Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Semiconductor technology",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release One chip has PCI Express expansion options covered from
MosChip Semiconductor Technology, which we summarised at the time by saying "World's first PCIe to peripheral I/O controller to have more than 21 combinations of serial, parallel, USB and ISA interface options".
A couple of weeks before,
we featured the news release Reference flow incorporates power reduction system from
Cadence Design Systems: "The Pride V1.5 flow incorporates the CPF-based Cadence low-power design solution to provide an automated and holistic low-power design flow from RTL design through GDS II tape-out".
In January 2008, we covered the news from Synopsys
concerning its PrimeTime VX
- take a look at STARC adopts statistical timing signoff tool
which says: "STARC was able to validate multiple evolutionary approaches to introducing statistical static timing analysis into existing design flows".
Take a look also at the news release from Oki Electric, Semiconductor technology cuts camera size,
as well as System provides easy CV measurements from Keithley Instruments,
and Process breakthrough for memory IP from Impinj.
See also:
IC platform cuts design times
(September 2007)
Cadence's new approach directly models critical elements of the manufacturing process instead of relying on conservative design rules
RF noise canceller improves receiver sensitivity
(September 2007)
In a weak signal area a mobile phone using the QNx220 can recover several bars of lost signal strength
Technology improves testing accuracy
(August 2007)
DFT MAX uses adaptive scan technology to substantially reduce the amount of test data required for each test pattern, achieving predictable results with virtually no impact on timing
Embedded DRAM process enables Xbox graphics
(August 2007)
Microsoft has started production of the Microsoft Xbox 360 graphics-memory subsystem using the TSMC 90nm embedded DRAM process
Low-cost FPGAs accelerate time to market
(August 2007)
SVS was able to launch its new product multiviewer only four months following silicon availability
Deal targets characterisation of novel materials
(July 2007)
Keithley and CEA Leti will research methods for characterising advanced semiconductor materials and devices that support DC, high frequency and RF-level signals
Programmable silicon is made for consumer designs
(July 2007)
Software Defined Silicon aims to provide consumer electronics system designers with the unit cost advantage of SoCs and the flexibility of FPGAs
Electronics companies develop digital amplifiers
(May 2007)
Zetex Class Z direct digital feedback amplifier (DDFATM) technology provides NAD Electronics with no-compromise audio performance
Pure design win is RF success
(April 2007)
Pure Digital has signed to use an RF CMOS device from Future Waves in its digital radio receivers
65nm reference flow targets Common Platform
(April 2007)
Cadence Design Systems has released the 65nm Common Power Format enabled reference flow targeting the Common Platform technology
Investment aids Czech education and research
(April 2007)
Masaryk University in the Czech Republic has set up a new laboratory for academic education and both silicon technology and microelectronics research
Chiu takes charge
(April 2007)
Prominent semiconductor technology scientist Dr Tzu Yin Chiu is the new President and Chief Operating Officer at Silterra Malaysia
Design software to create cell libraries
(March 2007)
Characterisation products Liberate and Variety have been adopted by STARC, the Japanese Semiconductor Technology Academic Research Center
Disruptive influences are isolated at ESC
(March 2007)
Innovative Silicon has been selected to exhibit in the Disruptive Zone at the Embedded Systems Conference Silicon Valley
Fame beckons for Bastani
(March 2007)
Dr Bami Bastani, President and Chief Executive Officer of Anadigics, has been inducted to the New Jersey High-Tech Hall of Fame
Awards honour IC companies
(March 2007)
Texas Instruments, NXP and Apexone were among the 24 semiconductor companies that won Global Sources' Annual Creativity in Electronics (ACE) Awards in mainland China
STARC signs for leakage power optimisation
(January 2007)
Blaze DFM has been chosen by STARC to provide leakage power optimisation software that will be integrated into the STARCAD-CEL reference design methodology
Alliance targets variability-aware DFM flow
(January 2007)
Clear Shape Technologies works with Japan's leading semiconductor technology research organisation to jointly develop, validate and deploy a variability-aware DFM flow
Alliance focuses on automotive component testing
(December 2006)
Cadence Design Systems and Advantest Corp have announced a collaborative partnership to deliver a methodology for zero-defect testing of digital automotive electronics
Topographical technology in new 65nm methodology
(December 2006)
Semiconductor Technology Academic Research centre has deployed Synopsys Design Compiler topographical technology in its 65nm Synopsys Galaxy Design Platform-based design flow
Awards recognise semiconductor companies
(November 2006)
The ACE Awards will present 24 awards for the Company of the Year, Product of the Year and Editor's Choice categories
Collaboration yields active cable range
(November 2006)
Active cable transforms data centre cable interconnects from passive, nonactive devices to intelligent roadways for use in today's mega data centres
Test pattern generator targets delay defects
(October 2006)
Automatic test pattern generation technology is designed to increase the quality of manufacturing tests by targeting small delay defects
Semiconductor forum features at SPS/IPC/Drives
(October 2006)
Following on from the TechTrends symposia and attendance at Embedded World in Nuremberg, this year EBV Elektronik is organising a semiconductor forum at SPS/IPC/Drives
NXP to take bigger share of SSMC
(September 2006)
NXP Semiconductors is to purchase the SSMC shares currently held by EDB Investments in the three months following completion of the separation of NXP from Royal Philips
Analogue devices make cables more intelligent
(September 2006)
Quellan can now transform data centre cable interconnects from passive, nonactive devices to intelligent 'roadways' for use in today's mega data centres
Industry veteran to attract design talent
(September 2006)
Zetex has appointed accomplished semiconductor industry veteran Dr Franz Riedlberger to head its technology department
Battery replacement chips answer laptop woes
(September 2006)
Eneco reckons its newly developed technology could provide the perfect solution to the problems now facing laptop manufacturers
High-security chip set for US passports
(September 2006)
NXP's SmartMX passport chip solutions meet the ICAO BAC data security and access standard, selected for the security in new passports
Termination system is maintenance free
(September 2006)
Tyco Electronics has introduced the HVT-Z high voltage termination system
Statistical capabilities for primetime
(July 2006)
Synopsys extends PrimeTime and Star-RCXT with statistical capabilities to address variation-aware design challenges
Component placement cell chosen by Editors
(July 2006)
Palomar Technologies has received an Editors' Choice Best Product Award for its Model 3500-II automatic component placement cell
Breakthrough in energy conversion
(July 2006)
Energy conversion with exciting potential benefits for a range of multi-billion dollar markets
Extended RTL-to-GDSII low-power reference design
(July 2006)
Extended RTL-to-GDSII low-power reference design flow for the latest 65-nanometer (nm) process offered by the IBM-Chartered Semiconductor Manufacturing-Samsung Common Platform technology initiative