‘Handset Market’
An Electronicstalk guide
Start with the news release
Trigon announces low-profile power inductor from
Trigon Components, which we summarised at the time by saying "Trigon has introduced its IRHL2D10P (3x3x1mm) low-profile power inductor. ".
Several months prior to that,
we featured the news release Asix controller provides Ethernet connectivity from
Asix Electronics: "Asix Electronics has released the AX88796C, an SPI or non-PCI Ethernet controller with low-power, low pin count and variable voltage I/O for Embedded and Industrial Ethernet applications. ".
In March 2010, we covered the news from Maxwell Technologies
- take a look at Maxwell Technologies - latest company news
which says: "9 March 2010 - Kevin Royal, chief financial officer of Maxwell Technologies will present to the Roth Capital Partners Growth Stock Conference.".
Take a look also at the news release from Baolab Microsystems, Baolab NanoEMS constructs MEMS within CMOS wafer,
as well as Tyco offers jumper assembly for LED lights from Tyco Electronics,
and Numonyx serial flash range targets embedded market from Numonyx.
Latest stories...
Maxwell ultracapacitor modules for transit bus (March 2010)
Voith Turbo has selected Maxwell's 125V Boostcap ultracapacitor modules for braking energy recuperation and torque assist in low-emission, fuel-efficient, hybrid-electric transit-bus drive systems.
Sysgo software offers multi-core implementation (March 2010)
Sysgo has released version 3.1 of its flagship product, PikeOS, which is said to offer the first multi-core implementation on the market that is part of a DO-178B-certified code basis.
Sysco develops software for infusion system (March 2010)
Sysgo was selected by B Braun to develop the software application related to Spacecom, one of the key components of the B Braun Space automated infusion system.
Linear seminars to discuss DC/DC regulators (February 2010)
Linear Technology has announced a series of free half-day seminars on the use of its range of high-performance DC/DC uModule regulators.
COM-45GS module reduces development time (February 2010)
Aaeon has launched the COM-45GS, a Type II COM Express Module based on the mobile Intel GS45 chipset.
MSC platform features digital visual interface (February 2010)
The target platform MSC Q7-MB-EP2 from MSC Vertriebs supports the development of POI/POS and digital signage applications based on a compact, power-saving MSC Qseven module.
IC Nexus launches HDVK10 handheld development kit (February 2010)
IC Nexus has announced the NXC2620 HDVK10 handheld development kit.
Soitec produces silicon-on-insulator substrates (February 2010)
Soitec has announced volume production of its new generation of high-resistivity (HR) silicon-on-insulator (SOI) substrates to serve the mobile phone and wifi markets.
Further reading
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Smartphones to lead handset market
Report predicts that the smartphone segment will be the fastest growing part of the mobile handset market in 2006, showing a year-on-year volume increase of over 40%.
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Chip makers drive ultra-low-cost handset market
Rapid product development from leading semiconductor players will enable 48 million ultra-low-cost handset shipments by the end of 2007.
