Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Passive component",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Software eases passive component design from
Cadence Design Systems, which we summarised at the time by saying "The Virtuoso Passive Component Designer helps designers automatically generate the optimum inductive device for their specific application and process technology".
A few weeks before,
we featured the news release 3D interconnect structure recognised with patent from
Jacket Micro Devices: "Patent covers new methods for making 3D liquid crystal polymer (LCP) interconnect structures using a high-temperature single-sided LCP and a low-temperature single-sided LCP".
In March 2007, we covered the news from Adept-SiP Consortium
- take a look at Partners investigate system-in-package design
which says: "A new project-based partnership is working to enable the successful introduction of a new system-in-package approach to electronics design and construction".
Take a look also at the news release from Kemet Electronics Corp, Inductors to expand passives portfolio,
as well as System-in-package design infrastructure from Flomerics,
and SpotComponents distribution agreement with Yageo from SpotComponents.
See also:
Low Cost hermetic semiconductor packages
(July 2006)
StratEdge introduces low cost hermetic semiconductor packages for switch applications
Interfaces chips put applications on the line
(June 2006)
The latest Litelink and Cybergate devices provide interfaces for connection to telephone networks for both voice and data applications combining all of the required functionality and compatibility
Programme promises faster access to planar arrays
(March 2006)
A lean manufacturing programme aims to reduce lead times of planar arrays by a third
Virtual shield boosts backplane connector speed
(March 2006)
AirMax VS connectors feature an innovative design that uses air as a highly efficient dielectric and employs staggered contacts to produce 'virtual shields'
Charger chip cuts power supply demands
(February 2006)
Combining switch-mode operation with Summit's proprietary Turbo Charge mode the SMB135 dramatically cuts charge time, shrinking or eliminating costly and bulky AC/DC power supplies
MLCCs move into RoHS-exempt equipment
(October 2005)
The latest designs of surface mount chip capacitors available from leading UK passive component manufacturer Syfer Technology can now be supplied with traditional tin/lead terminations
Passive role for Bolsover
(October 2005)
Abacus ECD has recruited Wendy Bolsover as a northern-based Passive Specialist, working with account managers to support customers in identifying solutions to their design challenges
BiCMOS process boasts GaAs-level performance
(October 2005)
QUBiC4X is the latest addition to the highly successful QUBiC4 family of high-performance BiCMOS (bipolar CMOS) process technologies from Philips
Murata signs for UK and Ireland coverage
(October 2005)
Arrow has been appointed by Murata to distribute its complete product range throughout the UK and Ireland
French success gives TTI Europe-wide deal
(October 2005)
Omron Components has appointed TTI as a Europe-wide franchised distributor for its full range of component products in all national markets, building on their successful partnership in France
Electro-emulation tester links bench with line
(September 2005)
New from Schaffner, the W629 electro-emulation tester offers OEMs efficient strategies for testing finished products and partial assemblies during the manufacturing process
Tooling technology accelerates processing
(September 2005)
DEK has developed an innovative, robust multiple chip package solution claimed to dramatically reduce cycle time while delivering unmatched accuracy and repeatability
Panasonic rewards 30% sales growth
(July 2005)
Premier Farnell has been presented with a special distributor award by Panasonic Industrial Europe, one of the electronics industry's largest suppliers of standard and custom components
Panasonic rewards sales performance
(June 2005)
The Abacus Group has received an award for outstanding sales performance in 2004-05 from Panasonic Industrial Europe
UL recognition for circuit protection devices
(March 2005)
PolySwitch TRF600-150 circuit protection devices are now UL recognised to UL1434 and have passed UL tests from UL497A
Thin-film process aids passive integration
(February 2005)
IMEC has created 5 and 15GHz low-power VCOs by post-processing high-Q inductors on top of 90nm RF CMOS devices using a thin-film wafer-level packaging technology
Farnell celebrates awards hat-trick
(January 2005)
Three recent supplier awards for Farnell InOne from Vishay, Epcos and Harwin, each pay tribute to the distributor's flexibility, focus and commitment to close working relationships
Epcos deal expands to UK and Ireland
(January 2005)
Under a new franchise distribution agreement Arrow will carry the full Epcos range of passive component products throughout the UK and the Republic of Ireland
Franchise expands to cover Northern Europe
(December 2004)
Arrow will now handle the full BI Technologies and Welwyn Components product portfolio throughout Northern Europe
Masterclass extols benefits of embedded passives
(December 2004)
At the recent NPL Masterclass, Dr Richard Ulrich gave a comprehensive discourse on the current and future benefits of embedded passives
Surface mount power inductors meet needs
(November 2004)
The NPI and NPIS series of surface mount power inductors from NIC Components meet the needs of the industry wide trend for low voltage, high current circuit operation
Investment brings market leadership
(October 2004)
According to Paumanok Publications, publisher of Passive Component Industry Magazine, AVX holds the number one worldwide position in tantalum and niobium oxide capacitors, with a market share of 22%
Sumitomo signs up for passive support
(June 2004)
Sumitomo Electric Industries has chosen Bookham Technology to supply critical passive optical components for the company's fibre-to-the-premise (FTTP) broadband systems
Nu Horizons grows again
(May 2004)
Nu Horizons Electronics Corp has reported financial and operating results for the fourth quarter and year ended 29th February 2004
Hat-trick of distribution awards
(February 2004)
Farnell InOne has been voted distributor of the year 2003 three times in as many months
Ceramic components go to extremes
(January 2004)
New from TTI Electronics are a range of high-voltage and high-temperature ceramic capacitor and EMI filter products
Simulation software helps UMC sort out inductors
(December 2003)
UMC is claiming a breakthrough electromagnetic design methodology for RF CMOS designs that uses a combination of electromagnetic analysis tools to reduce simulation cycle times from hours to minutes
Acquisitions double passives business
(November 2003)
Amersham-based passive component specialist VTM (UK) has purchased the components divisions of both Kestronics and Newsham Components
News on the Passive components from Farnell
(November 2003)
Farnell InOne has added 1300 new products to its already leading range of passive components with the launch of its 'Passive components new product guide' in the UK and Ireland
Taiwanese focus on high-frequency design
(October 2003)
Ansoft hosted a recent seminar in Taiwan focusing on the low-temperature cofired ceramic process
Wider availability for RF connectors
(October 2003)
Amphenol RF has signed Nu Horizons RF to distribute its coaxial connectivity products within the USA, Canada and Mexico
Website devoted to RF passives
(September 2003)
NIC Components Europe has launched a new website to address the passive component needs of the RF and wireless communications markets
Coleman brings strong technical background
(July 2003)
NIC Components Europe has appointed a new Technical Sales Engineer to strengthen its ability to provide passive component design-in support to its customers across Europe
Power amp handles all four GSM bands
(February 2003)
The BGY284 is a highly cost-effective quad-band GSM power amplifier module with a footprint of only 8 x 8mm, a mounting height of 1.5mm and featuring a fully integrated power control loop