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Memory Devices and Modules
Archive page 13 of 34
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Industry giant provides distribution support
Kingston Technology has signed industry giant Avnet Computing Components Europe to market and distribute its memory products across the UK, Europe, the Middle East and Africa.
News from Kingston Technology ( 2 February 2006)
Japanese giants collaborate at 45nm
NEC Electronics, Sony and Toshiba have agreed to jointly develop system LSI process technologies for the 45nm generation.
News from Toshiba Electronics Europe ( 2 February 2006)
Embedded Flash drives aim for handset use
Toshiba is collaborating with M-Systems on its new DiskOnChip (DOC) H3, the next generation of onboard, high density embedded Flash drives based on the DiskOnChip architecture.
News from Toshiba Electronics Europe (27 January 2006)
CompactFlash card claims new standards
The new Silicon Power 8Gbyte CompactFlash card is claimed to set new high standards in capacity, performance and low power consumption for longer shooting and recording.
News from Silicon Power Computer and Communications (27 January 2006)
AMD signs up for embedded memory technology
Advanced Micro Devices has contracted to purchase a Z-RAM embedded memory technology licence for potential use in its future microprocessor products. Brochure available
News from Innovative Silicon (24 January 2006)
Lewis takes embedded memory to market
Jeff Lewis has joined Innovative Silicon as VP of Marketing. Brochure available
News from Innovative Silicon (24 January 2006)
32bit-wide SRAMs expand to new depths
A 1M x 32bit asynchronous SRAM offers a direct upgrade path from Mintech's existing 512K x 32bit family.
News from Mintech Interconnect and Test (20 January 2006)
World Cup tickets are up for grabs
Football fans visiting the Toshiba Electronics Europe stand at Embedded World in Nuremberg will have the opportunity to win tickets for the 2006 FIFA World Cup.
News from Toshiba Electronics Europe (17 January 2006)
SD memory cards shrink to micro size
Kingston Technology has launched its new microSD memory card, as part of its strategy to support the rapidly growing smartphone market.
News from Kingston Technology (13 January 2006)
Embedded Flash drive promises easy integration
Hynix Semiconductor and M-Systems are collaborating on their first-ever jointly introduced embedded Flash drive based on field-proven DiskOnChip architecture.
News from M-Systems ( 6 January 2006)
No-tradeoff approach to Flash storage
User application article M-Systems' DOC H-series embedded Flash drive has been selected by XM Satellite Radio as the embedded storage solution for the recently launched XM portable radio receivers.
News from M-Systems ( 6 January 2006)
Development platform embeds Flash drive
M-Systems' DOC H-series embedded Flash drive has been integrated into PortalPlayer's personal media player development platform.
News from M-Systems ( 6 January 2006)
Flash drive boasts 1000x the density
A new 8Gbyte DiskOnKey USB Flash drive boasts 1000x the density of the original 8Mbyte DiskOnKey first launched in 2000.
News from M-Systems ( 5 January 2006)
Car audio development platform uses Flash drive
User application article Texas Instruments has integrated M-Systems' DOC H-Series embedded Flash drive (EFD) into its high-speed encode and playback solution for car audio applications.
News from M-Systems ( 5 January 2006)
EEPROM suits high reliability applications
A ceramic 128K x 32bit surface mount EEPROM module is designed for use in high reliability applications.
News from Mintech Interconnect and Test (14 December 2005)
Embedded Flash suits memory-hungry devices
New from M-Systems, DOC H3 is the company's next generation embedded Flash drive (EFD) based on a DiskOnChip architecture.
News from M-Systems ( 9 December 2005)
Ultimate claims for speedy CompactFlash cards
CompactFlash Ultimate cards offer the performance that high-end digital cameras and other fast capture and storage function devices need to perform at peak levels.
News from Kingston Technology ( 9 December 2005)
Renesas to quit Flash development
Renesas Technology Corp is to halt development of AG-AND Flash memory chips with capacities of 8Gbit and beyond.
News from Renesas Technology Europe ( 9 December 2005)
STMicroelectronics and Intel agree on Flash format
A common Flash memory subsystem will lower development costs for handset OEMs and enable them to get to market faster with feature-rich phones.
News from Intel Corporation ( 6 December 2005)
Paper claims long future for novel memories
A paper given at the IEEE SOI Conference shows the manufacturability of Z-RAM capacitor embedded memory technology in FinFET and TriGate devices with geometries below 45nm. Brochure available
News from Innovative Silicon ( 5 December 2005)
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