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Memory Devices and Modules
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AMD rewards Future Flash performance
Future Electronics has been presented with the 2001 European Demand Creation Award for High End Flash by AMD.
News from Future Electronics ( 8 March 2002)
Compact motor controller does it all on-chip
Featuring 3A-capable DMOS outputs and on-chip commutation logic, the A3936 is a cost-effective addition to the latest generation of three-phase brushless DC motor controller/driver ICs.
News from Solid State Supplies ( 8 March 2002)
EEPROMs meet latest VESA standard
Microchip has extended its serial EEPROM range with the first device to meet the VESA E-EDID 1.3 standard and a new packaging option for low- and mid-density devices.
News from Microchip Technology (28 February 2002)
TV time for Make-a-Wish
Training at Make-A-Wish Foundation UK will be much easier thanks to the gift of a large projection screen television and video by Toshiba.
News from Toshiba Electronics Europe (27 February 2002)
FIFOs feature double datarate capabilities
Acording to IDT (Integrated Device Technology), the high-performance TeraSync DDR FIFO family is the industry's only FIFO family with double datarate capabilities.
News from IDT (22 February 2002)
Speedy 16Mbit SRAMs are anything but static
Hitachi is claiming the industry's fastest 16Mbit low-power SRAMs, with two new devices offering access times of 25ns.
News from Hitachi Europe (19 February 2002)
Speedy EEPROMs have choice of interfaces
Catalyst Semiconductor has two new high-speed serial EEPROMs: the CAT93HC46 with a Microwire interface operates at 3MHz, and the CAT24FC32 with an I2C interface operates at 1MHz.
News from Catalyst Semiconductor (18 February 2002)
Thin-profile memory stack boasts 1Gbyte
Solid State Supplies is now supplying a thin-profile memory stack designed for use for a 1Gbyte thin-profile Registered DIMM for 1U servers.
News from Solid State Supplies (18 February 2002)
Smallest 512Mbit SDRAMs make high-density modules
The industry's first 0.13-micron 512Mbit double datarate (DDR) synchronous DRAMs to be fully compatible with the Jedec standard for 333, 266 or 200MHz DDR-I SDRAM are available now.
News from Sunrise Electronics (18 February 2002)
One-transistor one-capacitor cell boosts FRAMs
A new 256Kbit two-wire serial FRAM product uses a newly developed one-transistor, one-capacitor (1T/1C) memory cell that significantly improves the cost-per-bit ratio of resulting FRAM products.
News from Solid State Supplies (15 February 2002)
CompactFlash boosted to 1Gbyte
SMART Modular Technologies has expanded its high-performance ATA storage product family with the introduction of its 1Gbyte Type II CompactFlash (CF) 3/5V memory card.
News from SMART Modular Technologies (13 February 2002)
Low-voltage operation puts Flash in the hand
Sunrise Electronics has a new family of dual-operation Flash memory devices optimised for high performance in ultra-low-power mobile applications.
News from Sunrise Electronics (13 February 2002)
Ultra-low voltage for SDRAMs
Available now from Sunrise Electronics, the Elpida 128Mbit Mobile RAM achieves super-low power operation at 1.8V, making it well suited for mobile applications such as cellular phones and PDAs.
News from Sunrise Electronics (12 February 2002)
Memory cards hold up to 64Mbyte
Flint Smart has added Secure Digital memory cards to extend its range of convenient, secure storage for personal data and multimedia applications including audio, video and still images.
News from Flint ( 8 February 2002)
Brochure covers technology for portables
Toshiba Electronics has released a new brochure that will simplify and speed the selection of discrete ICs, high-frequency components and optoelectronic devices for mobile applications.
News from Toshiba Electronics Europe (28 January 2002)
NEC adds Verplex tools to SoC design flow
NEC has endorsed the Verplex Systems Conformal Logic Equivalence Checker as the formal verification standard for use in all of its worldwide technology development.
News from NEC Electronics (Europe) (18 January 2002)
New package provides stacks of memory
CS-Stack is a novel technology from DPAC that allows mechanical stacking of chip-scale package memory devices using a fine-pitch ball grid array (FBGA) interface.
News from Solid State Supplies (18 January 2002)
Nonvolatile memory takes clock and more onboard
The FM3808, the first in a new line of problem-solver memories from Solid State Supplies, is a combination of a 256Kbit nonvolatile FRAM with a real-time clock and system-supervisor functions.
News from Solid State Supplies (17 January 2002)
Four in one for futureproof mobile memory
Fujitsu has launched the world's first four-stacked multichip package (MCP) memory, the MB84VZ064A.
News from Fujitsu Microelectronics Europe (21 December 2001)
Low-power SRAMs squeeze 8Mbit into a CSP
Hitachi has a new 8Mbit low-power SRAM series designed for low-voltage industrial and consumer portable information terminals, such as communication, control and measurement products.
News from Hitachi Europe (18 December 2001)
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