Latest news on Electronicstalk categorised by product type
Memory Devices and Modules
Archive page 3 of 34
Our RSS feed for Memory Devices and Modules press releases
Memory technologies come together
NOR, NAND and RAM combine in a single-bus single-package solution that offers a completely managed memory subsystem in a 10 x 13 x 1.4mm LBGA package.
News from Silicon Storage Technology (13 July 2007)
Handset Flash is made for emerging markets
The NOR VS family will enable handset OEMs to introduce simplified, high-performance entry-level phones for regions with rapid new subscriber growth.
News from Spansion (10 July 2007)
Alliance targets data Flash expansion
IP purchase is the first part of a development co-operation which will continue to the next generation of advanced Flash memory technologies.
News from Saifun Semiconductors ( 3 July 2007)
Card range extends handset capacity
Small-format high-speed high-capacity memory card extends microSDHC range from 256Mbyte to 4Gbyte.
News from Toshiba Electronics Europe (29 June 2007)
Serial devices provide higher-density Flash
Serial Flash memories boast capacities of 16 and 32Mbit in space-saving cost-effective 8-pin SOIC packages.
News from Winbond Electronics Corp America (27 June 2007)
USB memory stick has industrial credentials
Yamaichi now offers a USB stick as part of its industrial-specified Y-ConUSB series.
News from Yamaichi Electronics (25 June 2007)
Flash chips host both applications and data
Novel NAND Flash memories combine a configurable single-level cell memory area and a multilevel cell memory area to store applications and data on the same chip.
News from Toshiba Electronics Europe (22 June 2007)
Memory deal covers SRAM, NOR Flash and DRAM
Memory devices remain a strategically important segment of 2001's marketing programme and the addition of Amic will complement the existing line up.
News from 2001 Electronic Components (22 June 2007)
More options for magnetoresistive RAM
New devices include extended temperature range nonvolatile RAM targeting rugged application environments, such as industrial, military, aerospace and automotive designs.
News from Freescale Semiconductor (19 June 2007)
3D structure offers increased Flash density
Novel three-dimensional memory cell array structure does not rely on advances in process technology, and has minimal increase in the chip die size.
News from Toshiba Electronics Europe (13 June 2007)
Memory makes the grade under the bonnet
64Kbit FRAM with a high-speed serial peripheral interface is now Grade 1 AEC-Q100 qualified, making it suitable for automotive applications under the bonnet.
News from Ramtron International (12 June 2007)
Memory supply supports network development
Viking InterWorks becomes the primary source of Direct Rambus DRAM and module support for networking OEMs using the Intel IXP2800 network processor.
News from Viking InterWorks (12 June 2007)
Nonvolatile state saver brings system stability
Novel nonvolatile device saves the state of signals on demand and restores them to the correct state automatically on power up.
News from Ramtron International ( 5 June 2007)
64Mbit SDRAM runs hot and cold
64Mbit SDRAM is pin compatible with industry standard 4M x 16bit devices and is available with an extended temperature range from - 40 to +85C.
News from Amic Technology Corp (28 May 2007)
Memory modules address the need for speed
Kingston Technology describes its ultra-low-latency DDR2 800MHz 3-3-3 HyperX memory modules as the fastest performing memories available.
News from Kingston Technology (22 May 2007)
Flash architecture boosts I/O bandwidth
Novel NAND Flash architecture is first to satisfy the emerging industry requirements for fast read, fast program, long retention, high endurance, high capacity and low cost.
News from Mosaid ( 8 May 2007)
Assembly and test specialist named best supplier
A leading independent provider of semiconductor testing and assembly services, has been named Supplier of the Year by a memory specialist for its response to the client's wafer-sort requirements.
News from Spansion ( 4 May 2007)
Registered DIMMs range up to 8Gbyte
RoHS-compliant 8Gbyte four-rank DDR2 VLP DIMMs are designed for the high-density server market.
News from Viking InterWorks ( 1 May 2007)
Memory modules put more on server blades
Memory modules are designed with significant enhancements to the JEDEC standard, including registered functionality, reduced module height, advanced cooling features and densities up to 4Gbyte.
News from Virtium Technology ( 1 May 2007)
Micro memory card adapts to standard SD designs
2Gbyte microSD card comes with "mini" and "standard" size Secure Digital adapters.
News from Kingston Technology (27 April 2007)
Earlier news from this category...
Latest news from this category...
