Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Placement equipment",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release IR LEDs and phototransistors in compact form from
Pacer International, which we summarised at the time by saying "Cost effective range addresses applications including portable electronics, appliances, industrial and automotive systems".
A few weeks before,
we featured the news release Voltage divider provides high stability from
IRC Advanced Film Division: "The TaNFilm voltage divider is ideal for battery monitoring, voltage references, voltage conversion, voltage regulators, logic-level conversion, DC/DC convertors and power supplies".
In March 2007, we covered the news from Assembléon
- take a look at Exclusive Russian distribution for single company
which says: "Assem Rus, will be the sole distributor for Assembleon's entire portfolio of products and services within the republics of the Russian Federation and Belarus".
Take a look also at the news release from Aegis Europe, Manufacturing information management on show,
as well as RGB LEDs create a colourful display from Optek Technology,
and Assembly systems join in lead-free experience from Siemens A and D Electronics Assembly Systems.
See also:
Upgrade accelerates pick and place performance
(April 2006)
A Speedpack upgrade for the AX range of pick and place machines increases the output of SMD placement equipment lines by up to 15%, while also improving line balancing
SMT placement equipment booms in Europe
(March 2006)
The development of high-growth end-user industries is opening up lucrative opportunities in the European surface mount technology (SMT) placement equipment market
Award celebrates commitment to innovation
(March 2006)
Universal Instruments Corporation has been confirmed as the recipient of the 2005 Frost and Sullivan Technology Award
Tooling and stencils show up with Assembleon
(February 2006)
Assembleon's recent customer roadshow highlighted new equipment from the SMT placement equipment manufacturer combined with selected tooling and stencil options from DEK
Multichip LEDs provide high luminance
(January 2006)
The OVTL09LGA Lednium series of high-luminance 10W LED sources was developed by Optek for applications in the automotive interior and exterior lighting, architectural lighting and signage markets
LEDs square up to boost brightness
(November 2005)
A new range of high-brightness, square, visible LEDs is ideally suited to a wide variety of roles that include signage, automotive, traffic control, decorative and landscaping applications
Ball grid array technology improves fish tagging
(November 2005)
Andover-based electronics design and manufacturing company CIL, has worked with Cefas to develop data storage tag (DST) for fish that uses double-sided ball grid array technology
Surface-mounting clips speed screening onboard
(September 2005)
A new range of surface mount EMI/RFI shield clips saves PCB space and reduces assembly and rework time by eliminating through hole manufacturing processes
Rotary placement head to star in Munich
(September 2005)
Universal Instruments will use Productronica 2005 to showcase its innovative Lightning rotary placement head
D-sub connectors on the surface
(July 2005)
A new range of surface-mount D-sub connectors offers an innovative solution for next generation designs
Digital X-ray system is first in Europe
(February 2005)
Whitchurch based electronics design and contract manufacture company Custom Interconnect has taken delivery of the first Dage XD7600 XiDAT digital X-ray system to be installed in the Europe
15 years of high-speed co-operation
(November 2004)
Universal Instruments has celebrated 15 years of its OEM agreement with Hitachi High Technologies (HHT) to market the 4797 HSP high speed, turret-style placement machine
Lead-free trials under way
(November 2004)
CIL, an electronic manufacturing and design company, has invested to put it in a position to work with customers on trial projects involving lead-free manufacture
Rapid changeover 'key to SMT placement market'
(November 2004)
Mydata's experience in the SMT placement market backs up the findings of a recent report from Frost and Sullivan, according to the company's managing director
Lower global prices for platform product ranges
(October 2004)
Universal Instruments has significantly reduced the prices of its platform product ranges in all geographic regions, effective immediately
Compact MLCs handle higher voltages
(June 2004)
A new series of high-voltage ceramic chip capacitors supports up to 1000V in a tiny 0805 package for power supplies, high-voltage coupling and DC/DC convertors
CBAR recognises Universal contribution
(March 2004)
Universal Instruments has received a plaque from the Centre for Board Assembly Research at the Georgia Institute of Technology to commemorate its contribution to advancing assembly technology
Thick-film resistors oust wire-wound types
(March 2004)
HVC Series thick-film surface-mount resistors exhibit superior power and voltage handling capabilities, making them ideal for use in defibrillators, power supplies and other high-voltage applications
Five more years for placement accord
(February 2004)
Universal Instruments and Hitachi High Technologies (HHT) have renewed their successful OEM agreement for a further five years
Kit checks out pick-and-place equipment
(June 2003)
The IPC-9850 test materials kit includes all the materials needed for manufacturers to test flexible placement machines and chip shooters to the specifications of the IPC-9850 standard
Awards for turret-style chip shooter
(April 2003)
The HSP4797L turret-style chip shooter has scooped two separate prestigious industry awards - both in the premium pick and place category
Placement for small- to mid-size manufacturers
(March 2003)
Vantis is an accurate and reliable placement platform introduced to meet the needs of small- to mid-size consumer electronics, audio-visual equipment, PC and peripheral manufacturers
Kaisertech to maintain UK coverage
(February 2003)
Netherlands-based manufacturer of advanced SMT placement equipment Assembleon has appointed Kaisertech as its UK agent
Characterisation kit for SM placement equipment
(December 2002)
A new kit from Dynamix Technology helps with surface mount placement equipment characterisation in accordance with the IPC-9850 standard
Placement alliance survives acquisition
(November 2002)
Hitachi High-Technologies and Universal Instruments are to continue their successful OEM business for turret-style high-speed placement equipment
CSP test die covers all the standards
(September 2002)
Amkor has adopted the Ultra CSP as its standard wafer level package offering, available now from Practical Components
Tooling system supports SMT boards both sides
(June 2002)
Ovation Products division of Airline Hydraulics Corp has added several more machine capabilities to the Grid-Lok pneumatic-compliant tooling system for automatic PCB support
Component mounter goes easy on the ceramics
(May 2002)
The FCM Ceramic is the latest addition to the FCM fast component mounter family from Assembl‚on
Ultralight SM coaxial connectors keep low profile
(August 2001)
New SMT coaxial connectors from Flint Distribution enable 2.5mm-high PCB-mounted connections, and are among the lightest in the world
DC/DC convertors for low-voltage devices
(December 2000)
Following its acquisition of Azcore Technologies in August this year, Artesyn Technologies has significantly extended its range of DC/DC convertors