Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "SMT assembly",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Antenna chip works deep indoors from
Siano Mobile Silicon, which we summarised at the time by saying "Covering the entire UHF spectrum, from 470 to 870MHz, the SMS8022 supports digital TV technologies such as DVB-T, DVB-H, ISDB-T, FLO and ATSC".
Earlier in the week,
we featured the news release Acquisition expands SMT support from
Gen3 Systems: "Merger will now bring around 15 new product families to Gen3 Systems for exclusive distribution within the UK and Ireland".
In December 2007, we covered the news from TT electronic manufacturing services (TTems)
- take a look at Investment anticipates UK manufacturing upturn
which says: "Contrary to the negative growth that many UK-based CEMs are currently experiencing, TTems is responding to an increasing number of market opportunities".
Take a look also at the news release from NBS Design, Test and manufacturing facility expanded,
as well as Second-user assembly kit targets Russian market from Alternative SMT,
and Soldering and reliability in the spotlight from Indium Corporation of America.
See also:
Troubleshooting and reliability in focus
(March 2007)
Lecture on lead-free electronics assembly at the SMT/Hybrid/Packaging Conference in Nuremberg, Germany, will emphasise troubleshooting and finished goods reliability
Show business deal leads to placement order
(December 2006)
A deal initiated at the Nepcon exhibition has resulted in Mydata selling two high-spec MY-Series placement machines to Cogent Technology
Machine vision ensures solder quality
(November 2006)
DEK has stepped up its collaboration with industry-leading vision specialists following the completion of a recent and successful solder paste inspection development project
SMT line improves production flexibility
(August 2006)
Clofield has just installed machinery from production automation system specialist Contax to equip its new lead-free SMT assembly line
Post-print verification doesn't miss a beat
(May 2006)
For production of today's electronics products, process speed is the name of the game and, until now, keeping up with the line beat rate meant sacrificing thorough inspection
Pick and place machines configured to order
(May 2006)
AlternativeSMT has developed an innovative approach to selling second user SMT assembly equipment by supplying Fuji QP242 pick and place machines configured to order
DIP switches suit space-constrained applications
(April 2006)
EAO offers a comprehensive range of high-quality, reliable and RoHS-compliant DIP switches, manufactured by switch and control specialist Grayhill
Workshops examine stencil printing performance
(March 2006)
A series of workshops during 2006 will provide information on stencil printing performance and how stencil technology and stencil design influences stencil printing performance
Papers explain stencil technologies
(January 2006)
Photo Stencil will present two papers at the upcoming IPC Printed Circuits Expo, APEX and Designers Summit
Low-profile card connectors aid miniaturisation
(October 2005)
A new series of low-profile connectors for SD memory cards and MultiMediaCards features a height of just 4.65mm
Chinese output expands on time
(September 2005)
Kingston Technology Electronics Co is opening on time and within budget in China, increasing Kingston Technology's China output to 5 million memory modules per month
Mass imaging solutions on show in Munich
(August 2005)
Between 15th and 18th November, Productronica 2005 will witness DEK presenting an impressive range of industry-leading high accuracy mass imaging solutions from Hall A4, Booth 305
Mexican university helps with lead-free research
(June 2005)
Henkel and Monterrey Technology Institute are to conduct ground-breaking research on lead-free solders, provide superior local customer support and afford unmatched educational opportunities
Complementary businesses come under one roof
(May 2005)
Following the opening of its state-of-the-art research and applications centre in Irvine, California, Henkel has completed the expansion of its Hemel Hempstead facility expansion in the UK
Study investigates stencil performance
(April 2005)
The nickel content of screen print stencils appears to be the figure of merit when migrating to lead (Pb)-free assembly
Chip-on-board modules suit embedded applications
(April 2005)
Swissbit reckons that its chip-on-board assembly method for memory modules offers many advantages not found in traditional surface-mount technology chip packaging forms
Platform-level innovations at Nepcon
(March 2005)
Visiting DEK at Nepcon Brighton 2005 will reveal platform-level innovations for high-productivity screen printing in advanced SMT assembly
Saturn acquisition adds Californian presence
(February 2005)
Integrated Microelectronics has completed the acquisition of the EMS and ODM assets of Saturn Electronics and Engineering (Tustin) and its subsidiary Saturn Electronics Philippines (Tustin)
Stencils enable speedy adhesive application
(September 2004)
VectorGuard PumpPrint stencils combine the speed and flexibility advantages of pump printing compared with dispensing, with the strengths of the VectorGuard tension system
Three move up at Indium
(June 2004)
The Indium Corporation of America has promoted three members of its engineering team
Substrate solves power LED thermal problems
(April 2004)
A novel aluminium-based substrate technology provides an optimum solution for thermal performance, yielding increased life expectancy and improved luminous densities for surface mount power LEDs
Lighting and inspection at Nepcon
(March 2004)
Special Applications Products will be exhibiting a wide range of lighting and machine vision products on stand H536 at Nepcon
Speedy placement head recognised at APEX
(February 2004)
The Lightning high-speed placement head from Universal Instruments has been selected for the Innovative Technology Showcase at APEX 2004
Tiny SM convertor puts regulated DC on the spot
(February 2004)
The Pico Brick iPB series delivers 10A of tightly regulated power from a tiny 29.3 x 30.5mm surface-mount footprint
Printer looks to next-generation packaging
(November 2003)
The Galaxy screen printer is a new platform that meets future speed and accuracy demands for SMT assembly and advanced semiconductor packaging
High-throughput print gains ultrafine resolution
(October 2003)
New ProFlex technology, introduced by DEK, will enable high accuracy mass imaging to surpass resolutions of 150um in commercial volumes
Profitable secrets revealed at Productronica
(September 2003)
This year at Productronica, DEK will showcase new tools and advanced process expertise conceived to help European assembly businesses seize opportunities in the resurgent world electronics industry
Platforms and tools on show in Munich
(August 2003)
DEK will showcase new platforms and new web-oriented support and operation tools on its stand at Productronica this year
Hybrid handles highest CCD performance
(May 2003)
The ADCDS-1405 is a functionally complete, top of the line image digitiser made for direct connection to the highest performing CCDs
Inline technology aids wafer-level processing
(November 2002)
Neil MacRaild of DEK explains how back-end packaging processes and technology must become more flexible for manufacturers to produce today's advanced packages at commercial prices
CSP test die covers all the standards
(September 2002)
Amkor has adopted the Ultra CSP as its standard wafer level package offering, available now from Practical Components
Software speeds SMT assembly operations
(May 2002)
Assembleon has upgraded its PPS Pro production preparation software to accelerate the setup, and increase the output, of component placement operations in SMT assembly
Mounter puts larger components on larger PCBs
(May 2002)
Assembleon's release of an enhanced Topaz-X component mounter further strengthens the company's position in the medium-volume SMT assembly marketplace
SM connectors aim for high-datarate integrity
(January 2002)
Honda Connectors has a new range of surface-mount connectors specifically designed for high-speed signal interfaces such as Ultra SCSI-320, PCI-X and future Ultra SCSI-640