Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Semiconductor devices",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Test technologies keep up with design complexity from
National Instruments, which we summarised at the time by saying "Eric Starkloff highlights five trends he expects will significantly influence the test and measurement industry over the next three years".
A couple of weeks before,
we featured the news release Wafer probing provides 45nm resolution from
Cascade Microtech: "Users of the Elite 300 wafer probe station won't have to retool at each process node or lose business to competing foundries with more accurate test capabilities".
In December 2007, we covered the news from Yamaichi Electronics
concerning its NP481
- take a look at Fine-pitch burn-in socket takes larger devices
which says: "Sockets use compression mount technology, in which the flexible contacts are pressed onto the contact pads of the PCB by screwing the socket to the board".
Take a look also at the news release from Arrow Electronics (UK), Monitor checks for bad cholesterol,
as well as Software defined silicon nears reality from XMOS Semiconductors,
and Book outlines simple electronic design from CRS.
See also:
Programmable source aids device characterisation
(October 2007)
DC voltage and current generator for high-speed and highly accurate measurement of the voltage, current and other characteristics of semiconductor devices and other electronic equipment
Imaging system finds fault with ICs and small PCBs
(August 2007)
The Micro thermal imaging system includes several important hardware components that are essential when analysing or troubleshooting semiconductor devices
Deal targets characterisation of novel materials
(July 2007)
Keithley and CEA Leti will research methods for characterising advanced semiconductor materials and devices that support DC, high frequency and RF-level signals
Matrix boards expand LXI switching options
(July 2007)
A high voltage matrix and a low thermal EMF matrix are the latest in an expanding range of LXI compliant switching products available from Pickering Interfaces
Semiconductor materials growth continues
(June 2007)
The global semiconductor materials market is predicted to grow by more than 10% during 2007, and is forecasted to grow another 10% in 2008
Power ICs now tested on the wafer
(May 2007)
Power device characterisation system answers on-wafer probing challenges for engineers and test technicians who need to characterise their power devices
Adhesive helps keep flip-chip BGAs cool
(May 2007)
High-performance thermal adhesive combines the proven reliability and flexibility of silicone-based chemistries with a silver filler to achieve high thermal conductivity
Chip analyser upgraded to test latest memory cells
(April 2007)
New hardware and software capabilities for the B1500A semiconductor device analyser reduce the time required for testing and characterising advanced non-volatile memory (NVM) cells and other devices
Power Package series guards semiconductor devices
(April 2007)
A new line of semiconductor packages can be used in silicon, silicon carbide, gallium nitride, and other applications for power integrated circuits
Semiconductor test companies complete merger
(April 2007)
The distinct R and D, manufacturing and support operations of Antares ConTech and UMD Advanced Test Technologies have been integrated following the companies' merger in the third quarter of 2006
Rework system reflows lead-free BGAs gently
(March 2007)
Optimised heating scheme avoids excessive lid temperatures, melting joints outside the rework area, warping of the PCB or distorting the plastic bodies of connectors
50th anniversary for pioneering firm of industry
(March 2007)
The company where the planar process for semiconductor manufacture was invented is celebrating its 50th anniversary this year
Japanese success for netlist reduction tool
(March 2007)
The Jivaro netlist reduction tool from Edxact has been chosen by one of Japan's leading worldwide suppliers of semiconductor devices
Innovation Award for capacitorless memory device
(February 2007)
The 2006 Frost and Sullivan Product Innovation Award in the field of silicon-on-insulator (SOI) technology was presented to Innovative Silicon for the invention of the capacitorless memory device
Five star rating for commitment to customers
(February 2007)
VLSI Research has awarded Keithley a five star rating among process diagnostics companies, the highest possible rating for overall customer satisfaction
Structured ASICs fit in system-in-package design
(January 2007)
Japanese researchers selected eASIC's Nextreme family of 90nm structured ASIC devices for a unique system in package product
Added support for signal integrity engineering
(December 2006)
The MathWorks has introduced RF Toolbox 2, which includes new functions that enable signal integrity engineers to design, model, analyse and visualise networks of Radio Frequency (RF) components
Programmable ASICs add support in Italy and Sweden
(October 2006)
eASIC Corp has signed up two new European channel partners
Comparators speed ATE setups
(September 2006)
Window comparators enable semiconductor device testing with ATE in large voltage swing applications without the need for bus isolation relays, saving setup time and cost
Ovens are economical for test and manufacture
(August 2006)
Economical ovens can perform a wide range of roles from high temperature tests and drying to heat treatment on production lines
Discrete appointment is essential addition
(August 2006)
Focus EDL has been appointed by EIC, one of the industry's leading manufacturers of discrete semiconductor devices
Low Cost hermetic semiconductor packages
(July 2006)
StratEdge introduces low cost hermetic semiconductor packages for switch applications
Bluetooth audio development with SBC middleware
(July 2006)
Renesas introduces SBC Middleware, an important enabling tool in the development of audio applications for Bluetooth devices using SuperH family microprocessors incorporating an SH3-DSP CPU core
Acquisition expands IC design services
(June 2006)
TES Electronic Solutions has added process and device characterisation to its broad range of semiconductor design services with the acquisition of the assets and key employees of DAnalyse
Collaborative effort wins best paper award
(May 2006)
A paper co-authored by Flomerics and the Budapest University of Technology and Economics is the IEEE Transactions on Components and Packaging Technologies paper of the year
New fab contributes to carbon nanotube research
(May 2006)
ON Semiconductor and Nantero have teamed up to develop innovative semiconductor process technology, continuing ongoing work to effectively integrate carbon nanotubes in CMOS fabrication
Thermal chamber cycles quickly
(May 2006)
Unitemp has a new rapid rate thermal cycle chamber designed primarily for the testing and monitoring of miniaturised high density semiconductor devices and other electronic devices
Avago range expands online
(May 2006)
Farnell InOne has further strengthened its partnership with Avago Technologies by adding a further 163 of its latest product lines to the Farnell InOne website
Microchip deal makes five for Anglia
(April 2006)
Anglia has signed a UK and Ireland distribution agreement with Microchip Technology, its fifth new semiconductor signing in recent months
Source-measure units raise current and voltage
(March 2006)
Keithley Instruments has made two new additions to its Series 2600 System SourceMeter instruments
Thermal tester checks eight devices at once
(March 2006)
Flomerics is to supply the T3Ster (pronounced Trister) thermal testing system and other testing products gained through its acquisition of Micred
Californian power devices come to the UK
(February 2006)
Anglia has signed a UK and Ireland distribution agreement with Diodes Incorporated, a manufacturer of discrete semiconductor devices based in Westlake Village, California
Software speeds switch-mode PSU design
(February 2006)
STR-CAD Design Aid software helps users to develop cost-effective switch-mode power-supply designs using the Sanken Electric STR series of switching-regulator integrated circuits
Integrated system checks automotive compliance
(January 2006)
The R and S IMS integrated measurement system is a compact instrument, handling measurement tasks from development to certification