Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Surface mount assembly",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release PSUs are configured for medical applications from
Excelsys Technologies, which we summarised at the time by saying "Configurable power supply is approved to EN60601-1 and UL2601-1, providing up to 600W output in a slimline 1U x 260 x 89mm package".
A few weeks before,
we featured the news release High-efficiency supplies configured online from
Excelsys Technologies: "Ultracompact high-power-density power supplies can be configured to order with system power levels up to 600W".
In May 2007, we covered the news from Excelsys Technologies
concerning its Xvite series
- take a look at Speedy specification for medical power supplies
which says: "Configurable power supply range expands into the medical sector with the release of the Xvite series of medically approved supplies".
Take a look also at the news release from Frost and Sullivan, Increased demand for SMT inspection and test,
as well as Placement range covers high volumes and high mixes from Universal Instruments,
and Universal Instruments signs co-operation agreement from Universal Instruments.
See also:
Frequency-control components suit WiMAX tasks
(June 2006)
Frequency-control components for WiMAX applications include low-phase-noise VCOs, low-phase-noise VC-TCXOs and high-rejection IF SAW filters
Silicone materials support LED manufacture
(May 2006)
Dow Corning Corporation has launched an expanded family of silicone materials for the fast-growing light emitting diode (LED) market
Alliance improves high-density assembly
(April 2006)
A new electronics manufacturing technique could be of significant benefit to the aerospace and defence industries
News on the Surface mount assembly lines from Contax
(March 2006)
Contax has supplied and installed a third surface mount assembly line for electronic board manufacturer In-Line Electronics
Micro chip package promises major space savings
(January 2006)
The micro SMDxt (micro surface mount device extended technology) chip package, is the latest generation of wafer-level package technologies
Network sockets are RoHS-compliant
(October 2005)
GTK's range of low-profile RJ45 network sockets are now RoHS-compliant, well ahead of the new legislation due for implementation next summer
More power to CompactPCI systems
(June 2005)
Gresham Power Electronics has added to its market leading range of CompactPCI power supplies
Wafer-level packaging shrinks SoC designs
(May 2005)
LSI Logic Corporation has released its enhanced wafer-level packaging (WLP) technology for use in ASIC/SoC designs
Danish distributor comes onboard
(February 2005)
Danish company PC Trading has become the newest distributor in Europe for Indium Corporation of America
Switching power supplies show their flexibility
(January 2005)
The eFO800 is a new family of high density switching power supplies that can deliver from 600 to 800W continuous power output depending on configuration
Placement machine boosts throughput and quality
(December 2004)
CRS Electronics of Ware, Hertfordshire, has considerably increased production capacity and PCB build quality since installing a new iPulse M1 SMT placement machine and reflow oven
Assembly equipment manufacturer presents platform
(November 2004)
Universal Instruments has presented Binghamton University's Thomas J. Watson School of Engineering and Applied Science with a high accuracy surface mount placement platform
MMIC packaging expertise on show in California
(October 2004)
Labtech will be showcasing its high-tech capabilities at the 37th International Symposium on Microelectronics in Long Beach, California from 16th to 18th November 2004
Conference paper describes novel MMIC package
(August 2004)
Labtech has collaborated with TNO Physics and Electronics Laboratory to write a technical paper that will be presented at the European Microwave Conference in Amsterdam
On Board signs for latest placement system
(June 2004)
Surface mount equipment supplier VSMT has sold its first high-performance QPlacer HS 4000 component placement system
Tiny inductors are thermally stable
(June 2004)
New low cost 0402 and 0603 wirewound chip inductors from Wearns Cambion have excellent thermal stability thanks to the use of ceramic formers
A toggle switch for (just about) every application
(January 2004)
Knitter-Switch reckons it now offers the widest range of toggle switches available to designers worldwide
New SM line answers customer demands
(December 2003)
Crayford based electronics manufacturing solutions company Texcel Technology has purchased a new surface mount assembly line to cater for increased demand for its services
Isolated POL convertor sets new records
(September 2003)
Vicor has released its first VI chip voltage transformation module (VTM), the V048K015T80
Budget pricing for full SMT line
(June 2003)
Blundell Production Equipment can now supply a very competitively priced surface mount assembly line for less GBP 50,000
Kit checks out pick-and-place equipment
(June 2003)
The IPC-9850 test materials kit includes all the materials needed for manufacturers to test flexible placement machines and chip shooters to the specifications of the IPC-9850 standard
Low-cost switches are washable
(June 2003)
Knitter Switch has released two new families of low cost dual-inline switches
New dimensions in electronics manufacturing
(April 2003)
The latest version of the Dimensions programming and optimisation software includes enhanced support for Universal HSP 4797/4796 machines, as well as enhanced CAD import and viewing capabilities
Brighton seminars tackle process technology issues
(March 2003)
The Nepcon Brighton process technology seminar programme will cover a diverse number of topics this year, from circuit design to thermal management to PCB purchasing decisions
Characterisation kit for SM placement equipment
(December 2002)
A new kit from Dynamix Technology helps with surface mount placement equipment characterisation in accordance with the IPC-9850 standard
Inline technology aids wafer-level processing
(November 2002)
Neil MacRaild of DEK explains how back-end packaging processes and technology must become more flexible for manufacturers to produce today's advanced packages at commercial prices
Videos educate assembly personnel
(August 2002)
A new video package from Dynamix Technology will help companies to train assembly operators in through-hole and surface mount components, leading to association-sponsored certification
Custom prototype is a speedy freebie
(August 2002)
Speedboard has turned out its first customer board on its fast turn Kwikboard prototyping system - in less than 24 hours and for free
Contract manufacturer recruits more staff
(June 2002)
In contrast to many electronics companies, contract electronics manufacturer BI Electronics is continuing to recruit more staff to cope with increased business
Multitone offers bespoke manufacturing and repair
(April 2001)
Integrated wireless networking company, Multitone, has appointed David Johnson to head up its new third-party manufacturing and repair services division