Memory Devices and Modules

Archive page 2 of 34

Our RSS feed for Memory Devices and Modules press releases

Small-format SD cards boost storage to 4Gbyte

MicroSDHC cards are perfect to meet the rising communication and multimedia demands of mobile phones and digital devices.

News from Kingston Technology ( 1 October 2007)

Third-generation modules save embedded space

Memory modules are designed for space constrained next-generation AdvancedTCA, AdvancedMC, MicroTCA, PicoTCA, PC104, SBB canisters and PICMG SBCs.

News from Virtium Technology (26 September 2007)

EEPROM devices handle 125C temperatures

The 25XX512 and 25XX1024 are the industry's only 512Kbit and 1Mbit SPI serial EEPROMs specified to operate up to 125C.

News from Microchip Technology (24 September 2007)

Serial EEPROMs come in low-profile 8-pin packages

The novel XDFN package is ideal for height-constrained comms applications such as headsets, wireless LAN adapters and Bluetooth modules.

News from Atmel Corporation (21 September 2007)

Flash facility begins producing 300mm wafers

The SP1 wafer manufacturing site is the first factory constructed by Spansion since becoming an independent company.

News from Spansion (20 September 2007)

State saver avoids data loss

The FM111x operates like a conventional logic building block, but stores and retains the logic state in the absence of power.

News from Ramtron International (11 September 2007)

Wafer fab is ready for Flash expansion

Latest 300mm wafer fabrication facility is expected to start mass production in December 2007 and reach a production capacity of 80,000 wafers a month in the second half of 2008.

News from Toshiba Electronics Europe (10 September 2007)

SHDC card runs up to 32Gbyte

New cards meet the Class 4 specification in the SD speed class, ensuring they deliver the high level performance and functionality.

News from Toshiba Electronics Europe ( 7 September 2007)

FRAM device handles automotive temperatures

The FM25640-GA 5V, 64Kbit FRAM is now Grade 1 AEC-Q100 specified, making it suitable for automotive applications under the hood.

News from Ramtron International ( 4 September 2007)

Serial Flash runs faster

32Mbit serial Flash device with dual I/O guarantees high-speed performance in digital flat panel and set-top-box applications.

News from STMicroelectronics (30 August 2007)

Flash drives enhance PC performance

Memory devices enable users to boost system responsiveness of PCs running Vista by using USB memory as external memory.

News from Toshiba Electronics Europe (15 August 2007)

Asynchronous SRAMs support legacy systems

In addition to 1.8, 2.5 and 3.3V SRAMs, Integrated Silicon Solution now has a wide variety of 5V SRAMs from 256Kbit to 4Mbit.

News from Integrated Silicon Solution (14 August 2007)

CompactFlash cards lead for speed

PQI's 300x CF cards provide up to 45Mbyte/s reads and 34Mbyte/s writes - well above rapid continuous photo shoot requirements.

News from PQI Europe (13 August 2007)

Serial Flash boasts fastest interface

Quad-SPI architecture allows for greater than six times the performance of the current generation of serial Flash memories and offers a true code-execution alternative to parallel-NOR Flash.

News from Winbond Electronics Corp America ( 8 August 2007)

NOR Flash is ready for Chinese handset designs

Prequalification of Flash memory will enable manufacturers to get cost-effective, high-performance phones to market faster in China and other high-growth regions.

News from Spansion ( 7 August 2007)

Ferroelectric RAM remembers in-car entertainment

User application article Daesung-Eltec of Korea has used FRAM in the design of its new digital signal processing based car audio platform.

News from Ramtron International ( 2 August 2007)

Controllers take charge of solid-state storage

NAND controllers allow system manufacturers to optimise NAND costs, availability and performance requirements in the face of fast-changing NAND technologies.