Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Soldering process",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Vertical headers suit mid-range power from
Molex UK, which we summarised at the time by saying "Molex' Mini-Fit RTC vertical headers can withstand high SMT solder-reflow temperatures and are compatible with lead-free RoHS reflow processes".
A few weeks before,
we featured the news release Wave soldering expansion is Blundell's hundredth from
CIL Custom Interconnect: "New machine complements existing selective soldering machines that have provided CIL with lead-free capability for the past four years".
In August 2007, we covered the news from Rogers Corp
concerning its R/flex Jade A
- take a look at Laminate system cleans up flex circuit designs
which says: "Halogen-free transparent epoxy polyimide laminate system is safe for the environment and delivers superior performance in an all-inclusive package for flexible circuit designs".
Take a look also at the news release from Photo Stencil, Reflow process handles the (w)hole board,
as well as Nepcon launch for upgraded solderability tester from Gen3 Systems,
and ATE advances aid production automation from Seica.
See also:
Push-push SIM card socket is 2mm high
(April 2007)
The SIMS60 2mm-high push-push SIM card socket, for GSM11.11 or the latest 3G USIM standard, has 6 or 8-pin options and is available in tape-and-reel packaging for automated high volume production
Electrolytic capacitors survive lead-free reflow
(April 2007)
New surface-mount V-chip aluminium electrolytic capacitors withstand reflow soldering to +260C
Chip capacitors handle the heat of reflow
(November 2006)
NIC Components has introduced six new series of SMT V-Chip capacitors that feature +260C soldering heat ratings
Speciality compound withstands lead-free reflow
(October 2006)
When Winchester Electronics began developing a complete line of RoHS-compliant products it found the plastics it had traditionally used could not handle lead-free reflow
Fume extraction systems banish acrid odours
(September 2006)
Rework professionals are increasingly calling for better health and safety measures and better fume extraction
Budget PCB package improves reverse engineering
(August 2006)
Affordable printed circuit board design system integrates schematic capture and PCB layout with features normally found in the world's most expensive PCB design systems
Solderability or soldering ability
(July 2006)
Gen3 Systems has called attention to the need for manufacturers to draw a clear distinction between solderability and soldering ability
Guidelines for high reliability sub-assemblies
(June 2006)
The INEMI High-Reliability RoHS Task Force has released a set of guidelines regarding assembly processes and reliability requirements for RoHS5 and RoHS6 subassembly modules
Voltage regulator connectors boost density
(June 2006)
The Mini Crown Edge connector, which is available in a variety of form factors, has recently been enhanced to offer greater choice in signal contact spacing and connector length
Frequency-control components suit WiMAX tasks
(June 2006)
Frequency-control components for WiMAX applications include low-phase-noise VCOs, low-phase-noise VC-TCXOs and high-rejection IF SAW filters
Wave solder flux scores a hat-trick
(January 2006)
A powerful new wave solder flux combines the benefits of residue-free performance, coverage of mixed-technology and through-hole applications and the ability to work with both Pb-free and SnPb solder
Big turnout for lead-free conference
(January 2006)
The recent National Physical Laboratory conference entitled 'Manufacturing reliable lead-free assemblies' attracted a capacity audience
Selective soldering kit meets lead-free demands
(December 2005)
The Pillarhouse range of selective soldering equipment is now available exclusively in the UK and Benelux from Contax
Lead-free wire is kinder on soldering iron tips
(December 2005)
A new formulation of Pb-free solder wire is designed to minimise the leaching of soldering iron tips and reduce the cost of tip degradation common at higher lead-free process temperatures
Selective soldering enhances manufacturing
(November 2005)
To further enhance its manufacturing capabilities, Ultra CEMS has recently purchased two EBSO SPA400 programmable selective soldering machines
Convertors offer lead-free upgrade
(October 2005)
The revised PKR DC/DC convertor is manufactured using an open frame building process, offering reduced cost and increased compatibility with lead free soldering processes
Mesh network answers home automation demands
(October 2005)
Thomas Jorgensen and Niels T Johansen describe how Z-Wave technology addresses the needs of the home control network, product development and manufacturing processes
Mazet moves towards RoHS compliance
(September 2005)
During 2005 Mazet will replace all parts and components containing lead in its development and production of printed circuit boards to make them RoHS-compliant, wherever requested by the client
Design issues for flex circuit manufacturers
(July 2005)
Nik Vyas from UK CAM looks at some of the constraints in the 'black art' of flexible circuit design
Selective soldering offers advantages
(February 2005)
Blundell Production Equipment offers several different styles of selective soldering machine
Thermal profiling to illustrate lead-free concepts
(February 2005)
SolderStar is to sponsor the 'thermal profiling' elements of the extremely popular Lead Free Experience seminars organised by the Smart Group at Nepcon UK in Brighton
Hand soldering with lead free alloys
(November 2004)
As companies start to implement lead free soldering processes, hand soldering and associated techniques have been identified as key functions in the manufacturing process requiring R+D
More options for VRM connectors
(November 2004)
Tyco Electronics has expanded the Elcon Mini Crown Edge line of low profile, high-current power connectors
Lead-free assembly line is up and running
(August 2004)
Following extensive trials, Weymouth based contract electronics manufacturing company Ultra Electronics Manufacturing Services has introduced a lead-free soldering process
Reflow ovens break new ground
(July 2004)
A new generation of Quattro Peak ovens for medium through very high volume applications includes many novel features, which until now have not been available in a reflow oven
Benchtop wave soldering ready for lead free
(May 2004)
The new lead-free ATF 20-F wave soldering system extends Contax's lead-free wave soldering solutions from ATF benchtop units to the full inline high-volume Electrovert systems
Soldering systems solve high-power LED dilemmas
(May 2004)
A new range of soldering systems has been developed specifically for processing high-power LEDs
Terminals suit through-hole reflow process
(April 2004)
A new range of terminals helps provide a cost-effective solution for surface mount technology assembly processes
SMD adhesive solves assembly problems
(April 2004)
Delo-Monopox MK096 is a heat-cured, single-part epoxy resin optimised for high-speed SMT processes as well as manual processing
Solderability tester evolves for SMT and Pb-free
(October 2003)
The long-established industry-benchmark Must solderability tester has been even further improved to accommodate the enhanced test accuracy needs demanded by the smallest surface mount devices
BGA inspection demands a closer look
(September 2003)
Paul Cooper, Product Manager at Blundell Production Equipment, explains why visual inspection is preferable to X-ray analysis in evaluating BGA joints
Industry must embrace lead-free processes
(June 2003)
Tony Inskip comments on progress towards the implementation of the WEEE and RoHS directives
Solderability tester takes in smallest SMDs
(May 2003)
The industry benchmark Must solderability tester has been improved to accommodate the enhanced test accuracy needs demanded by the smallest surface mount devices
More light from smaller LEDs
(April 2003)
Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain