Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Solderability",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Ceramic capacitors suit sensitive applications from
Kemet Electronics Corp, which we summarised at the time by saying "Kemet's ceramic capacitors exhibit no piezoelectric properties as well as no capacitance change with respect to applied rated DC voltage or time".
A few weeks before,
we featured the news release Miniature toggle switches reduce costs from
Live Electronics: "Dailywell's high quality 1M miniature toggle switches provide a cost-effective alternative to a wide variety of well known brands".
In October 2007, we covered the news from Tecan
concerning its TECfin Connect
- take a look at Waveguide finishes offer choice of properties
which says: "Gold- and silver-based plating finishes provide flexible surface properties for custom waveguides in aerospace, defence, medical, security scanning and comms applications".
Take a look also at the news release from TTI Europe, Multilayer ceramic capacitors resist flexing,
as well as Flexible MLCCs resist PCB abuse from Kemet Electronics Corp,
and Resistors keep cool onboard from TT Electronics Welwyn Components.
See also:
Preconditioning for component Pb conversion
(August 2007)
Joel Deutsch and Michael Baker explain how proper preconditioning allows older ICs and semiconductor devices to be converted to become RoHS compliant
MLCC range offers unique values
(July 2007)
C0G dielectric MLCCs provide stable performance over an operating temperature range of -55 to +125C, and are also particularly well suited for audio applications and microphones
Interposers ease BGA device transitions
(June 2007)
BGA interposers offer a cost-effective method for converting lead-free BGA device packages for use on boards processed with tin/lead solder profiles
Flexible termination cracks MLCC reliabilty
(May 2007)
Multilayer ceramic capacitors feature novel end termination technology that absorbs flex stress in the termination area, thereby protecting the ceramic body and active layers
MLCCs promise high CV values
(May 2007)
Multilayer ceramic chip capacitors offer more options in C0G dielectric
Nepcon launch for upgraded solderability tester
(April 2007)
Solderability tester performs all forms of solderability tests in accordance with all major international standards
Super lightweight relay is sensitive sort
(April 2007)
Subminiature DIP relay is ideal for high density PC board mounting and has low coil power consumption
Lead-free alloy saves on silver
(March 2007)
Modified tin copper alloy offers outstanding performance without any silver content, making it an economical alternative to lead-free solders containing 3-4% silver
Capacitors come in smaller packages
(February 2007)
Kemet has brought out EIA 1210 case size capacitors, offering the same capacitance and voltage extensions as its newly expanded EIA 1812 line, only in a smaller package
Finishes adapt components' surface properties
(January 2007)
Gold-based finishes are designed to provide optimum durability, reliability and/or solderabiilty dependent on the application
Conference covers lead free components reliability
(January 2007)
IPC has joined forces with Soldertec Global to provide viable solutions to lead free quandaries by hosting an International Conference on Lead Free Components Reliability
Inductors promise high frequency performance
(November 2006)
Tight tolerance L0402 LGA inductor is based on thin-film technology, providing excellent high frequency performance and rugged construction for reliable automatic assembly
Current sense resistor handles automotive duties
(November 2006)
Resistor features a wider metal alloy resistive element that offers exceptional TCR ratings and superior thermal compliance
Automotive relays come in singles and duals
(November 2006)
Ultralightweight automotive relays offer contact arrangements of SPST NO and SPDT on both the single and the dual styles
Low-power relays handle heavy loads
(October 2006)
The compact and lightweight low-cost J105 Series relay is offered in both SPST NO and SPDT contact arrangements
Insulation resistance tester meets new standards
(October 2006)
Revised surface insulation resistance (SIR) standards are designed to improve reliability and integrity testing of products assembled with lead-free solder
SMT resistors approach wirewound performance
(October 2006)
Rugged surface mount devices are specifically designed for surge/pulse applications and for circuits subject to extreme thermal cycling
Solderability or soldering ability
(July 2006)
Gen3 Systems has called attention to the need for manufacturers to draw a clear distinction between solderability and soldering ability
Overcurrent protection devices come in SMD format
(June 2006)
Available now from TDA Elektronic Technology is the TSFP2S series of PTC overcurrent protection devices in SMD format
New identity for Concoat Systems
(June 2006)
Gen3 Systems has a new identity and management structure in order to better tackle the demanding electronics reliability challenges of lead-free assembly and further miniaturisation
Varistor arrays save space in handheld protection
(June 2006)
Varistor arrays are ideal for cellphones, HDDs and other portable electronic devices needing smaller devices that can suppress the static electricity of a high-frequency signal circuit
Flux boosts BGA bumping yields
(May 2006)
A high-viscosity water-soluble interconnect flux offers high yields in the BGA bumping process
Custom alloy cuts cost of Pb-free soldering
(April 2006)
As the lead-free deadline approaches, Cookson Electronics is reporting spectacular growth in sales of Alpha Vaculoy SACX across Europe
Lead-free materials to be experienced at Nepcon
(April 2006)
Henkel will showcase several innovative solutions and Pb-free compatible material systems at the Nepcon UK 2006 Lead-Fee Experience
US flexible circuits are supported in the UK
(March 2006)
UK design engineers have new local contact point for rigid-flex and flexible circuit specialist Advanced Flexible Circuits of the USA
Water-soluble flux works with both processes
(February 2006)
WF-1010 is a novel VOC-free water-soluble wave solder flux that is effective for use with both Sn/Pb and Pb-free assemblies
Thermal simulation turns to lead-free reflow
(February 2006)
New Flo/PCB software makes it possible to design PCBs for lead-free manufacturing by predicting thermal gradients during solder reflow processing
Research findings available free of charge
(January 2006)
The UK National Physical Laboratory has published a number of new reports, all of which are available to download free of charge
RoHS compliant alloy proves popular onboard
(November 2005)
Nickel silver is fast becoming the preferred alloy for the majority of board level shielding tasks according to Precision Micro, the Birmingham based precision metal components manufacturer
Inductors increase equipment density
(November 2005)
A new surface-mount wire-wound shielded inductor provides high reliability and enables easy surface mounting in close proximity to other components on the assembly board
Novel alloy claims top lead-free performance
(September 2005)
A new wave-soldering alloy is claimed to outperform the standard lead free solder bars currently available and so ease the trauma of transition to lead-free assembly
Thermistors aid handheld temperature compensation
(August 2005)
A new series of surface mount NTC thermistors is specifically designed for temperature compensation and control applications in handheld and portable electronic equipment
LEDs boast super high flux output
(July 2005)
A new series of 1W LEDs offers super high flux output and high luminance, reaching over 48lm at an operating current of 350mA
Electronics reliability equipment goes on show
(May 2005)
Concoat Systems will be offering advice to assist companies in selecting the right solutions to meet their needs and demonstrating its electronics reliability equipment on Stand G522 at Nepcon 2005