Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Embedded DRAM",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release CMOS ASIC process creates DVB-H IC from
Toshiba Electronics Europe, which we summarised at the time by saying "The Enter E1 SoC IC is a fundamental element of Sidsa's mobile TV reference designs".
A few weeks before,
we featured the news release Embedded DRAM process enables Xbox graphics from
TSMC: "Microsoft has started production of the Microsoft Xbox 360 graphics-memory subsystem using the TSMC 90nm embedded DRAM process".
In June 2007, we covered the news from Toshiba Electronics Europe
concerning its Capricorn-A
- take a look at SoC simplifies automotive display design
which says: "RISC-based system-on-chip processor for automotive displays boasts the industry's highest system level of integration to date".
Take a look also at the news release from Innovative Silicon, Disruptive influences are isolated at ESC,
as well as New 65nm process for embedded DRAMs from TSMC,
and Controller provides image quality enhancement from Toshiba Electronics Europe.
See also:
TSMC signs up for 1T-SRAM technology
(February 2007)
MoSys has licensed Taiwan Semiconductor Manufacturing Company to develop and market memory macro products using its patented 1T-SRAM high-density embedded memory intellectual property
SoC designers invited to meet at DAC
(July 2006)
Innovative Silicon is organising meetings during DAC with SoC and microprocessor designers interested in reducing costs and improving the performance of their embedded memory implementations
Memory patent roll enters double digits
(June 2006)
Innovative Silicon has been awarded its tenth patent on advanced memory technology
65nm low power process is ready to roll
(May 2006)
Earlier this week, Taiwan Semiconductor Manufacturing Company today told a packed audience at its 2006 Technology Symposium that the company has fully qualified its 65nm low power process technology
Advisory board lines up technology expertise
(May 2006)
Innovative Silicon has recruited five semiconductor memory and silicon on insulator luminaries to participate in the company's newly formed Technology Advisory Board
Relationship extends to IP advantage
(April 2006)
ARM and Taiwan Semiconductor Manufacturing Company have agreed to extend the companies' long-term relationship for development of a new suite of ARM Advantage products
65nm process comes on stream two months early
(April 2006)
Qualcomm has begun sampling state-of-the-art wireless devices manufactured on TSMC's 65nm process technology
Lewis takes embedded memory to market
(January 2006)
Jeff Lewis has joined Innovative Silicon as VP of Marketing
Embedded memory works on 90nm SoI process
(January 2006)
Innovative Silicon has achieved silicon validation of Z-RAM memory arrays on 90nm SoI process technologies
Paper claims long future for novel memories
(December 2005)
A paper given at the IEEE SOI Conference shows the manufacturability of Z-RAM capacitor embedded memory technology in FinFET and TriGate devices with geometries below 45nm
Twin-transistor RAM has no capacitors
(September 2005)
A novel high density capacitorless twin-transistor RAM (TTRAM) achieves both high speed operation and low power consumption
Soft error immunity improved in CAM devices
(September 2005)
Renesas Technology Corp has introduced technology that improves soft error immunity in content addressable memory (CAM) devices used in networking and communication equipment, and similar products
Embedded memory exploits SoI floating body effect
(September 2005)
Z-RAM embedded memory technology for SoCs can double memory density when compared with existing embedded DRAM solutions
Financing boosts sales and marketing capabilities
(September 2005)
Austin Ventures has led a $16 million Series B round of financing targeted at expanding Innovative Silicon's sales and marketing capabilities for its ultra-high-density memory technology
Estimation tool helps control chip design costs
(February 2005)
A new website provides designers with free access to a chip estimation tool that helps control the cost of ICs early in the design cycle at the design creation and specification stage
Big camera names using MIPS-based technology
(March 2004)
When you choose your next digital still or video camera, chances are that it relies on the industry-standard MIPS architecture
300mm wafer fab on course for Q3 startup
(February 2004)
Toshiba has completed construction of the building for a new 300mm wafer-fabrication facility at Oita Operations in Kyushu, Japan
Holzapfel takes charge of new organisation
(November 2003)
CoWare has appointed Dr Heinz P Holzapfel as Vice President of its new Application Services and IP Integration organisation, reporting to Peter Richards, VP of Worldwide Field Operations
Chips bring higher picture quality to LCD TV
(July 2003)
A new generation of high-end motion compensation/estimation semiconductor solutions improves the picture quality of matrix displays (LCD or plasma), 100Hz and progressive scan television sets
CMOS ASIC process shrinks down to 90nm
(April 2003)
Toshiba Electronics Europe is now offering 90nm TC300 ASIC technology based on the Toshiba Corporation CMOS4complementary metal oxide semiconductor process
Big two shrink CMOS process to 65nm
(December 2002)
Toshiba and Sony have codeveloped the world's first 65nm CMOS process technology for embedded DRAM system LSIs
GameCube sparks 1T-SRAM demand
(October 2002)
NEC has shipped more than 25 million 96Mbit high-density 1T-SRAMs in just one year since the launch of the Nintendo GameCube which uses these high-performance custom chips as its main system memory
Big three collaborate on 90nm and beyond
(March 2002)
Philips, STMicroelectronics and TSMC have reached agreement on a new advanced 90nm (0.09-micron) CMOS process
Second-generation 1T-SRAM saves even more power
(November 2001)
MoSys and Taiwan Semiconductor Manufacturing Company (TSMC) have successfully implemented MoSys' second-generation 1T-SRAM technology optimised for very low-power mobile applications
Two new VPs at Bops
(August 2001)
Programmable DSP core producer Bops has named Steven E Schulz as vice president, corporate marketing, and Ivan Greenberg, vice president, platform marketing, effective immediately
Atmos closes $10 million investment round
(July 2001)
Atmos Corp has completed a $10 million round of financing
NEC and ATMOS to make DRAM for communications
(June 2001)
NEC Electronics and ATMOS Corp are to develop and offer high-performance embedded DRAM aimed at communications and wireless industries
Low power bonus for single-chip DAB baseband LSI
(June 2001)
Matsushita Electric Industrial Co has developed an advanced single-chip baseband signal processing LSI for digital audio broadcasting (DAB) that is fully compliant with ETS300401
DRAM proves to be logical in SoC designs
(March 2001)
Atmos has announced immediate availability of its system-on-a-chip (SoC) pure logic IP core, SoC-RAM PL