Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Reflow process",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Miniature module regulates efficiently from
Linear Technology Corp, which we summarised at the time by saying "Complete 4A regulator system includes onboard controller, power switches, inductor and bypass capacitors enclosed and protected in a 9 x 15mm LGA package".
A few weeks before,
we featured the news release Reflow process handles the (w)hole board from
Photo Stencil: "A novel process promises to increase efficiency for process engineers by eliminating the wave soldering process altogether".
In April 2007, we covered the news from PDR SMT/BGA Rework Solutions
- take a look at Inra-red provider celebrates 21 years of operation
which says: "PDR celebrates 21 years of supplying leading-edge focused infra-red (IR) rework systems to the global electronics industry".
Take a look also at the news release from Sabic Innovative Plastics, Speciality compound withstands lead-free reflow,
as well as Thermal monitor provides full process traceability from KIC Thermal Profiling,
and Fasteners have the right angle onboard from PennEngineering.
See also:
Board and kit ease lead-free evaluation
(June 2006)
The new PCB049 board and kit - developed by Practical Components in conjunction with Indium Corp - is billed as the ultimate resource for evaluating mixed-technology lead-free assembly
Packaging process protects components from reflow
(March 2006)
A novel packaging technique allows temperature-sensitive components to be surface mounted by reflow soldering, despite their sensitivity to prolonged high temperatures
Kit offers easy intro to mixed lead-free assembly
(March 2006)
The new PCB049 board and kit is billed as the ultimate resource for evaluating mixed-technology lead-free assembly
Clips put a new barb on applying PCB screens
(February 2006)
New technology can significantly cut the production time needed to solder large RFI screening cans and fences onto printed circuit boards
Thermal simulation turns to lead-free reflow
(February 2006)
New Flo/PCB software makes it possible to design PCBs for lead-free manufacturing by predicting thermal gradients during solder reflow processing
Siemens qualifies lead-free solder paste
(January 2006)
Multicore LF318 lead-free solder paste has now been successfully qualified by leading CEMs and OEMs such as Siemens
Delphi equips new SMT line
(December 2005)
Delphi has purchased an Electrovert OmniExcel 10 reflow oven and custom-designed Rommel board handling equipment from production automation specialist Contax
Novel no-flow underfill wins technology award
(December 2005)
Indium Corporation has received the Global Technology Award for its NF260 no-flow underfill
Logger helps get exhibition demo up and running
(October 2005)
The SolderStar datalogger solved a tricky Pb-free process profiling problem at the recent Forum De L'Electronique exhibition in France
Latest lead-free soldering materials go on display
(September 2005)
Cookson Electronics Assembly Materials will show its complete line of Alpha lead-free soldering materials on stand 262 in Hall 4 at Productronica 2005, including soldering alloys, fluxes and pastes
Solder preforms work with pick and place lines
(September 2005)
Tape and reel packaged solder preforms allow measured amounts of solder to be deposited accurately, selectively and without special equipment
Seminar series kicks off at Oxford and Cambridge
(July 2005)
The Electronics Group of Henkel has successfully supported two seminars on the implications of the forthcoming RoHS and WEEE Directives for the electronics industry
Convertors boast maximum current and power
(April 2005)
The ESM series of DC/DC convertors is billed as delivering the highest current and power available today in an industry standard 2 x 1in sized package
Scanning acoustic microscopy spots reflow damage
(April 2005)
The NPL has developed broad expertise in applying scanning acoustic microscopy for assessing the level of delamination in printed circuit boards and die cracking inside electronic packages
Logger allows real-time reflow control
(March 2005)
The Pro-5 data logger overcomes the disadvantages of most other profilers, as it uses RF technology to transmit the heat profile in real time
Cabinets keep components fresh and ready to solder
(March 2005)
One of the UK's leading contract electronics manufacturers recently purchased three McDry cabinets of varying sizes from production automation specialist, Contax
Pb-free paste keeps it clean
(February 2005)
Multicore WS300 is a high-activity water-washable lead-free solder paste with superior cleaning characteristics and suitable for fine-pitch high-speed printing applications
Compact reflow oven handles lead-free processing
(February 2005)
The Solano is a full convection reflow oven for lead-free processing
Camera puts rework in the picture
(January 2005)
A new camera system is available for the Ersa IR550 BGA rework and replacement station, enabling the user to actually watch the reflow process as it happens
Centre probe socket speeds debug operations
(December 2004)
A novel solderable centre probe socket enables users to debug a wide range of package types - BGA, UBGA, MLF, QFN and others - on the same package footprint
Terminals suit through-hole reflow process
(April 2004)
A new range of terminals helps provide a cost-effective solution for surface mount technology assembly processes
Drying cabinets stop damp chips cracking
(March 2004)
McDry is a new range of drying cabinets developed by Seika Sangyo and available exclusively in the UK and Ireland from Contax
VDE certification for connectors
(February 2004)
Tyco Micro Mate-N-Lok connectors have received VDE certification
Stencils smooth the switch to lead-free processing
(December 2003)
Innovative stencil design features, improved squeegee blade technology and added component protection can simplify the transition to lead-free production
Paste-in-hole females need less handling
(December 2003)
THTR hm 2.0mm hard metric female connectors from In2Connect can save important time and associated PCB assembly costs
Sounders and buzzers tackle critical applications
(September 2003)
Dubilier has a new series of sounders and buzzers for quality-critical applications such as smoke alarms, portable alarms and special needs equipment
Multilevel solder stencils aid pin-in-hole reflow
(October 2002)
As the PCB manufacturing industry increasingly adopts the beneficial concept of pin-in-hole reflow, Tecan continues to boost its share of this developing new market
Sockets integrate magnetics for gigabit integrity
(June 2002)
Pulse has three new PulseJack connector sockets with integrated magnetics which extend the family's data handling capability into the gigabit (1000Base-TX) range
Reflector shield saves sensitive components
(March 2002)
A new thin-metal reflector shield protects sensitive components during pin-in-hole reflow, the technique of soldering both SMD and traditional leaded components in a single operation
Organic capacitors perform better for longer
(January 2002)
New aluminium organic capacitors from Micromark C and CD sustain their capacitance at high operating frequencies, thereby enabling component count and system cost savings
Inline printer puts BGA bumps on 300mm wafers
(November 2001)
Ekra has released the X5-WAF, a new inline wafer bumping system
Switches and relays for automotive uses
(March 2001)
Tyco Electronics has introduced four new products designed to meet the demanding requirements of the automotive market
Labyrinth RFI screening can brings RFI benefits
(January 2001)
A labyrinth RFI screening can is an effective one-part board-level alternative for PCB designs which would otherwise require solid metal enclosures or multiple screening cans
Can-on-board solder migration problems solved
(October 2000)
Tecan Components has solved a range of problems associated with automated soldering of RFI screening cans/fences onto PCBs with the introduction of the 'Plimsoll line and lattice bridging stencils'