‘Tsop’

An Electronicstalk guide

Start with the news release Ramtron launches F-RAM family from Ramtron International, which we summarised at the time by saying "Ramtron has launched the first parallel device in a family of parallel and serial F-RAM products that offer high-speed read/write performance, lower-voltage operation and optional device features. ". Several months prior to that, we featured the news release ON Semiconductor offers surge protection devices from ON Semiconductor: "ON Semiconductor has announced the release of a family of low-capacitance Thyristor Surge Protection Devices (TSPD) designed to protect the next generation of high-speed telecom equipment. ".
 
In August 2008, we covered the news from Ramtron International - take a look at Memory takes the gamble out of system design which says: "Ferroelectric RAM replaces battery-backed SRAM in Aewin's gaming SBC to guarantee data integrity with a lower component count, less mechanical contact, higher reliability and greater security.".
 
Take a look also at the news release from Vishay Siliconix, Miniature MOSFETs maintain lower on-resistance, as well as Low-power SRAMs expand to 64Mbit density from Renesas Technology Europe, and Performance boost for Flash memories from Silicon Storage Technology.
 

Latest stories...
Automotive SDRAMs expand temperature range (November 2007)

Product family covers densities from 16 to 512Mbit and supports both -40 to +85C (A1 grade) and industry leading -40 to +105C (A2 grade) temperature ranges.

Ferroelectric RAM runs up to 2Mbit density (October 2007)

High density FRAM device targets SRAM-based industrial control, metering, medical, automotive, military, gaming and computing applications.

Asynchronous SRAMs support legacy systems (August 2007)

In addition to 1.8, 2.5 and 3.3V SRAMs, Integrated Silicon Solution now has a wide variety of 5V SRAMs from 256Kbit to 4Mbit.

Power switches combine to save handset space (July 2007)

Main battery switch, wall charging switch and USB charging switch elements are combined into a single component.

Package cuts MOSFETs down to size and heat (July 2007)

P-channel power MOSFETs in PowerPAK ChipFET packages promise advanced thermal performance in a compact 3 x 1.8mm footprint.

More options for magnetoresistive RAM (June 2007)

New devices include extended temperature range nonvolatile RAM targeting rugged application environments, such as industrial, military, aerospace and automotive designs.

Mosfets offer 3W dissipation in a tiny package (April 2007)

Vishay Silconix' new PowerPAK ChipFET package offers advanced thermal performance in a compact 3 x 1.8mm footprint.

Ferroelectric memory chips at 2Mbit capacity (April 2007)

Fujitsu Microelectronics has doubled the capacity of its ferroelectric memory (FRAM) ICs to 2Mbit.

Back to topBack to top

Further reading
Newsletter sign up

Request your free weekly copy of the Electronicstalk email newsletter ...

All suppliers A - Z

A Pro-talk Publication

A Pro-talk publication