Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Solder reflow",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Wide viewing angle expands fitting options for LED from
Optek Technology, which we summarised at the time by saying "The 1204 package size provides OVSRRGBCC3 users with the option of mounting the LED as a top-emitting or side-emitting device".
A few weeks before,
we featured the news release IR sensor cuts space required from
TTI Europe: "The volume occupied by the SMD PIR sensor is 30% that required by traditional PIR sensors, resulting in lower costs".
In August 2007, we covered the news from Lord Corporation
concerning its ME-532 flip chip underfill
- take a look at Encapsulants suit lead-free soldering
which says: "ME-532 flip chip underfill is specifically formulated to achieve high reliability for in-package or chip-on-board applications where fast flow under large chips is required".
Take a look also at the news release from PennEngineering, Fasteners have the right angle onboard,
as well as No-flow underfill stars in Shanghai from Indium Corporation of America,
and WLAN power amp saves power for handhelds from Avago Technologies.
See also:
No-flow underfill wins award at APEX
(February 2006)
NF260 No-Flow underfill won the 2006 Vision Award at the APEX show in Anaheim, California
Thermal simulation turns to lead-free reflow
(February 2006)
New Flo/PCB software makes it possible to design PCBs for lead-free manufacturing by predicting thermal gradients during solder reflow processing
Novel no-flow underfill wins technology award
(December 2005)
Indium Corporation has received the Global Technology Award for its NF260 no-flow underfill
High-brightness LEDs aim for dashboard duties
(November 2005)
High-brightness red, red-orange, orange, amber, green and blue LEDs in the industry-standard Power PLCC-4 surface-mount form factor have integral lenses to produce a 30-degree viewing angle
Munich debut for solder reflow oven
(October 2005)
BTU Europe will exhibit a range of equipment at Productronica this year, including the latest version of the solder reflow oven for SMT processing, the Pyramax 125
Investment expands surface-mount capabilities
(August 2005)
Contract electronics manufacturer Mitsumi UK has boosted its service with an investment of a quarter of a million pounds in high-tech machinery to complement its surface mount manufacturing process
LEDs drop in to replace industry standards
(August 2005)
Agilent Technologies has introduced a family of high-brightness, white light-emitting diodes in the industry-standard PLCC-2 and Power PLCC-4 surface-mount form factor
Low-profile power chips aim for PoE deployment
(August 2005)
Power Integrations has expanded its DPA-Switch family of integrated circuits, introducing a low-profile option for the power over Ethernet market and other high-voltage DC/DC applications
Tactile switches designed for automated assembly
(April 2005)
The Components Division of Devlin Electronics has introduced a RoHS-compliant range of super-thin, fully sealed SMT tactile switches
Low-noise amplifier covers a wide bandwidth
(March 2005)
A new E-pHEMT MMIC low-noise amplifier targets applications in the 0.5 to 6GHz frequency range, including WLANs, WiMAX point-to-multipoint systems and cordless phones
MEMS microphones dominate new cellphone designs
(March 2005)
As designers continue to integrate new features into sleek new cellphone designs, there continues to be a drive for integrated components and for size reductions of each individual component
High brightness on surface mount LEDs.
(November 2004)
Agilent Technologies has introduced a series of surface-mount LEDs designed and qualified specifically for automobile interior and exterior lighting applications
Adapter simplifies PSOC emulation
(August 2004)
Ironwood Electronics has developed a novel small footprint surface mount package emulator foot for 5mm-body, 0.5mm-pitch pins such as the Cypress PSOC CY8C2XXXX family
Amp powers basestations up to 10GHz
(August 2004)
A new E-pHEMT MMIC medium-power amplifier is optimised for use as a driver in wireless fixed access-points/basestations operating at up to 10GHz
Tactile alternative to rubber keypads
(August 2004)
The SOT range of super-thin fully sealed SMT tactile switches are billed as a viable alternative to rubber-moulded keypads - which are anything but tactile in operation
Surface-mount RJ45s minimise scrap
(April 2004)
A new series of 1x1 tab-down 10/100Base-TX RJ45 surface-mount connectors feature integrated magnetics
Wolfson scraps lead from new products
(April 2004)
Wolfson Microelectronics is to supply all its new products in lead-free format only, compatible both with conventional SnPb and Pb-free soldering processes
Inductors aim for distributed power
(April 2004)
A new series of power shielded surface mount (SMT) power inductors is designed for use in local DC/DC power conversion
Lead-free reflow need not cost the earth
(April 2004)
A new range of energy efficient solder reflow and curing ovens boasts low delta-T, high performance and low operating costs
Tiny mouse is all-round performer
(February 2004)
Measuring less than 10 x 10 x 1.4mm, the MicroNav FSR is billed as the world's smallest OEM mouse which enables precise, 360-degree cursor navigation
Bridge that gap without silicone
(December 2003)
A new silicone-free, thermally conductive and electrically isolating gap filling material is designed for use in applications where silicone could contaminate key manufacturing processes
Bonding heads speed soldering operations
(July 2003)
A new family of air-actuated heads is specially designed to address pulsed heated hot bar reflow soldering applications
Basestation buffer replaces two-stage amplifier
(June 2003)
The latest E-pHEMT MMIC from Agilent Technologies is specifically designed for basestation LO buffer amplifier applications
SAW filters shrink to chip-scale packaging
(February 2003)
A new ultracompact range of RF SAW filters uses chip-scale packaging specifically to address the demanding miniaturisation and performance requirements for new generations of mobile phones
RF amp cuts wireless LAN cards down to size
(February 2003)
The Agilent MGA-545P8 is an E-pHEMT medium-power amplifier RFIC for 5 to 6GHz wireless LAN access points, network interface cards and fixed wireless applications
Leadless FET improves basestation performance
(November 2002)
Agilent Technologies has developed a miniature enhancement-mode pseudomorphic high electron mobility FET that combines exceptional RF performance, power efficiency and reliability
Batteries shrink into IC packages
(October 2002)
Application specific solid energy technology (ASSET) thin-film rechargeable batteries can be customised in physical size and energy capacity to fit on or within IC packages
Sockets integrate magnetics for gigabit integrity
(June 2002)
Pulse has three new PulseJack connector sockets with integrated magnetics which extend the family's data handling capability into the gigabit (1000Base-TX) range
Bags protect from static and moisture
(November 2001)
Static Control Components (Europe) offers a complete system for packaging and protecting sensitive electronic components, and assemblies, from both static electricity and moisture
Plasma cleaning improves packaging integrity
(March 2001)
Production Equipment Sales claims the Itrak plasma cleaning system eliminates delamination, improving wirebond strength, ensuring void-free underfill and giving increased die attachment