Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "MCM",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release EDA market grows on all fronts from
EDA Consortium, which we summarised at the time by saying "The electronic design automation industry raised revenues of US $1493 million during Q4 of 2006, a 19% increase over Q4 2005".
A few weeks before,
we featured the news release Multichip module saves room for space memory from
Atmel Corporation: "The AT68166 is a 16Mbit SRAM packaged in a hermetic multichip module (MCM) for space applications".
In November 2006, we covered the news from Fluent
concerning its Icepak version 4.3
- take a look at Cooling design software handles complex geometries
which says: "Version 4.3 of Icepak introduces key new technologies in the thermal design of electronic systems".
Take a look also at the news release from EDA Solutions, MEMS design software supports education,
as well as Capacitors suit low gigahertz applications from Cornell Dubilier Electronics,
and EEPROM suits high reliability applications from Mintech Interconnect and Test.
See also:
Monolithic VGAs claim basestation supremacy
(March 2005)
The MAX2056 and MAX2057 are billed as the industry's highest performing RF variable gain amplifiers in monolithic form
Software offers thermal validation for IC packages
(February 2005)
Icechip is novel package-level thermal validation software for IC package designers
Memory modules aim for ceramic replacement
(May 2004)
Force Technologies has released a comprehensive range of volatile and nonvolatile memory modules aimed at replacing expensive 'J'LCC and HIP packaged ceramic MCM devices
Novel package puts programmed FPGAs in space
(December 2003)
A novel advanced packaging technology is small enough to enable the assembly of tested and programmed FPGAs into multichip modules (MCMs) for space applications
Leading European source for MCM fabrication
(November 2003)
Since its formation in 2000, the German electronic manufacturing service company Aemtec has become a market leader for the manufacture of multichip modules in Europe
Full range of fine-pitch test probes
(October 2003)
A number of new devices have been added to the range of fine-pitch test probes available from Peak Test Services, making it probably the most comprehensive range available in the UK
High-current connectors shrink in size
(September 2003)
The Radsok contact and connector series is now available in smaller package sizes that provide a lower insertion force than larger connectors, while providing increased durability
Ultra-fine-pitch test probe for 0.5mm centres
(September 2003)
The P706 is an ultra-fine-pitch test probe for testing components at centres down to 0.5mm
Micro-contact probes test fine-pitch components
(July 2003)
Peak Test Services has expanded its range of double-ended spring test probes with two new series designed for probing at 0.75mm centres
Interconnects add new dimension to packaging
(July 2003)
HyperStac is a z-axis interconnect module especially suited for high-speed applications in harsh environments
Inverter modules aim for white goods integration
(April 2003)
At PCIM 2003 Allegro MicroSystems Europe will present a new family of miniature high-current motor drive inverter modules aimed at providing energy and power savings in white-goods applications
Semiconductor packages in ceramic and metal
(September 2002)
High-performance and custom-designed packages in ceramic and metal are now available from Atek Technology
Package design tool gains time-saving functions
(July 2002)
Zuken has added two new time-saving enhancements to its Package Predictor advanced packaging solution for designers developing single- or multichip IC packages
Mobile processor takes camera control onboard
(June 2002)
Hitachi has released the second version of its SH-Mobile application processor
Component mounter goes easy on the ceramics
(May 2002)
The FCM Ceramic is the latest addition to the FCM fast component mounter family from Assembl‚on
Virtual prototyping cuts MCM design time
(March 2002)
Zuken's Hot-Stage 4 high-speed virtual prototyping environment is now supported by the company's upgraded PCB and multichip module (MCM) layout tool, Visula 6.0
Multichip die bonder ready for 300mm wafers
(October 2001)
Datacon has released its next generation multichip die bonder
Space-saving MCMs combine MPU, Flash and RAM
(September 2001)
Hitachi has two new series of multi-chip modules (MCMs) that offer a high-performance SuperH microprocessor together with Flash and either SDRAM or SRAM in a single compact package
Tolerance is a blessing for MCM connector
(May 2001)
Suited to high-density requirements, RJ connectors from Hypertac find numerous applications in the interconnection of dual-cavity MCMs, PCBs and daughterboards
News on the PCB/MCM Signal Integrity V3.7 from Ansoft Europe
(March 2001)
Ansoft has announced version 3.7 of its PCB/MCM Signal Integrity (SI) tools
MCM packaging shrinks stepper motor driver
(March 2001)
The TA84002F stepper motor driver from Toshiba Electronics uses an innovative multichip module design to improve thermal performance and reduce board space requirements