Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Mobile device manufacturers",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Driver expands appeal of passive matrix OLEDs from
Dialog Semiconductor, which we summarised at the time by saying "The use of lower power and lower cost passive matrix OLEDs can be extended to higher resolution main displays on mobile devices".
A few weeks before,
we featured the news release Acquisition adds GPS to RF expertise from
Atheros Communications: "The acquisition of u-Nav immediately expands Atheros' growing product portfolio in mobile wireless communications".
In December 2007, we covered the news from NXP Semiconductors
concerning its ISP1704 and ISP1601
- take a look at Charger chips meet USB battery specs
which says: "Devices can detect and differentiate between a dedicated USB charger, USB host charger and USB host when charging a mobile phone battery".
Take a look also at the news release from NXP Semiconductors, Joint venture to focus NFC efforts,
as well as Financing secures Wi-Fi expansion from Nanoradio,
and Alliance to streamline mobile device certification from Bureau Veritas E and E Product Services.
See also:
3GSM showing for 65nm handset devices
(February 2007)
Broadcom is showcasing new 65nm products for mobile handsets and handheld devices at this week's 3GSM World Congress in Barcelona, Spain
BenQ to integrate VoIP in dual-mode handsets
(February 2007)
BenQ has licensed HelloSoft's VoIP technologies for use in dual-mode handsets
Handwriting recognition is embedded at 3GSM
(February 2007)
Vision Objects will take part in 3GSM this year for the first time and will showcase the latest developments in MyScript technology for mobile handsets
Alliance unites contactless smart card standards
(November 2006)
NXP Semiconductors and Sony Corp have signed a memorandum of understanding to establish a joint venture that will drive global adoption of contactless smart card applications in mobile phones
PoP technology brings Flash to hand
(September 2006)
Spansion is working with Freescale Semiconductor to produce package-on-package Flash memory for handset manufacturers
Funding seeds laser-projector development
(August 2006)
Light Blue Optics has closed a US $2.5 million seed funding round
Forum mandates near field comms format
(June 2006)
Innovision Research and Technology has developed a low-cost near field communications platform for consumer electronics and mobile applications
Kit eases handwriting integration
(May 2006)
A software development kit is designed for integration of handwriting recognition capabilities into small footprint platforms such as PDAs, Internet tablets and smartphones
Processor is first with Windows CE 6 support
(May 2006)
Microsoft has selected TI's OMAP2420 applications processor as the first ARM11-based development platform for its Windows CE 6 beta release distributed this week to device makers worldwide
Flash file system features on mobile platform
(April 2006)
Datalight's Flash FX Pro and Reliance products have been selected by Texas Instruments for its OMAPV1030 platform for the mobile device market
Bluetooth and FM coexist in harmonious RF chip
(March 2006)
The BlueLink 6.0 platform combines the industry's best performance Bluetooth wireless technology with high fidelity FM stereo and mono performance on a single chip
OMAP2 architecture powers Docomo 3G handsets
(November 2005)
Texas Instruments' OMAP2420 application processor has been selected for the new NTT Docomo's FOMA 902i series 3G handsets to provide advanced multimedia capabilities
Graphics development focuses on games sector
(October 2005)
The PowerVR Insider development programme aims to promote and endorse excellence at all levels of the mobile graphics ecosystem from silicon providers to games developers
Sensors cut the cost of handset imaging
(September 2005)
New low-cost imaging solutions are designed to directly replace existing quarter-inch VGA image sensors and quarter-inch VGA SoC image sensors in camera-enabled mobile phones
Reference design eases CMOS sensor integration
(September 2005)
Eastman Kodak Company is making it easier for camera phone manufacturers to build next-generation devices that offer improved image quality and multimedia capabilities
Motorola signs for cellular applications platform
(August 2005)
TTPCom is to license its Ajar cellular applications platform to Motorola for the development of select low-cost mass market mobile devices
Cellular platform gains CMOS image sensor support
(July 2005)
Eastman Kodak Company is making it easier for camera phone manufacturers to build next-generation devices that offer improved image quality and multimedia capabilities
Wireless platform takes media processors onboard
(February 2005)
Nvidia's WMP wireless media processors are now available pre-integrated on the TTPCom Ajar applications platform
Core destined for TD-SCDMA chipset
(December 2004)
Chongqing Chongyou Information Technology Co has licensed the ARM926EJ processor
Group focuses on open mobile terminal platforms
(October 2004)
Tao has joined the OMTP group, a mobile industry group focused on open mobile terminal platforms
Single-chip solution brings pen sensing onboard
(September 2004)
A new mixed-signal IC allows the easy integration of Wacom's proven inductive pen sensing technology into mobile devices such as smartphones and personal digital assistants
Collaboration targets global 3G chipset
(July 2004)
Texas Instruments and NTT DoCoMo are to develop a cost-competitive, multimode UMTS (W-CDMA/GSM/GPRS) chipset to serve the Japanese, US and worldwide 3G handset market
Full system solution puts mobile devices in dock
(July 2004)
The new HandyLink connector system aims to reduce design and resource costs for a variety of handheld and mobile device applications
New Bluetooth chips enhance datarates
(June 2004)
CSR has launched a fourth generation of its Bluetooth silicon, designed for enhanced datarate (EDR) Bluetooth, launched this week by the Bluetooth SIG at WiCon World in Amsterdam
Study to look at 3D chip scale packaging
(May 2004)
3D chip scale packaging solutions will play an increasingly vital role in meeting performance and size requirements for future generations of mobile electronics
Hands-free kit design combines Bluetooth with DSP
(April 2004)
Texas Instruments has developed a DSP-based hands-free kit development platform matched with a complete Bluetooth radio subsystem
TTPCom and Intel go to the Edge
(March 2004)
TTPCom has extended its collaboration with Intel Corp to encompass the development of Edge and 3G platforms for mobile devices
Multimedia processor migrates down to 90nm
(December 2003)
The OMAP1710 is the first multimedia applications processor developed using TI's advanced 90nm process technology, offering up to 40% improvement in performance at half the power drain
Bluetooth transceivers optimised for handhelds
(December 2003)
A new Bluetooth product family from National Semiconductor complies with the recently ratified Bluetooth Specification Version 1.2
With the BFR6150 die area gets smaller
(December 2003)
The BRF6150 provides full support for Bluetooth Specification Version 1.2 and is the industry's first Bluetooth solution with direct battery connection and a power shutdown mode
Open environment to cut cost of mobile Java
(November 2003)
Sun Microsystems and TI are working together to deliver optimised end-to-end wireless solutions for 2.5G and 3G networks
Pair to validate new UMTS test system
(August 2003)
BABT is helping Cetecom to validate a new conformance test system for mobile telecommunications devices
Alliance to promote mobile processor standards
(July 2003)
The Mobile Industry Processor Interface (MIPI) Alliance is a new industry initiative that will define and promote open standards for interfaces to mobile application processors
Video processor to gain mobile games support
(July 2003)
Alphamosaic has entered a major joint initiative with Korea's top mobile game and entertainment developer, Zio Interactive