Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Solder pastes",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Solder comes in handy-sized bars from
Almit Technology, which we summarised at the time by saying "Mini solder bars are an ideal size for use in small dipping pots and solder fountains".
A few weeks before,
we featured the news release Pb-free solder paste is top innovation from
Indium Corporation of America: "Indium5.1AT Pb-free solder paste has won the Innovation Award at Nepcon China".
In April 2007, we covered the news from Indium Corporation of America
concerning its Solder paste products
- take a look at Solder pastes suffer from tin and silver rises
which says: "Indium Corporation has placed a surcharge on its silver- and tin-containing solder paste products, effective immediately".
Take a look also at the news release from Cookson Electronics, Tin market boom puts surcharge on solder,
as well as Dispenser is precise about lead-free paste from Contax,
and Rework flux works with lead and lead-free solders from Almit Technology.
See also:
Cabinets keep sensitive substances dry
(November 2006)
Kaisertech has introduced a range of dry cabinets for the storage of moisture sensitive products such as electronic components, PCBs, solder pastes and adhesives
Stencils and squeegees bring lead-free success
(October 2006)
A combination of proven design features have been brought together to ensure lead-free printing success through the adoption of stencils and squeegees from Tecan
Pb-free solder paste cleans up award
(September 2006)
Indium Corporation has been recognised with a Global Technology Award for its Indium5.1AT Pb-free solder paste
Reliability in focus at Mexican show
(September 2006)
Indium Corporation will feature its Reliability programme at Mexitronica, from 10th to 12th October 2006 in Guadalajara, Mexico
CEM expertise maintains wireless quality
(August 2006)
Contract electronics manufacturer Prism Electronics has provided an essential role helping Trackflow to bring to market an innovative wireless data transmission system
Stencils pass paste transfer test
(May 2006)
Photo Stencil has revealed the results of Universal SMT Laboratories' independent, extensive study, conducted in February 2006
Tests show promise of SAC-based solder pastes
(May 2006)
Research into screen printing for 0201 SMT components using SnPb and SAC solder pastes concludes that SAC pastes have an inherently wider process window
Reliability in focus at Boston show
(April 2006)
Indium Corporation will highlight its reliability programme at Nepcon East/Electro on 10th and 11th May 2006 in Boston
Lead-free reliability in focus in Shanghai
(March 2006)
Indium Corporation will highlight its reliability programme at Nepcon Shanghai Electronics Manufacturing Technology China from 4th to 7th April 2006
Papers explain stencil technologies
(January 2006)
Photo Stencil will present two papers at the upcoming IPC Printed Circuits Expo, APEX and Designers Summit
Pb-free suite on show in Munich
(October 2005)
Indium Corporation will be exhibiting its suite of Pb-free electronics assembly materials for WEEE and RoHS compliance at Productronica in Munich, Germany on from 15th to 18th November 2005
Distribution network covers Germanic markets
(October 2005)
The Electronics Group of Henkel is preparing to reach out to key regional markets in Germany, Austria and Switzerland with a specialised distribution network for solder wires and fluxes
Die bonder turns to sensor assembly
(October 2005)
A new machine is the first to offer die bond technology proven in high volume production at an attractive price/performance ratio for the sensor and micro assembly market
Report allays lead-free paste users' fears
(October 2005)
The NPL has published its report on the effect of voiding on lead-free reliability
Lead-free range aims for wider process window
(September 2005)
Cookson Electronics has focused on developing products with a greater process tolerance than previous generations of lead-free solder paste, wave solder flux, cored wire and wave solder bar
Solder paste eases process transition
(September 2005)
Halide-free no-clean Multicore MP218 solder paste is now optimised to enable modern Sn-Pb processes, allowing for the inevitable interaction with lead-free device finishes
Mexican university helps with lead-free research
(June 2005)
Henkel and Monterrey Technology Institute are to conduct ground-breaking research on lead-free solders, provide superior local customer support and afford unmatched educational opportunities
Lead-free process range comes together
(June 2005)
A new portfolio of products and services focuses on maximising productivity and process capability for customers screen printing with lead-free solder pastes
Study investigates stencil performance
(April 2005)
The nickel content of screen print stencils appears to be the figure of merit when migrating to lead (Pb)-free assembly
Stencil printer resolves to boost Pb-free accuracy
(March 2005)
New from Dima SMT Systems, the HS-100 is a semi-automatic stencil printer with an optional under-stencil cleaning unit
Squeegees are a vital component
(February 2005)
As the industry moves towards lead-free, Intertronics reckons that Permalex squeegees will become vital to the printing process
Lubricant reduces friction and stencil wear
(February 2005)
Permalex Metal Squeegees are infused with a polymer lubricant which reduces friction and stencil wear
Distributor targets Germany, Croatia and Slovenia
(November 2004)
GPS is the latest addition to the Indium Corp European distribution network, covering Germany, Croatia and Slovenia
Top award for mass imaging platform
(October 2004)
DEK's new Micron-class high accuracy mass imaging platform is the assembly solution of the year, according to the judges at the Electronic Industry Design Awards
Multifuse polymer PTC products go lead-free
(August 2004)
TTI Europe is helping industry comply with imminent legislation controlling the use of lead with the introduction of a complete series of lead-free Multifuse polymer PTC products
Robot dispenser has compact footprint
(January 2004)
The Unitek Eapro Diamond 100 benchtop robot dispenser has a footprint not much bigger than a sheet of A4 paper and can be used with a variety of production fluids from coatings to adhesives
Lead-free paste set to clean up
(September 2003)
Soldering specialist Cobar has developed a novel lead-free no-clean solder paste
Conro adds profiling to soldering portfolio
(June 2003)
Embedded Data Systems has appointed Conro Electronics as authorised distributor for its SolderStar range of temperature profiling systems within the UK
Software simulates reflow oven profiles
(May 2003)
Profile Seeker is an inexpensive software utility that allows the SMT engineer to simulate reflow oven heater and belt-speed changes and view the resultant effect to the reflow profile
Positive displacement dispensing from the syringe
(January 2003)
Intertronics has a novel technology for air-free volumetric dispensing
Heads make the most of expensive materials
(January 2003)
A new series of low-volume ProFlow transfer heads reduces costs and enhances the precision of high-accuracy mass imaging using very small quantities of high-value materials
Inline technology aids wafer-level processing
(November 2002)
Neil MacRaild of DEK explains how back-end packaging processes and technology must become more flexible for manufacturers to produce today's advanced packages at commercial prices
Mass imaging technology handles 300mm wafers
(November 2002)
DEK has successfully deployed a production wafer bumping solution for 300mm wafers at customer sites in Asia
Solder paste passes the Eurotherm test
(June 2002)
Eurotherm has named Koki as the leading supplier of solder paste for its range of thermodynamic control equipment