Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Thermal conductivity",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release High power devices are made for RF and microwave from
IRC Advanced Film Division, which we summarised at the time by saying "Attenuator and terminator feature low VSWRs at high frequencies, providing an excellent combination of power dissipation and performance in the RF and microwave bands".
Earlier in the week,
we featured the news release Potting compound is key to protection from
Lord Corporation: "Two-comportment silicone elastomer solution enables a new technology to protect mission-critical electronic components from damage due to heat, shock and vibration".
In November 2007, we covered the news from Flomerics
concerning its EFD V8.1
- take a look at Software addresses mechanics of electronics
which says: "Simulation software contains many new enhancements built on Flomerics' 20 years experience and research in thermal analysis of electronics".
Take a look also at the news release from Arka Technologies, EMC specialist turns to thermal management,
as well as Ceramics expertise on show in Stuttgart from AdTech Ceramics,
and Encapsulant and potting agents are made for solar from Dow Corning.
See also:
PCB laminates answer RF demands
(September 2007)
Laminates provide the controlled relative permittivity, low loss and passive intermodulation response required by the wireless infrastructure market
Products keep LED heat down
(September 2007)
The 8940 thermally conductive adhesive tape manages thermal transfer away from the LED into the designated heat sink
Compound boasts high thermal conductivity
(August 2007)
Novel thermal transfer compound is particularly suited to many electrical and electronics applications
Thermal interface includes fibre for strength
(August 2007)
High-tensile-strength thermal interface material improves heat transfer between components and heatsinks, and provides durability for installation and long-term use
Cooling technology addresses shrinking electronics
(July 2007)
The increased power densities of modern electronic products demand new approaches to thermal management: Michael Dreyer looks at advances in thermal interface materials
Adhesive helps keep flip-chip BGAs cool
(May 2007)
High-performance thermal adhesive combines the proven reliability and flexibility of silicone-based chemistries with a silver filler to achieve high thermal conductivity
Novel crystals provide laser benefits
(May 2007)
Neodymium doped gadolinium orthovanadate single crystal diode pumped lasers are now available from Laser Components
Silicone elastomer protects critical components
(May 2007)
Two-comportment silicone elastomer enables a new technology to protect mission-critical electronic components from damage due to heat, shock and vibration
New materials add DPM module options
(April 2007)
Diode-pumped microchip modules comprise a 0.5mm thick Nd:YVO4 crystal that functions as a laser rod joined to 2mm thick KTP doubling crystals
Polyurethane resins go under the bonnet
(April 2007)
Flexible resins operate continuously at 155C and fulfil the stringent Class F requirements
Metal core PCBs keep powerful LEDs cool
(March 2007)
Dielectric material answers extreme thermal challenges of applications using high brightness LEDs
Silver-filled epoxy conducts heat and current
(February 2007)
Araldite 7047 epoxy adhesive is a high purity, 100% solids system designed for void-free bonding of circuitry and microelectronic chips to printed circuit boards
Composite material for high-power cooling fins
(February 2007)
AlSiC (Aluminum Silicon Carbide) from CPS Corporation is a metal matrix composite that enables cost-effective integration of cooling pin fins for high-power applications
Adhesives focus for exhibition stand
(January 2007)
Intertronics reckons that Stand D37 at the Southern Manufacturing Show at Thorpe Park on 7th and 8th February is the place to go for anyone who specifies or uses adhesives
Composite cools flip-chip packages
(January 2007)
Metal matrix composite provides high-performance lids, or heat spreaders, for the flip-chip IC packaging and optoelectronic market
Thermally enhanced board level shielding
(December 2006)
RoHS-compliant convergence technology combines EMI shielding and thermal management into a single-assembly solution
Captive screws maximise heat dissipation
(December 2006)
A new line of captive screws designed specifically for electronic heatsink applications provides a consistent, high-load mechanical fastening solution that maximises thermal conductivity
Cooling design software handles complex geometries
(November 2006)
Version 4.3 of Icepak introduces key new technologies in the thermal design of electronic systems
Power amplifier package survives Martian duties
(November 2006)
One of StratEdge's SE20 power amplifier packages is playing a key role in transmitting signals with information gathered from Mars Exploration Rovers Spirit and Opportunity back to earth
Thermal pads expand design options
(November 2006)
Expanded range of products from Universal Science updates the choice of thermal pads and accessories available to the design engineer of today
Greases enhance thermal reliability
(September 2006)
T-grease high performance thermal greases help cool thermally stressed components in the most demanding electronics applications
MOSFETs help maximise power densities
(September 2006)
MOSFETs are designed for applications where high efficiency and improved thermal conductivity are needed to increase power density
Silicon carbide materials come in two grades
(August 2006)
Morgan Advanced Ceramics offers Performance silicon carbide (SiC) for semiconductor processing equipment manufacturing
RO4230 high frequency circuit material
(August 2006)
Rogers Corporation will introduce its RO4230 high frequency circuit material at this year's Antenna Systems Show
Commercial markets drive power electronics
(June 2006)
Study predicts that military and high power electronic applications will be the catalysts for the development of a gallium nitride device market through to 2010
Coated thermal plates aid safety-conscious cooling
(June 2006)
The IsoEdge range of heatsink products can improve component packaging densities, reduce parts counts and cut the assembly costs of a wide range of electronic products
Softer gap filler boosts thermal performance
(June 2006)
Material provides an industry-leading combination of specifications, including thermal conductivity, softness, robustness and ease of use, for demanding applications such as cooling laptop CPUs
Process paves the way to low-cost power devices
(May 2006)
IMEC has demonstrated the growth of low-sheet-resistivity AlGaN/GaN high-electron mobility transistors on 150mm silicon wafers
Collaborative effort wins best paper award
(May 2006)
A paper co-authored by Flomerics and the Budapest University of Technology and Economics is the IEEE Transactions on Components and Packaging Technologies paper of the year
Presentation emphasises thermal design
(May 2006)
A presentation at the DesignCon 2006 conference encouraged electrical engineers to be more proactive about thermal management
Low-TC film resistors cover a wide range
(May 2006)
The USF300 Series of ultrastable low-TC ultraprecision film resistors has been developed for use in the most demanding precision analogue electronics applications
RoHS Directive switches materials
(May 2006)
This article looks at the implications of the RoHS Directive on the switch industry
Filler bridges thermal gaps
(April 2006)
High-performance, thermally conductive, electrically isolating, liquid gap filling material combines both an excellent conductivity of 3.6W/mK and exceptional softness
GaN-on-diamond wafer adds an extra option
(April 2006)
Group4 Labs has released a gallium-facing gallium-nitride-on-diamond semiconductor water