Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "SOI",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Wafer share scheme brings 45nm to academia from
STMicroelectronics, which we summarised at the time by saying "The 45nm CMOS process builds on the successful collaboration that has allowed universities to access previous CMOS technology generations such as 65 and 90nm".
A few weeks before,
we featured the news release SBCs handle high voltages from
Atmel Corporation: "The Smartis high-voltage BCD-on-SOI technology and the SO8 power package allow the devices to operate at supply voltages of up to 40V".
In August 2007, we covered the news from Innovative Silicon
concerning its Z-RAM
- take a look at Memory licence brings Z-RAM to market
which says: "Hynix works with Innovative Silicon to bring Z-RAM technology to the US $30 billion-plus merchant memory market".
Take a look also at the news release from Atmel Corporation, Half-bridge driver runs from any automotive supply,
as well as LIN devices claim new EMI benchmarks from Atmel Corporation,
and Processors and memories meet military specs from Honeywell Defense and Space Electronic Systems.
See also:
Memory developer wins new patent ruling
(March 2007)
Silicon intellectual property holder has been awarded its 21st patent, and has another 43 more patent applications pending worldwide
LINbus transceiver keeps automotive signals clean
(March 2007)
Stand-alone LINbus transceiver IC claims new benchmark in EMI performance for reduced RF interference
Innovation Award for capacitorless memory device
(February 2007)
The 2006 Frost and Sullivan Product Innovation Award in the field of silicon-on-insulator (SOI) technology was presented to Innovative Silicon for the invention of the capacitorless memory device
Boudre to engineer substrate expansion
(February 2007)
Soitec has appointed former KLA-Tencor executive, Paul Boudre, to the newly created post of Executive Vice President of Sales, Marketing and Customer Support
Alliance pools CMOS and SOI research
(January 2007)
Freescale Semiconductor has joined the IBM technology alliance for joint semiconductor research and development
Ultra-dense memory technology improves speed
(December 2006)
Innovative Silicon has announced availability its second generation Z-RAM technology, named Z-RAM Gen2, which delivers significant performance improvements with greatly reduced power consumption
Precision amplifiers claim new standards
(November 2006)
Precision operational amplifiers combine ultralow noise with lower power, smaller package size and higher bandwidth than competing 36V amplifiers
IBM veteran heads up memory development
(October 2006)
Dr Gary Bronner has joined Rambus to serve as Technical Director
Papers present memory technologies
(September 2006)
Innovative Silicon will be participating in two prestigious events in early October
Driver takes charge of auto DC motors
(September 2006)
Driver IC is designed to control two DC motors or up to three different loads via a microcontroller in automotive applications
SoC designers invited to meet at DAC
(July 2006)
Innovative Silicon is organising meetings during DAC with SoC and microprocessor designers interested in reducing costs and improving the performance of their embedded memory implementations
Sensor takes over when GPS gets lost
(June 2006)
A new angular rate sensor (gyroscope) will enhance the accuracy of GPS instruments in situations where satellite reception is lost
Advisory board lines up technology expertise
(May 2006)
Innovative Silicon has recruited five semiconductor memory and silicon on insulator luminaries to participate in the company's newly formed Technology Advisory Board
Semiconductor industry gathers in Scotland
(April 2006)
The future of innovation and new pervasive technologies shaping European semiconductors will be the key topics for discussion at Semiconductor 2006 in Edinburgh during June
Processor powers ultraportable devices
(March 2006)
The VIA C7-M ULV processor promises unprecedented power efficiency to enable an exciting range of ultracompact ultraportable devices
US operation expands into Santa Clara
(February 2006)
Innovative Silicon has relocated its US headquarters to a larger facility in Santa Clara, California
Embedded memory works on 90nm SoI process
(January 2006)
Innovative Silicon has achieved silicon validation of Z-RAM memory arrays on 90nm SoI process technologies
News on the IEEE SOI Conference from Innovative Silicon
(December 2005)
A paper given at the IEEE SOI Conference shows the manufacturability of Z-RAM capacitor embedded memory technology in FinFET and TriGate devices with geometries below 45nm
Design kit smoothes the switch to SOI
(November 2005)
Soisic has successfully produced six working integrated circuits from 90nm silicon-on-insulator tapeouts to qualify its customer-owned-tooling (COT) design kit
SOI process promises analogue advantages
(October 2005)
A fully complementary silicon on insulator bipolar foundry technology is designed to meet the high performance requirements of DVD players, digital video recorders and ADSL modems
News on the SoI-CMOS transistors from Oki Electric
(October 2005)
Oki Electric has developed a new device structure for super low off-leakage current
BiCMOS technology improves operational amplifiers
(October 2005)
A proprietary BiCMOS analogue process technology from National Semiconductor improves the performance of the company's next-generation precision and low-power, low-voltage operational amplifiers
Twin-transistor RAM has no capacitors
(September 2005)
A novel high density capacitorless twin-transistor RAM (TTRAM) achieves both high speed operation and low power consumption
New company focuses on embedded memory technology
(September 2005)
Innovative Silicon (ISi) was founded to develop, commercialise and license floating body effect memory intellectual property (IP) for SoC/MPU applications
Embedded memory exploits SoI floating body effect
(September 2005)
Z-RAM embedded memory technology for SoCs can double memory density when compared with existing embedded DRAM solutions
Financing boosts sales and marketing capabilities
(September 2005)
Austin Ventures has led a $16 million Series B round of financing targeted at expanding Innovative Silicon's sales and marketing capabilities for its ultra-high-density memory technology
Simulator covers sub-100nm process MOSFETs
(July 2005)
T-Spice v11 is the latest version of the analogue circuit simulation platform from Tanner EDA
Characterisation system gains pulse capabilities
(July 2005)
Keithley Instruments now offers pulse generation and measurement in its Model 4200-SCS semiconductor characterisation system
Front-end tools are successfully installed
(July 2005)
IMEC has successfully completed the installation of its front-end-of-line tools by processing the first pathfinder lots
Reflective switch cuts its losses
(June 2005)
The PE4283 is an SPDT reflective switch for developing 'convergence' market and generic RF applications
Advanced SoI process set for commercialisation
(April 2005)
American Semiconductor will use manufacturing services from Silicon Valley Technology Center to commercialise its Flexfet advanced SoI CMOS wafer fabrication process
Analogue switch handles high-voltage signals
(March 2005)
Available now from Clare is the CPC7220, an eight-channel high-voltage analogue switch
First Japanese order for Elmos
(January 2005)
Elmos Semiconductor has received its first order from Japan: a large automotive supplier will apply an Elmos chip to control a motor management application
Rad-hard SoI process evolves to 150nm node
(October 2004)
Honeywell has developed a 150nm 15-million-gate IC technology that exponentially increases speed and bandwidth capabilities for processing and transmitting data in aerospace systems