Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Heatsinks",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release SFP interconnect accelerates to 10Gbit/s from
Tyco Electronics - Comns Computer Consumer Elctrns, which we summarised at the time by saying "System meets the performance requirements of the SFF-8431 specification and supports 8G Fibre Channel and 10G Ethernet applications".
A few weeks before,
we featured the news release Novel LDO design keeps its cool from
Linear Technology Corp: "Current reference allows sharing between multiple regulators with a small length of PC trace as ballast, enabling multi-amp linear regulation in all surface-mount systems without heatsinks".
In November 2007, we covered the news from OLC
concerning its ACM1B, ACM2B and ACM3B
- take a look at Low-profile modules get active on cooling
which says: "Compact active cooling modules combine crossflow fans with special airfoil-fin heatsinks".
Take a look also at the news release from FDK Corp, Eighth-brick convertors power through the heat,
as well as Pressure film boosts capacitor reliability from Sensor Products,
and Heatsinks upgrade fan performance from OLC.
See also:
Mezzanine card provides faster denser storage
(September 2007)
Flash memory PMC is designed for high-speed read, write and erase performance, with up to 64Gbyte of NAND Flash and sustained datarates of over 130Mbyte/s
New name in microwave components
(August 2007)
Thales-MESL has been bought out from Thales Holdings and will now be known as MESL Microwave
Thermal interface includes fibre for strength
(August 2007)
High-tensile-strength thermal interface material improves heat transfer between components and heatsinks, and provides durability for installation and long-term use
Solid-state storage expands to 256Gbyte
(August 2007)
VMEbus board uses NAND Flash memory supported by software drivers to provide full hard-disk emulation for cost-effective, solid-state mass storage in COTS applications
Three-channel driver optimises LED performance
(August 2007)
Intelligent and power efficient LED drivers offer a significant advantage to solid-state lighting manufacturers that are serious about reducing the carbon footprint of their ranges
Interconnect boosts fibre port density
(July 2007)
Quad Small Form-factor Pluggable interconnect system offers three-times the density of traditional SFP ports and supports speeds up to 10Gbit/s per channel
Convertor is cooler choice for LED driving
(July 2007)
Buck convertor offers a simpler and smaller alternative to linear regulators for driving high-brightness LEDs in step-down applications, eliminating the need for heatsinks
Half bricks offer three high-current outputs
(July 2007)
DC/DC convertors provide three fully independent and precisely regulated output voltages in a single compact package
High-voltage bricks cut losses to keep cool
(July 2007)
High voltage input full brick DC/DC convertors provide 200W power or 40A current with industry standard compatible pin assignment
Cooling technology addresses shrinking electronics
(July 2007)
The increased power densities of modern electronic products demand new approaches to thermal management: Michael Dreyer looks at advances in thermal interface materials
Backplanes host legacy support
(July 2007)
Backplanes support SHB Express system host boards as well as a variety of PCI Express, PCI-X and PCI option cards
Convertors are ideal for IBA and DPA
(June 2007)
Agreement makes Mouser the sole North American distributor for FDK DC/DC convertors
Aluminium electrolytics can be specified online
(April 2007)
Screw-terminal aluminium electrolytic capacitors offer long life and better than 50A ripple capability for bus capacitor or DC-link capacitor applications
Power products and heatsinks come together
(March 2007)
Catalogue includes information on a range of embedded copper pipe heatsinks that can be custom drilled for isolated IGBT, MOSFET or thyristor/diode modules
SAS controllers enable advanced storage systems
(February 2007)
The first product in Marvell's SAS controller portfolio is the Marvell 88SA6640 host controller, supporting four SAS/SATA ports
QSFP interface meets need for speed
(February 2007)
Quad small form-factor pluggable product offering is compatible with the QSFP multisource agreement and combines optimal real estate, power and port density
Resistors come with novel heatsinks
(January 2007)
A new method of heatsinking solves the problem of overtorque when installing conventional TO-220 resistors and creates optimal thermal transfer between the resistor and the heatsink
Seifert heatsinks available from MEC International
(December 2006)
MEC International is pleased to announce that it can now offer to the UK market the full range of Seifert heatsinks from Germany
Thyristor modules are made for soft starters
(November 2006)
Semikron has introduced the Semistart family of antiparallel uninsulated thyristor modules, which has been designed specifically for use in soft-start devices
Light engines smooth the switch to LEDs
(November 2006)
New power LED light engines from CML-Innovative Technologies (CML-IT) make moving to LED technology simple
Thermal pads expand design options
(November 2006)
Expanded range of products from Universal Science updates the choice of thermal pads and accessories available to the design engineer of today
System-on-module comes quickly to life
(November 2006)
The ARM9-based TS-7400 system-on-module can boot Linux in 1.1 seconds
Silicone sponge closes the gap on heatsinks
(October 2006)
Thermally conductive silicone sponge helps remove heat generated by electronic devices
Low-profile heatsinks cool tightly spaced boards
(October 2006)
When compared with other heatsinks of equivalent size, low-height forged heatsinks have better thermal performance
Adhesives range answers electronics demands
(October 2006)
Specialist coatings, adhesives, encapsulants, potting, sealing and masking products are made for microelectronic and optoelectronic manufacture, rework and repair
Franchise adds foils to thermal management options
(October 2006)
Rutronik has signed a pan-European franchise with Balkhausen, the leading manufacturer of thermal management products
EMC simulation cuts the cost of board respins
(October 2006)
Suppliers of IT infrastructure equipment address EMC during the early design phase using Flo/EMC electromagnetic simulation software
Distribution deal covers powerful range
(October 2006)
Power Products International has been appointed the official UK distributor for International Rectifier High Power Group
Greases enhance thermal reliability
(September 2006)
T-grease high performance thermal greases help cool thermally stressed components in the most demanding electronics applications
Switches speed to route QXGA video signals
(September 2006)
Crosspoint switches operate above 500MHz, providing professional video designers with high levels of integration and bandwidth
Mezzanine card packs a big Flash memory
(June 2006)
A high density PMC provides up to 64Gbyte of NAND Flash memory in two banks
Coated thermal plates aid safety-conscious cooling
(June 2006)
The IsoEdge range of heatsink products can improve component packaging densities, reduce parts counts and cut the assembly costs of a wide range of electronic products
Power convertor turns DSP to motor control
(June 2006)
DSP-based TMS320C2000 controllers are the key component in a motor control system for washing machines and other white goods developed by Tier Electronics
Convertors need no heatsinks
(May 2006)
A fixed output DC/DC convertor with a wide input voltage range provides design engineers with a robust 2W device suitable for high temperature environments