Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "JEDEC",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release I/O modules check out memory interfaces from
Goepel Electronic, which we summarised at the time by saying "Low-cost digital module enables the testing of all signal and voltage supply pins of JEDEC-compliant DDR2 Mini DIMM 244 sockets".
Earlier in the week,
we featured the news release Board sets the standard for DDR3 testing from
Inphi Corp: "Clock reference board enables memory module and system designers to validate DDR3 RDIMMs and simulate system-level functionality effectively and efficiently".
In January 2008, we covered the news from Avago Technologies
concerning its ACPL-M43U, M46U and M61U
- take a look at Digital optocouplers have industrial specs
which says: "Wide temperature optocouplers are extremely reliable and ideal for use in applications that operate in harsh industrial environments".
Take a look also at the news release from Ericsson Power Modules, DC/DC convertors move to the surface,
as well as FPGAs race to DDR3 interface speeds from Altera Europe,
and Thyristors provide fast bidirectional protection from Raychem Circuit Protection.
See also:
Integrated register controls propagation delay
(October 2007)
The INSSTE32882-GS02 exhibits the lowest jitter and most tightly controlled propagation delay in the industry, giving module manufacturers a high manufacturing margin for memory module production
MIMO WiMAX chip drives femtocell designs
(September 2007)
Integrated reference design combines Sequans' new SQN2130 basestation ASIC with PMC-Sierra's new PM8800 WiZIRD 2Tx/2Rx RF IC
Third-generation modules save embedded space
(September 2007)
Memory modules are designed for space constrained next-generation AdvancedTCA, AdvancedMC, MicroTCA, PicoTCA, PC104, SBB canisters and PICMG SBCs
WiMAX chips take MIMO onboard
(September 2007)
Highly integrated WiMAX RF IC features full twin-transmitter/twin-receiver multiple-in/multiple-out capability
Temperature sensors protect PCs
(September 2007)
The STTS424 is a stand-alone digital temperature sensor, while the STTS424E02 integrates the temperature sensor with a 2Kbit serial presence detect (SPD) EEPROM
Test application improves reliability
(August 2007)
The Agilent U7231A DDR3 application automatically configures the oscilloscope for each test and generates an HTML report at the end of the test
Encapsulants suit lead-free soldering
(August 2007)
ME-532 flip chip underfill is specifically formulated to achieve high reliability for in-package or chip-on-board applications where fast flow under large chips is required
Companies collaborate on high-end memory
(August 2007)
The GDDR5 memory devices from Qimonda are designed to meet the high-performance requirements from graphic applications on game consoles, desktop PCs and notebooks
Preconditioning for component Pb conversion
(August 2007)
Joel Deutsch and Michael Baker explain how proper preconditioning allows older ICs and semiconductor devices to be converted to become RoHS compliant
Asynchronous SRAMs support legacy systems
(August 2007)
In addition to 1.8, 2.5 and 3.3V SRAMs, Integrated Silicon Solution now has a wide variety of 5V SRAMs from 256Kbit to 4Mbit
Warm white option for high-power LEDs
(August 2007)
Warm-white light emitting diode provides a competitively robust and reliable package that provides high brightness illumination and easy installation
Boundary scan module meets DIMM interface
(July 2007)
Low-cost digital I/O module enables the testing of all signal and voltage supply pins of JEDEC compliant DIMM168 plug connectors
FPGAs speed DDR3 memory adoption
(July 2007)
Stratix III FPGAs support DDR3 with a maximum clock speed of 400MHz and maximum datarate of 800Mbit/s
Surface-mount LEDs pack more brightness
(May 2007)
High-brightness LEDs are the first devices rated at 0.5W in industry-standard PLCC-4 surface-mount packages
Buffer cuts FB-DIMM power budgets
(May 2007)
Third generation memory buffer family offers the lowest power consumption available in the industry today - up to 40% power savings over competing AMB offerings
Call for clarity in lead-free part numbering
(May 2007)
iNEMI members support move to create unique part numbers for BGA components to differentiate any Pb-free ball metallurgies other than SAC 305 or SAC 405
Memory modules put more on server blades
(April 2007)
Memory modules are designed with significant enhancements to the JEDEC standard, including registered functionality, reduced module height, advanced cooling features and densities up to 4Gbyte
Mini-RDIMMs stack up memory advantages
(April 2007)
Viking InterWorks is supporting the highest density 244-pin Mini-RDIMMs in the industry with its latest offering, a 4Gbyte module
Register and PLL accelerate DDR3 modules
(April 2007)
Integrated register and phase-locked loop for DDR3 registered dual inline memory modules is hailed as the industry's fastest yet
Sensors set for launch in Nuremberg
(April 2007)
During Sensor + Test 2007 Melexis will release several new products for both medical and industrial applications
System places components accurately
(April 2007)
Assembleon's AX-201 places 01005 components, fine-pitch devices and odd-form components up to 130 x 79mm with machine vision and laser alignment ensuring accurate board and component positioning
Low-profile memory modules go up to 4Gbyte
(April 2007)
Very-low and ultra-low profile memory modules offer DIMM heights of 0.7in, (1.78cm), compared with the JEDEC standard of 0.72in (1.83cm) and operate over the extended industrial temperature range
Configurable register enables DDR3-1600 memory
(March 2007)
A JEDEC-compliant Double Data Rate (DDR3) Configurable Integrated Register device will work with server memory operating at DDR3-1600 rates
Single chip DVB-H for small devices
(February 2007)
Frontier Silicon has announced a single-chip IC (integrated circuit) for DVB-H broadcast mobile digital TV (MDTV), enabling longer battery life, smaller handset form factors and faster time-to-market
Expo provides sneak preview of 2007 roadmap
(January 2007)
iNEMI will preview highlights of its 2007 roadmap at the upcoming IPC Printed Circuits Expo, APEX and Designers Summit in Los Angeles, California
Oscilloscope-based DDR2 compliance test
(December 2006)
Agilent Technologies has introduced what it believes to be the industry's first oscilloscope-based DDR2 compliance test application
16 Mbit low voltage, low density flash
(December 2006)
SST (Silicon Storage Technology), has rolled out its 1.8V low-density flash product portfolio with the announcement of a 16 Mbit Multi-Purpose Flash Plus (MPF+) device
Automotive linear regulator has adjustable reset
(December 2006)
MAX5091 low-quiescent-current, low-dropout (LDO) linear regulator with a wide operating input-voltage range of +5V to +40V and the capability to withstand up to 40V transients
Memory modules boost system speed and capacity
(October 2006)
In stock at Memorysolution are the latest fully buffered DIMM (FB-DIMM) modules made by Qimonda and Nanya
DDR2 modules are made for telecomms boards
(October 2006)
Virtium Technology has broadened its DDR2 and DDR2 ECC registered SO-DIMM product families designed for telecomms equipment manufacturers and evolving telecommunications applications
Connectors support DDR2 modules
(September 2006)
JAE Europe has introduced a series of connectors that enable industrial and embedded PC applications to benefit from the advantages of DDR memories
Infra-red sensor takes signal conditioning onboard
(September 2006)
IR sensor helps OEMs to integrate noncontact temperature measurement in car air conditioning, room heaters, home appliances, handhelds and medical equipment
Short run ASICs add plastic package options
(September 2006)
Mosis has signed a strategic agreement with Sempac that will enable the company to offer customers a low-cost alternative to ceramic packages for VLSI circuits
PoP technology brings Flash to hand
(September 2006)
Spansion is working with Freescale Semiconductor to produce package-on-package Flash memory for handset manufacturers