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"Pb-free"...

Laurence Marchini

Laurence Marchini, Editor, writes:
 

We see from your search that you're looking for information on the term "Pb-free", and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest. Let me be your guide.
 
Start with the news release Switching regulator is cool alternative to linear from Linear Technology Corp, which we summarised at the time by saying "Complete DC/DC module includes a DC/DC controller IC, power switches, inductor, compensation circuitry and input and output bypass capacitors". The same day, we featured the news release Transmitter module saves space and power from RF Micro Devices: "Dual-band transmit module features two symmetrical receive ports, 50ohm matched input and output ports and GSM/GPRS Class 12 compliance".
 
In January 2008, we covered the news from Advanced Analogic Technologies concerning its AAT1239-1 - take a look at White LED driver cuts down on flicker which says: "By driving up to 10 white LEDs in a serial string, the AAT1239-1 simplifies the use of larger LCD panels in a wide array of battery-powered portable devices".
 
Take a look also at the news release from Micrel, Hot-swap controllers meet PCIe specs, as well as Integrated switches simplify power design from Advanced Analogic Technologies, and Polymer tantalum chips are rated for 35V from Kemet Electronics Corp.
 

See also:

Miniature module regulates efficiently (November 2007)
Complete 4A regulator system includes onboard controller, power switches, inductor and bypass capacitors enclosed and protected in a 9 x 15mm LGA package

Convertor can power bigger loads (November 2007)
Synchronous step-up convertor delivers more load current than competing products in the same footprint and supporting lower startup and operating voltages

Book presents six years of lead-free research (November 2007)
Data from several large reliability studies, including rework on standard and large boards, demonstrated the manufacturability of the recommended solder

Drivers add flexibility to analogue design (September 2007)
Dual differential ADC drivers enable designers of data acquisition systems to improve system performance by enhancing key ADC performance characteristics

Serial EEPROMs come in low-profile 8-pin packages (September 2007)
The novel XDFN package is ideal for height-constrained comms applications such as headsets, wireless LAN adapters and Bluetooth modules

Controller cuts modems down to size (September 2007)
Modem controller IC integrates a microcontroller, datapump, memory and system side device in a single die

EMI suppressors fit in small footprints (September 2007)
BLM02 devices provide EMI suppression and prevention of abnormal oscillation in mobile phone power amplifier modules

IGBT offers low conduction losses (August 2007)
The FGH30N60LSD is designed to increase system efficiency while meeting low-frequency requirements

Compact transceivers offer robust performance (August 2007)
Parallel networks, like SCSI 'fast 40' systems, benefit from the 40Mbit/s data rate and the low transceiver and receiver skews, as well as the 4nS part-to-part skews

Preconditioning for component Pb conversion (August 2007)
Joel Deutsch and Michael Baker explain how proper preconditioning allows older ICs and semiconductor devices to be converted to become RoHS compliant

MOSFETs survive larger voltage spikes (August 2007)
Low-on-resistance N-channel MOSFETs boost system efficiency and offer new levels of ESD prptection

Charge pumps provide all handset LED power (August 2007)
The AAT2846 and AAT2856 combine backlight drivers, high-current flash drivers and two general purpose LDOs linear regulators in a single package

Switching regulators protect against spikes (August 2007)
High-efficiency 2A integrated FET step-down DC/DC switching regulators support wide operating input voltages and can handle transient spikes up to 100V

Translators enable design independence (July 2007)
Low-voltage dual-supply voltage translator increases design flexibility by allowing designers to control the direction of each bit individually

Power switches combine to save handset space (July 2007)
Main battery switch, wall charging switch and USB charging switch elements are combined into a single component

Load switches improve thermal performance (July 2007)
Load switches integrate current-limited P-channel MOSFET with protection and control features to simplify design, reduce component count and minimise board space

Two-way voltage translator goes low (July 2007)
Single-bit bidirectional voltage translator is guaranteed to operate from 1.1 to 3.6V

Integrated LED drivers need no support (July 2007)
Multichannel linear LED drivers minimise board space and simplify display backlighting by requiring no external components

Half-bridge driver runs from any automotive supply (July 2007)
Low-cost half-bridge driver IC targets automotive applications in both passenger cars and commercial vehicles

LIN devices claim new EMI benchmarks (July 2007)
LIN system basis chips integrate transceivers with system protection measures to save space in automotive applications

FET and driver combine for compact power (July 2007)
Optimised and integrated FET plus driver power stage solution replaces discrete alternative to save more than 80% of PCB real estate

Front-end chips simplify battery pack design (June 2007)
Integrated analogue front ends slash component count for cell balancing and overcurrent protection in multiple-cell Li-ion battery packs

Interface chip brings carrier values to VoIP (June 2007)
Device combines a fully integrated dual-channel SLIC and codec in a single chip

Controllers cut notebook power (May 2007)
Power controllers are specifically designed to meet the efficiency requirements of notebook PCs

Study vindicates chip-on-board reliability (May 2007)
Extensive programme of reliability tests validates performance of chip-on-board (COB) technology for harsh environment applications

Ultraminiature fuses protect on the surface (May 2007)
Thick- and thin-film surface-mounting micro fuses can be reflow soldered and come with full safety agency certification

LED boasts high visibility from low profile (May 2007)
Ultra-low-profile 0.5W surface mount white LED offers a full 120-degree viewing angle

Call for clarity in lead-free part numbering (May 2007)
iNEMI members support move to create unique part numbers for BGA components to differentiate any Pb-free ball metallurgies other than SAC 305 or SAC 405

Pb-free solder paste is top innovation (May 2007)
Indium5.1AT Pb-free solder paste has won the Innovation Award at Nepcon China

Soldering and reliability in the spotlight (April 2007)
Dr Ning-Cheng Lee will lecture on metallurgical fundamentals and optimal processes at the International Conference on Soldering and Reliability in Toronto

Solder pastes suffer from tin and silver rises (April 2007)
Indium Corporation has placed a surcharge on its silver- and tin-containing solder paste products, effective immediately

Dual-edge PWM controllers are dynamic performers (April 2007)
Multiphase buck controllers address power needs for servers and for VR10.x, VR11.0 and parallel VID based desktop personal computers

Serial Flash memories available up to 16Mbit (March 2007)
New from Amic Technology Corp, the A25LXXP family of SPI Serial Flash memories spans a full range of devices from 512Kbit to 16Mbit

MPU-controlled IBCs raise power efficiency (March 2007)
Intermediate bus convertors are capable of delivering exceptionally high levels of usable output power with a conversion efficiency of 97%

 

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