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Communications ICs (Wireless)

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Latest articles from 'Communications ICs (Wireless)'

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Showing 576-600 of 1608 articles

RFICs help simplify power amplifier system designs

RF integrated circuits are capable of delivering the 100W RF output power required for GSM and Edge network basestations.

News from Freescale Semiconductor, Feb 14, 2007

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Multiband transceiver has global appeal

Single-chip CMOS transceiver provides global roaming capabilities with multiband UMTS and quad-band Edge.

News from Qualcomm, Feb 14, 2007

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Mobile platform speeds GPRS handset to market

The Broadcom CellAirity platform for mobile phone designs has been adopted by Lenovo for its recently introduced P768 multimedia GPRS handset.

News from Broadcom Corp, Feb 14, 2007

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Mobile broadcast technology demonstrated at 3GSM

Qualcomm and Abertis Telecom are conducting a live demonstration of MediaFLO mobile broadcast technology during 3GSM World Congress 2007in Barcelona, Spain.

News from Qualcomm, Feb 13, 2007

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GPS interoberability testing in London complete

NEC Corporation, NEC Europe and SiRF Technology Holdings have successfully completed a program of assisted-GPS (A-GPS) interoperability testing in London on a commercial GPRS/WCDMA network.

News from SiRF Technology, Feb 13, 2007

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SiRF works with Philips on low-cost 3G handsets

SiRF Technology Holdings is to collaborate with NXP Semiconductors, newly independent from Philips, to speed the development of cost-effective, location-aware 3G wireless handsets.

News from SiRF Technology, Feb 13, 2007

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Wireless industry trends discussed 3GSM

In addition to showcasing a wide range of innovative wireless solutions, Qualcomm executives will discuss key wireless industry trends this week at 3GSM.

News from Qualcomm, Feb 13, 2007

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Cellular chip design available in ASIC form

Cellular3G has implemented its TopHat W-CDMA chip design in 90nm Nextreme family of structured ASICs.

News from eASIC Corp, Feb 13, 2007

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Kamp to bring analogue/RF expertise

Peter Kamp is set to join H-Stream Wireless as Director of Analog/RF Engineering.

News from H-Stream Wireless, Feb 13, 2007

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Transceiver and baseband unite in single-chip Edge

Edge processor integrates Edge RF transceiver, all analogue and digital baseband functions and high performance multimedia and connectivity support.

News from Broadcom Corp, Feb 13, 2007

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NXP to purchase RF technologies

Silicon Laboratories has reached a definitive agreement for NXP to purchase its Aero transceiver, AeroFone single-chip phone and power amplifier product lines.

News from Silicon Laboratories, Feb 13, 2007

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WiMAX in focus at 3GSM

Fujitsu Microelectronics Europe is exhibiting its WiMAX devices, demonstrating its WiMAX solutions and unveiling its WiMAX SoC roadmap at the 2007 3GSM World Congress in Barcelona.

News from Fujitsu Microelectronics Europe, Feb 13, 2007

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3GSM showing for 65nm handset devices

Broadcom is showcasing new 65nm products for mobile handsets and handheld devices at this week's 3GSM World Congress in Barcelona, Spain.

News from Broadcom Corp, Feb 13, 2007

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Test system supports Assisted GPS development

Nemerix has standardised its GPS testing activities on Spirent's new ULTS-ADS testing platform.

News from Nemerix, Feb 13, 2007

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GPS ICs gain assistance for free

Extended Ephemeris solution enables mobile devices to acquire immediate positioning information "deep-indoors", in difficult garage scenarios, and in the harshest multipath environments.

News from Nemerix, Feb 13, 2007

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Voice over Wi-Fi design drives SunCorp handset

CSR has announced that its Wi-Fi (802.11 b/g) voice over Wi-Fi (VoWi-Fi) design, UniVox, has been selected by SunCorp Technologies for its first generation of Wi-Fi handsets.

News from Cambridge Silicon Radio, Feb 13, 2007

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VoWiFi design provides DECT-quality handsets

Accton's VM8168C phones have been designed around UniVox, CSR's VoIP phone example design, which uses UniFi, the company's single-chip Wi-Fi technology.

News from Cambridge Silicon Radio, Feb 13, 2007

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Chipset is first to support HSPA+

Qualcomm will sample the Mobile Data Modem (MDM) MDM8200 solution, the first chipset supporting HSPA+, by the end of 2007.

News from Qualcomm, Feb 13, 2007

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Mobile TV receiver chip supports three standards

Qualcomm has begun sampling its Universal Broadcast Modem (UBM) chip ahead of schedule.

News from Qualcomm, Feb 13, 2007

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Chipsets improve stand-alone-GPS performance

Qualcomm has introduced gpsOneXtra Assistance technology, an enhancement to its integrated gpsOne solution to improve stand-alone-GPS performance.

News from Qualcomm, Feb 13, 2007

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Broadcast trial points to increased coverage

Qualcomm and British Sky Broadcasting have announced the successful completion of a second joint technical trial of Qualcomm's MediaFLO system in the UK.

News from Qualcomm, Feb 13, 2007

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Chipset extends desktop experience to mobiles

Chipset is designed to make the smartphone more affordable and available to an increasing number of subscribers by enabling sub-$200 mobile broadband smartphones.

News from Qualcomm, Feb 13, 2007

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3G transceiver does away with SAW filters

CMOS RF transceiver provides a complete solution for 3G mobile terminals based on the W-CDMA air interface standard.

News from Analog Devices, Feb 13, 2007

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RF front-end module saves space in handsets

Module integrates FBAR-based duplexer with advanced power amplifier technology to create the industry's smallest integrated RF front-end module for UMTS Band 1 handsets.

News from Avago Technologies, Feb 13, 2007

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Motorola prefers Freescale

Motorola has reaffirmed its strategic relationship with Freescale Semiconductor by selecting the Austin-based company as a preferred supplier of 2G and 3G chipset platforms through 2009.

News from Freescale Semiconductor, Feb 12, 2007

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