Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Semiconductor device",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Indian designers support wireless development from
picoChip Designs, which we summarised at the time by saying "Larsen and Toubro Infotech offers a comprehensive product development service for communications equipment based on the picoArray".
A few weeks before,
we featured the news release Deal targets characterisation of novel materials from
Keithley Instruments: "Keithley and CEA Leti will research methods for characterising advanced semiconductor materials and devices that support DC, high frequency and RF-level signals".
In July 2007, we covered the news from Power Electronic Measurements
concerning its CWT Ultra Mini
- take a look at Current transducers measure in small spaces
which says: "AC transducers feature more robust mechanical outline and improved high-frequency performance".
Take a look also at the news release from Cascade Microtech, Power ICs now tested on the wafer,
as well as Chip analyser upgraded to test latest memory cells from Agilent Technologies Europe,
and Microscopy technique clears up 45nm imaging from Toshiba Electronics Europe.
See also:
PM finds facts on semiconductor manufacturing
(April 2007)
Prime Minister Tony Blair visited Zetex Semiconductor's Oldham Headquarters during a recent fact-finding trip to the North West of England
Metrology services support semiconductor shrinks
(January 2007)
Besides its wide service portfolio, SGS Institut Fresenius focuses on some special techniques in order to correspond with developments in the semiconductor industry
Parallel test and RF testing enhanced
(December 2006)
Keithley Instruments announces the release of KTE V5.2, Keithley's Interactive Test Environment software for the Series S600 Parametric Test System
Reliability test alliance
(December 2006)
Agilent Technologies has announced a formal agreement with Core Wafer Systems (CWS) for the semiconductor test market space
Curing light system wins US patent
(November 2006)
A patent for a curing light system for curing light-activated composite materials has been issued to Dr Densen Cao, President of Cao Group
Project to upgrade automotive accelerometers
(November 2006)
A new research project aims to produce higher performance inertial sensors which could detect potential car accidents more accurately than any currently available
Mass metrology proves popular with chip makers
(October 2006)
Metryx has received orders from three new customers for its innovative mass metrology Mentor technology
Comparators speed ATE setups
(September 2006)
Window comparators enable semiconductor device testing with ATE in large voltage swing applications without the need for bus isolation relays, saving setup time and cost
Alliance focuses on 45nm logic structures
(September 2006)
Epion Corporation has entered into a formal joint development programme with the world's number one supplier of microcontrollers
Low Cost hermetic semiconductor packages
(July 2006)
StratEdge introduces low cost hermetic semiconductor packages for switch applications
DigRF interface suits RF and baseband for 3G
(July 2006)
TTPCom's 3G DigRF solution is designed to enable semiconductor device vendors to quickly and easily add a 3G DigRF compliant digital interface to both 3G RF and baseband ICs
Preprocessing switch speeds DSP bandwidths
(July 2006)
An advanced semiconductor device integrates an innovative suite of byte- and packet-level manipulation capabilities designed to offload DSPs of specific bandwidth-intensive tasks
Conditioner diagnoses piezoresistive bridges
(June 2006)
The ZMD31015 is a signal conditioner IC with on-chip diagnostics for use with nearly all piezoresistive bridge sensors
Lord Lieutenant presents Queen's Award
(May 2006)
Wolfson Microelectronics has been formally presented with the Queen's Award for Enterprise by the Rt Hon Lesley Hinds, Lord Lieutenant and Lord Provost of the City of Edinburgh
Initiative unites leaders in low-power design
(May 2006)
Cadence Design Systems has set up the Power Forward Initiative to address obstacles to lower power IC design facing the electronics industry
Advisory board lines up technology expertise
(May 2006)
Innovative Silicon has recruited five semiconductor memory and silicon on insulator luminaries to participate in the company's newly formed Technology Advisory Board
Generators improve accuracy and control
(April 2006)
Pulse/pattern generators provide key performance advantages, such as superior signal quality and precise control for pulsewidths from 3ns to 1000s, as well as a simple, intuitive user interface
Audio chip leads to Queen's Award
(April 2006)
Wolfson Microelectronics has won the Queen's Award for Enterprise in the Innovation category
Wolsheimer is quality recruit to executive team
(March 2006)
Summit Microelectronics has appointed Evert Wolsheimer, PhD, to the position of Vice-President of Manufacturing and Quality
Thermal tester checks eight devices at once
(March 2006)
Flomerics is to supply the T3Ster (pronounced Trister) thermal testing system and other testing products gained through its acquisition of Micred
Multichannel acquisition modules speed up to 2MHz
(February 2006)
The DT9832 Series USB 2.0 data acquisition modules offers two or four channels of simultaneous 16bit analogue measurement at speeds up to 2MHz per channel
Innovation spreads to new areas of T and M
(January 2006)
Keithley Instruments is celebrating its 60th year of innovation by expanding its measurement portfolio into new areas
Embedded memory works on 90nm SoI process
(January 2006)
Innovative Silicon has achieved silicon validation of Z-RAM memory arrays on 90nm SoI process technologies
CANbus varistors protect three ways
(December 2005)
Surface-mountable CANbus varistors save space by replacing three components typically used to protect against transient voltage spikes
Cadence forms initiative with STARC
(November 2005)
Cadence Design Systems has announced a cooperative quality modelling initiative with the Semiconductor Technology Academic Research Centre (STARC)
Weight metrology proves popular in wafer fabs
(September 2005)
Metryx has won orders worth up to $4 million for its revolutionary Mentor high-throughput simple-to-use nondestructive metrology tool that offers atomic layer measurement accuracy
New company focuses on embedded memory technology
(September 2005)
Innovative Silicon (ISi) was founded to develop, commercialise and license floating body effect memory intellectual property (IP) for SoC/MPU applications
Probe technology aids semiconductor analysis
(July 2005)
Advanced laser 3D atom probe technology can be used on silicon devices
NASA finances low-temperature IC research
(June 2005)
BAE Systems has received a $12.5 million contract from NASA for research and development of extreme temperature technology
Tester gets the measure of advanced IC reliability
(April 2005)
The S510 semiconductor reliability test system is a high-channel-count turnkey solution for use in reliability testing and lifetime modelling of the world's most advanced ULSI CMOS processes
Brighton debut for high-speed device programmer
(April 2005)
Adaptsys will be introducing a number of advanced component programming, marking and handling solutions at Nepcon UK 2005 (Stand U401)
Entegris and Mykrolis to merge
(March 2005)
Two leading suppliers to the global semiconductor industry have signed an agreement to combine in a merger-of-equals transaction that creates a combined company valued at approximately $1.3 billion
CD explains semiconductor reliability testing
(January 2005)
Keithley Instruments has released an interactive, tutorial CD on reliability testing for semiconductor test engineers
University teaches analogue engineering online
(November 2004)
National Semiconductor has expanded its popular Analog University, the industry's first free online education resource for electronic design engineers