-generation ASICs and SoCs
Physical software addresses sub-0.13-micron issues
(May 2002)
Monterey Design Systems has released version 2.1 of its flagship Dolphin physical implementation system to support advanced process technologies of 0.13-micron and beyond
Cadence to acquire Simplex Solutions
(April 2002)
Cadence Design Systems has signed a definitive merger agreement to acquire Simplex Solutions
Newsletter looks at reliability
(February 2002)
The latest edition of Reliability Analysis News, a newsletter for design engineers, testing laboratories, and manufacturing organisations, is now available
Sign-off solution sorts submicron bugs
(June 2001)
Avant! Corp claims that Star-Rail is the industry's first ultra deep submicron (UDSM) sign-off solution for IR drop and electromigration analysis of power distribution networks