Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "TSOP",
and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest.
Let me be your guide.
Start with
the news release Performance boost for Flash memories from
Silicon Storage Technology, which we summarised at the time by saying "Flash memories feature fast effective read and program performance, which gives systems using the devices fast boot and field update times".
A few weeks before,
we featured the news release Automotive SDRAMs expand temperature range from
Integrated Silicon Solution: "Product family covers densities from 16 to 512Mbit and supports both -40 to +85C (A1 grade) and industry leading -40 to +105C (A2 grade) temperature ranges".
In June 2007, we covered the news from Freescale Semiconductor
concerning its MR0A16A and MR2A16AV
- take a look at More options for magnetoresistive RAM
which says: "New devices include extended temperature range nonvolatile RAM targeting rugged application environments, such as industrial, military, aerospace and automotive designs".
Take a look also at the news release from Memorysolution, DRAMs packaged in DDR2 modules,
as well as Adapters cover a large range of popular packages from Atomic Programming,
and DRAM modules cover full range of applications from Dane-Elec.
See also:
Boost convertor is made for budget applications
(August 2006)
Boost convertor with dynamic output voltage programming has space-efficient packaging to minimise system footprint
Magnetoresistive RAM enters production
(July 2006)
The first commercial magnetoresistive random access memory (MRAM) device is now in volume production and available from Freescale Semiconductor
Lead-free process advice available at Nepcon
(April 2006)
Visitors to Nepcon UK will be able to discuss their lead-free process issues and requirements with OK International
Handheld convection tool aids rework
(April 2006)
A handheld convection tool has the flexibility to handle a wide range of thermally demanding production and rework applications, including lead-free
SDRAM upgrades to 16Mbit density
(April 2006)
A next-generation 16Mbit SDRAM is produced using an all-new 0.14um trench technology that offers die sizes comparable with traditional 0.11um technology but with vastly improved performance
Hot air tool handles lead-free components
(November 2005)
A low cost hot air tool is designed for removing and replacing thermally demanding lead-free components, from 0201s to 304-pin QFPs
Low power SRAMs come in 48-pin packages
(August 2005)
Renesas Technology Europe has extended its 16Mbit advanced low power SRAM series with a TSOP I (48-pin) package device
Conductive adhesive suits leadframe attachment
(July 2005)
Hysol QMI168 is a silver filled conductive adhesive designed specifically for attachment of integrated circuits to metallic leadframes
Speedy access for 16Mbit Flash
(May 2005)
The Eon Silicon Solutions EN29LV160 is a 16Mbit erasable, read/write nonvolatile Flash memory
Chip-on-board modules suit embedded applications
(April 2005)
Swissbit reckons that its chip-on-board assembly method for memory modules offers many advantages not found in traditional surface-mount technology chip packaging forms
Number of read/write cycles are unlimited
(March 2005)
A 1Mbit, 3V, nonvolatile FRAM product in a 32-pin TSOP package is Ramtron's highest-density FRAM to date and offers an unlimited number of read/write cycles
Big Flash chips boast super-fast programming
(September 2004)
Renesas Technology Europe reckons it has developed the world's fastest 4Gbit AG-AND type Flash memories, offering a programming speed of 10Mbyte/s
Thermal simulation optimises memory stack design
(September 2004)
Staktek, a leading supplier of high-density memory stacking solutions, is using Flotherm thermal simulation software to ensure that innovative new products meet thermal management requirements
Big Flash chips offer speedy erasure
(August 2004)
Silicon Storage Technology has entered production with the first of its 64Mbit Multi-Purpose Flash Plus (MPF+) product family
Flash chips ramp up to 4Gbit density
(April 2004)
Toshiba has developed the semiconductor industry's first 4Gbit single-die, multilevel cell (MLC), NAND Flash memory
Faster erasing for 32Mbit Flash memory
(March 2004)
Silicon Storage Technology has developed a high-performance 32Mbit Flash chip that boasts typical chip erase time of just 40ms
Speedy access for 1Gbyte DIMM
(November 2003)
SMART Modular Technologies now offers a 1Gbyte PC2700 registered DDR Value DIMM targeted to increase performance and lower costs for high-performance computing applications
Novel cell technology shrinks SRAM sizes
(September 2003)
A novel range of low-power 16Mbit SRAM products known as superSRAMs offers the world's smallest chip size of approximately 32mm2
Board checks out latest packages
(July 2003)
The PCB007 MicroLeadFrame (MLF) test board is really two test boards in one
Fast cycle RAMs deliver speed and capacity
(February 2003)
Two new fast cycle RAM (FCRAM) devices from Toshiba will suit high-performance network systems and other high-end applications requiring high-speed large capacity low-power memories
Fastest claim for 16Mbit asynchronous SRAM
(September 2002)
Cypress Semiconductor is sampling the industry's fastest, high-performance 16Mbit fast asynchronous family of SRAMs, with a significantly lower active power than its competitors
Synchronous DRAMs take temperature extremes
(August 2002)
New from Sunrise Electronics is a range of high-performance wide-temperature-range synchronous DRAM devices for use in automotive GPS, remote communications, and industrial applications
Achieving next generation memory densities today
(August 2002)
Chip-on-chip stacking technology can help designers achieve the highest possible electrical functionality and performance in the least possible amount of space
Flash memory is optimised for Bluetooth
(July 2002)
Cambridge Silicon Radio and Fujitsu have been working together to develop Flash memory optimised for Bluetooth requirements
Consumer SDRAM combines low power and high speed
(March 2002)
New and exclusive to Sunrise Electronics, Elpida Memory's 128Mbit synchronous DRAM devices combine high speed and low power for consumer applications
Speedy 16Mbit SRAMs are anything but static
(February 2002)
Hitachi is claiming the industry's fastest 16Mbit low-power SRAMs, with two new devices offering access times of 25ns
Smallest 512Mbit SDRAMs make high-density modules
(February 2002)
The industry's first 0.13-micron 512Mbit double datarate (DDR) synchronous DRAMs to be fully compatible with the Jedec standard for 333, 266 or 200MHz DDR-I SDRAM are available now
One chip handles all text to speech functions
(February 2002)
A new single-chip text to speech convertor allows developers to quickly create speech-enhanced products without adding significantly to the complexity of the system
Low-voltage operation puts Flash in the hand
(February 2002)
Sunrise Electronics has a new family of dual-operation Flash memory devices optimised for high performance in ultra-low-power mobile applications
32bit-wide Flash raises density and cuts costs
(October 2001)
GD Technik has introduced the latest series of high density, high-speed Flash SDRAM devices from Atmel, called the SFlash family
Approval for 184-pin FBGA-based DDR DIMMs
(October 2001)
Prototype 184-pin PC2700 registered FBGA-based DDR DIMMs from SMART Modular Technologies have been successfully tested and conform to the new JEDEC DDR333 standard