Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Printed circuit boards",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Software spots EMC issues in PCBs and cables from
CST - Computer Simulation Technology, which we summarised at the time by saying "New additions to simulation suite aim to expose EMC issues early in the design process, reducing the number of expensive cut and try iterations".
Earlier in the week,
we featured the news release Current transducer offers current output option from
LEM UK: "Multirange configuration is designed for nominal currents of 8, 12 and 25A RMS with galvanic isolation between the primary and output circuits".
In January 2008, we covered the news from Syfer Technology
concerning its Syfer discoidal multilayer ceramic capacitors
- take a look at Ceramic capacitors suit EMI filtering
which says: "Syfer's discoidal multilayer ceramic capacitors can be installed directly into filters, onto bulkheads, hybrid circuits or onto printed circuit boards".
Take a look also at the news release from National Physical Laboratory, Industry defects database goes online,
as well as Audio analyser goes offshore from Prism Sound,
and Simulation validates high-power chassis design from Flomerics.
See also:
Equaliser supports all 10G/8G interface standards
(December 2007)
Flexible high-speed equaliser extends the reach of printed circuit board signal channels, such as backplanes or active copper cables
Incremental encoders control without wobble
(November 2007)
Typical applications for the EC11J series are in volume adjustment or menu selection for car audio and car navigation systems
Flexible silicone coating to launch in Munich
(November 2007)
Fast-drying silicone-based conformal coating is designed to protect printed circuit boards exposed to high humidity environments
Software automates scanning
(October 2007)
System Cascon 4.4.1 contains new tools for test and in-system programming of Flash Eeprom devices, increasing the number of integrated tools to 36
Development system tracks designs for testability
(October 2007)
XJTAG 2.0 has a raft of new features, including automated JTAG chain discovery and setup, a built-in netlist explorer, optimised memory test and real-time design for test coverage tracking
Pressure film boosts capacitor reliability
(October 2007)
Pressurex tactile surface pressure-indicating film is used to ensure manufacturing tolerances for capacitors produced by SB Electronics
Simulation kit matches FPGA progress
(October 2007)
The Xilinx Virtex-5 FPGA simulation kit provides a set of topology templates, in-context HTML documentation and useful content for simulation of waveforms and eye patterns
Capacitors block interference
(October 2007)
Feeding DC current directly through the E07 chip filters will provide PCB designers with a significantly improved high-frequency filtering performance
Critical controller boards put on trial
(October 2007)
System provides a comprehensive set of tools to test, debug and program complex printed circuits containing ball grid array devices
Scanning module provides programmable voltages
(September 2007)
The JT 2111/MPV enhances regular interconnect tests by exercising the board's connections in synchronisation with native boundary-scan components
High-performance jack answers need for speed
(September 2007)
PCB-mounting high-speed Category 7A jack suits high speed data transmission equipment and high speed test instruments
Thermal management keeps pace with fast processing
(September 2007)
The method of heat sink attachment can be crucial to the performance of the system
Alliance addresses LED backlight expansion
(August 2007)
Agreement gives Laird Technologies access to Iteq's high volume lamination capabilities and AP distribution and gives Iteq access to Laird Technologies' high performance T-lam materials
Simulation kits aid FPGA integration
(August 2007)
Zuken is quick to provide users of its CR-5000 packaging and PCB design environment with simulation design kits that enable rapid and easy adoption of the devices
Chemicals makers chase PCB production
(August 2007)
Growing replacement of PCBs in several industrial applications has led to decreased usage
Interconnection process promises a revolution
(August 2007)
An 'evolutionary' technology for both printed circuit boards and PCB assemblies promises to dramatically improve the way electronic products are made
Cooling technology addresses shrinking electronics
(July 2007)
The increased power densities of modern electronic products demand new approaches to thermal management: Michael Dreyer looks at advances in thermal interface materials
PCB labels withstand lead-free reflow
(July 2007)
High-temperature labels and ribbons withstand temperatures to 538C for marking of printed circuit boards
Simulation suite bypasses networking prototypes
(July 2007)
ZTE engineers predict radiated emissions and induced interference from PCBs and examine multiple PCBs within a cabinet to determine trends for system-level emission
Development system debugs precision motion
(June 2007)
Etel uses the XJTAG boundary scan development system to debug and test complex printed circuit boards used in its market-leading range of advanced digital motion controllers
Study vindicates chip-on-board reliability
(May 2007)
Extensive programme of reliability tests validates performance of chip-on-board (COB) technology for harsh environment applications
Alliance marries FPGA design and verification
(May 2007)
A new partnership between Zuken and Aldec aims to make it easier for designers to work with programmable devices
System evolves to monitor FPGA developments
(May 2007)
Development system offers easy access to FPGA analogue debug and system management tool for thermal management and measurement of on-chip power supply voltages
Boards help bring a garden to life
(May 2007)
Prism Electronics manufactures PCB assemblies for a novel wireless lighting system designed to create stunning lighting effects and spectacular shows in domestic gardens
Thermal analysis software takes a 3D view
(May 2007)
Novel thermal optimisation capability fits a 3D surface to the entire design space, enabling engineers to visualise the complete interaction of the design parameters with the design goal
Probe technology stars in awards
(April 2007)
Agilent's revolutionary Medalist Bead Probe Technology has won the 17th EDN Innovator/Innovation Awards in the Test and Measurement category
Design kit explores ALIVH capabilities
(April 2007)
A design kit for Any Layer Interstitial Via Hole (ALIVH) boards can be used with Nexxim, HFSS and Ansoft Designer software
Aluminium electrolytics can be specified online
(April 2007)
Screw-terminal aluminium electrolytic capacitors offer long life and better than 50A ripple capability for bus capacitor or DC-link capacitor applications
Adhesives encapsulate, insulate and bond
(April 2007)
A comprehensive series of high-strength epoxy and polyurethane adhesives provides encapsulation, insulation and bonding of electronic components and PCBs
Design platform puts Wi-Fi/DAB/FM module to work
(March 2007)
Low-cost Wi-Fi radio reference platform for 'four-in-one' module helps designers build portable and clock radio products incorporating Internet radio, DAB, FM and music streaming capabilities
Electronic materials on show in Shanghai
(March 2007)
Huntsman Electronics has supported International Electronic Circuits Exhibition in Shanghai since 1999, and this year is presenting a range of advanced products
Small switches produce reassuring feedback
(March 2007)
Tiny tactile switches are ideal for wireless headsets, mobile phones, portable instruments, keyless entry systems and other applications where size is a key differentiator
Enhancements to PCB test systems on show at Nepcon
(March 2007)
Enhancements to PCB testers include new digital functional testing, mixed-signal testing, in-system programming and improved probing speeds
Microwave components are shielded onboard
(March 2007)
Combination of microwave absorber with board level shield absorbs or suppresses high frequency interference, enabling the board to be more effective at high frequencies