Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Solderless",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Test socket promises minimal signal loss from
Aries Electronics, which we summarised at the time by saying "Socket is ideal for manual high-speed testing of devices such as CSP, micro-BGA, DSP, LGA, SRAM, DRAM and Flash, with pitches as low as 0.40mm".
A few weeks before,
we featured the news release Compliant pin connectors handle tough applications from
Onanon: "Onanon's innovations in compliant pin technology are made possible by its highly automated, close-tolerance milling manufacture".
In March 2007, we covered the news from ACAL Radiatron
concerning its JST connectors
- take a look at Franchise boosts range of connector technologies
which says: "Agreement extends connector linecard with options for wire-to-wire, wire-to-board and board-to-board systems, application tooling and a comprehensive range of solderless terminals and splices".
Take a look also at the news release from Molex UK, Low-profile RJ45 sockets go flat onboard,
as well as Shortform brings probe ranges together from Peak Test Services,
and Edgecard connectors maintain signal integrity from In2Connect.
See also:
One-piece connectors cut soldering demands
(August 2006)
Captivated solderless contact connectors are specifically designed for use with semirigid cables
Test probes switch to finer pitch
(June 2006)
Peak Test Services has introduced a new range of threaded switch test probes, the P202/GI5 Series, designed for use with 2.54mm (0.1in) centres
Termination method wins international patents
(March 2006)
Rapid Conn has received US and Chinese patents for a novel termination method for cable assemblies that ensures high-speed reliability and automation capability
Up to 30% savings on selected development tools
(November 2005)
Development boards and tool bundles of the FT series are discounted by 30% off regular retail prices
Low profile six-pack IGBT module handles 200A
(July 2005)
The SEMiX13 has been designed for motor ratings up to 37kW, allowing the SEMiX product range to seamlessly cover the power range from 0.75 to 200kW with modules for solderless assembly
Test socket boasts broad coverage
(June 2005)
A new test and burn-in socket accommodates device packages from 41 to 55mm2 in applications up to 1GHz
Chip-on-board modules suit embedded applications
(April 2005)
Swissbit reckons that its chip-on-board assembly method for memory modules offers many advantages not found in traditional surface-mount technology chip packaging forms
RF test sockets are made for use with handlers
(April 2005)
Aries Electronics has a new centre probe RF test socket designed specifically for use with Delta handlers
Kits offer low-cost intro to PSoC development
(February 2005)
Cypress MicroSystems has released three inexpensive development kits for its PSoC programmable system-on-chip mixed-signal array devices
Press-fit contacts enable solder-free connection
(July 2004)
Anderson Power Products has added new press-fit, solderless contacts to its popular PowerMod family of products
Tiny module is complete handheld Wi-Fi solution
(May 2004)
Agere Systems has released a small-form-factor 802.11g mobile Wi-Fi module specifically designed for handheld consumer devices
News on the Solderless Ultra-low Profile Tactile Switch from Omron Corp
(September 2003)
Omron has developed a solderless ultra-low-profile tactile switch that reduces production lead-time for operating parts of portable devices
Test sockets handle device burn-in
(July 2003)
Aries Electronics now offers a BGA/CSP test and burn-in socket for devices with a pitch from 0.50mm or larger in applications up to 1GHz
Futurebus data connectors
(November 2002)
The Harwin Futurebus connector system is based on a modular 2mm grid for high-density high-speed signal board-to-backplane applications at a datarate of 0.622Gbit/s
Hard metric backplane connectors run to 6.4Gbit/s
(September 2002)
New high-speed differential signal interconnection for next generation 6.4Gbit/s telecomms backplanes and high-speed measurement/control systems has been added to Honda's NCB hard metric series
Modular basis for Futurebus connector range
(August 2002)
Genalog has a new modular 2.00mm grid connector system for use in telecomms, networking and high-end computing applications
Flexible Futurebus connector system
(July 2002)
Harwin's new Futurebus connector system is a modular 2.00mm grid system for high density, high-speed signal board-to-backplane applications for datarates of 0.622Gbit/s
HF test socket takes two separate packages
(May 2002)
Aries Electronics has developed a high-frequency test socket with a replaceable spring probe interposer
2mm connectors support high-speed backplanes
(October 2001)
F-Pack-3 (FCN-086 series) hard metric 2mm connectors from Fujitsu are available in the UK from Young ECC
Catalogue features industrial interconnection
(October 2001)
Molex has released a catalogue of products available from its industrial division, focusing on its broad range of solderless terminals, wire management products and connectors
Press-fit technology improves throughput
(October 2001)
Sanmina Dublin, the leading contract manufacturer to the electronics manufacturing services market, has invested in advanced servoelectric press-fit technology from ASG, part of Tyco Electronics
Zero profile solderless socket
(June 2001)
Now available from Tyco Electronics, the Holtite socket is part of the renowned Augat brand, which today claims the widest range of products available on the market
High-reliability solderless connectors
(January 2001)
The D01 series from Harwin has been extended to include a range of 2.54mm pitch connectors, offering high reliability for solderless board-to-board applications