‘Soldering Process’
An Electronicstalk guide
Start with the news release
Trigon announces low-profile power inductor from
Trigon Components, which we summarised at the time by saying "Trigon has introduced its IRHL2D10P (3x3x1mm) low-profile power inductor. ".
Several months prior to that,
we featured the news release Timing analysis tool addresses speed limitations from
Magma Design Automation: "Magma Design Automation has unveiled Tekton, a timing analysis platform that is claimed to offer higher capacity and faster runtimes than traditional tools, without sacrificing accuracy. ".
In March 2010, we covered the news from Baolab Microsystems
- take a look at Baolab NanoEMS constructs MEMS within CMOS wafer
which says: "Baolab Microsystems has launched a new technology to construct nanoscale micro electro mechanical systems (MEMS) within the structure of the CMOS wafer using standard, high-volume CMOS lines.".
Take a look also at the news release from FC Lane Electronics , Lane details modular edge-connector range,
as well as Deposition Sciences provides LWIR bandpass filters from Deposition Sciences,
and Inertial introduces solid-state magnetometers from Inertial Aerosystems.
Latest stories...
Tyco offers jumper assembly for LED lights (March 2010)
Tyco Electronics has introduced a board-to-board screw-down jumper assembly for use in LED lighting strips, lighting controls and channel lettering.
Acces launches USB-based DAQ and control modules (March 2010)
Acces I/O Products has added the USB-AO series of small form-factor USB-based data acquisition (DAQ) and control I/O modules to its product offering.
LCR launches EC110 liquid-level control board (March 2010)
LCR Electronics is offering a control board that incorporates a solid-state and mechanical relay for dual redundant control of liquid level in process applications.
STI offers cable assembly kits and training (March 2010)
STI Electronics has introduced cable assembly kits and training to support customers involved in cable and harness assembly.
Enea extends technology lead with Hypervisor (March 2010)
Enea has announced that it has extended its multi-core technology lead with the Hypervisor.
Future launches development board at exhibition (March 2010)
Future Electronics has introduced the Connectnet Micro-Blox development board at the Embedded World exhibition in Nuremberg, Germany.
Development platforms added to Future-Blox range (March 2010)
Future Electronics has launched new products in its Future-Blox range of development platforms, supporting the ProASIC3 and Igloo Flash-based FPGAs from Actel.
Schmartboard boards target SMT connectors (March 2010)
Schmartboard has announced a range of boards for prototyping with Surface Mount Technology (SMT) connectors.