Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Semiconductor manufacturing",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Semiconductor association welcomes new member from
National Microelectronics Institute, which we summarised at the time by saying "The first of the NML's new Business Associate Members is Oracle, the world's largest enterprise software company".
A couple of weeks before,
we featured the news release Mixed-signal process runs on 32nm node from
TSMC: "Leading edge technology is optimised for low power, high density and manufacturing margins with optimal process complexity and cost management".
In November 2007, we covered the news from Mentor Graphics UK
concerning its 65nm Mentor design kit
- take a look at Design kit mixed-mode and logic sub-processes
which says: "A packaged RF flow tutorial takes an RF circuit design from schematic capture through RF simulation, layout and post-layout simulation".
Take a look also at the news release from Certicom Corp, Memory IP adds secure dimension,
as well as Low-power process suits ZigBee/Wibree devices from TSMC,
and LSI to shed IC assembly and test operations from LSI Europe.
See also:
Reconfigurable logic IP optimised for 65 and 45nm
(July 2007)
Manufacturability-optimised reconfigurable logic intellectual property brings significant benefits to customers designing in advanced geometries
Alliance targets data Flash expansion
(July 2007)
IP purchase is the first part of a development co-operation which will continue to the next generation of advanced Flash memory technologies
Measurement link aids optical proximity correction
(June 2007)
Design for manufacturing interface helps customers to develop faster, more accurate and predictive OPC models for advanced 45nm and beyond technologies
Reference flow supports 45nm process technology
(June 2007)
Design methodology increases yields, lowers risks and improves design margins
Infineon and Chartered use litho-friendly design
(May 2007)
Mentor Graphics has validated its Calibre LFD (litho-friendly design) results in silicon on 65nm process technology
Multilayer organic technology in showcase
(May 2007)
Patented multilayer organic (MLO) technology from Jacket Micro Devices has been selected for the SEMI Technology Innovation Showcase award
65nm reference flow targets Common Platform
(April 2007)
Cadence Design Systems has released the 65nm Common Power Format enabled reference flow targeting the Common Platform technology
Memory core is passed fit for TSMC SoCs
(April 2007)
Aeon/MTP Parallel Architecture memory core is qualified to Taiwan Semiconductor Manufacturing Company's quality standard
Orders roll in for inspection system
(April 2007)
A leading semiconductor manufacturer will use Vistec's LDS3300 C macro inspection system for front, back and macro inspection and review of 45 and 32nm devices
MEMS process innovation wins Europe-wide award
(April 2007)
Two Bosch Group researchers have been named 'European Inventors of the Year'
Insulin pump on a patch makes use of MEMS
(April 2007)
Mixed-signal chip company teams up with insulin specialist to develop a miniature pump, which can fit on to a skin patch and deliver regular insulin infusions
Director of European Sales for interconnect firm
(April 2007)
Specialist in system interconnect has appointed Peter Schmidt as Director European Sales, effective immediately
Chiu takes charge
(April 2007)
Prominent semiconductor technology scientist Dr Tzu Yin Chiu is the new President and Chief Operating Officer at Silterra Malaysia
Chan spearheads sales in the USA
(April 2007)
Dr Charles Chan is the new President of Silterra USA
Foundry offers support services for 45nm process
(April 2007)
A full range of design support services for foundry's 45nm process includes prototyping
45nm process ready to run in September
(April 2007)
Taiwan Semiconductor Manufacturing Company is aiming to complete 45nm technology qualification and enter production as early as September 2007
RFID makers opt for enabling silicon
(April 2007)
Gen 2 silicon is provided to RFID inlay, label and packaging manufacturers in three convenient forms: bare wafers; processed wafers; and silicon chip on strap
Wireless infrastructure chip starts sampling
(April 2007)
Toumaz Technology has delivered the first silicon from Infineon Technologies' advanced 130nm RF CMOS process
PM finds facts on semiconductor manufacturing
(April 2007)
Prime Minister Tony Blair visited Zetex Semiconductor's Oldham Headquarters during a recent fact-finding trip to the North West of England
Device makers expand association
(March 2007)
Microchip Technology and Skyworks Solutions have joined the Fab Owners Association as device maker members
News on the Hindustan Semiconductor Manufacturing Corporation from Infineon Technologies
(March 2007)
Infineon Technologies is to license its 130nm CMOS technology to the Hindustan Semiconductor Manufacturing Corporation
IC manufacturing kit expands globally
(March 2007)
SEMI reports that worldwide sales of semiconductor manufacturing equipment totalled US $40.47 billion in 2006, representing a year-over-year increase of 23%
Embedded Flash deal for silicon foundry
(March 2007)
Silicon foundry gets IP rights to make high-density embedded Flash
Image sensor company sees profit and revenues drop
(March 2007)
OmniVision Technologies has reported financial results for its third quarter ended January 31, 2007
FET switches have inherently low video leakage
(March 2007)
Low video leakage, high isolation and an industry-leading settling time make solid-state switches especially well suited for semiconductor manufacturing system test and R and D
Memory chip demand fuels equipment expansion
(February 2007)
North American-based manufacturers of semiconductor equipment posted US $1.71 billion in orders in January 2007 and a book-to-bill ratio of 1.06
IEEE award recognises algorithm development
(February 2007)
Prof Thomas Kailath has been selected to receive the 2007 IEEE Medal of Honour, the institute's top award
TSMC signs up for 1T-SRAM technology
(February 2007)
MoSys has licensed Taiwan Semiconductor Manufacturing Company to develop and market memory macro products using its patented 1T-SRAM high-density embedded memory intellectual property
News on the Semiconductor Manufacturing Services from MagnaChip Semiconductor
(January 2007)
The MagnaChip Semiconductor Manufacturing Services (SMS) business has expanded its IP offering in partnership with three leading IP providers
TSMC forges stronger CMOS alliance
(January 2007)
NXP and TSMC are to strengthen their co-operation to include advanced R and D in CMOS process technologies as well as manufacturing partnership
Inspection systems aid leading-edge IC research
(January 2007)
IMEC, the leading European 300mm process development centre in Leuven/Belgium, uses Vistec INS300 and INS3300 inspection and review systems in its advanced IC manufacturing research and pilot line
Former Philips operation grows semiconductor sales
(December 2006)
NXP Semiconductors has announced its results for the first nine months of 2006
Chemical polishing equipment for sensors
(December 2006)
Entrepix has announced the signing of a CMP FastForward volume pricing agreement (VPA) with a leading aerospace defence contractor
Surrey catches high speed tube to success
(December 2006)
IP Group has teamed up with scientists from the University of Surrey to form Surrey NanoSystems to provide commercial tools for producing nanomaterials to revolutionise the semiconductor industry