Communications ICs (wireless)
(a sub category of Active components)
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Alliance aims to drive 3G adoption on laptops
The GSM Association and Intel Corporation have outlined an initiative to facilitate and drive the adoption of the GSM family of technologies in laptop computers.
News from Intel Corporation, Feb 16, 2006
Freescale to incorporate Broadcom Bluetooth
Broadcom is working with Freescale Semiconductor to integrate its Bluetooth technology incorporated into the Freescale i.300 3G platform.
News from Broadcom Corp, Feb 15, 2006
Bluetooth chip adds FM radio receiver
A new device integrates a complete Bluetooth radio and baseband along with a high-performance FM stereo radio receiver into a single chip.
News from Broadcom Corp, Feb 15, 2006
Top RFID job for Wollen
Innovision Research and Technology has appointed David Wollen as CEO.
News from Innovision Research and Technology, Feb 15, 2006
Modem module makes ZigBee easy to integrate
Panasonic Industrial Europe has unveiled a ZigBee-based modem module powered by Ember's semiconductors and software for OEMs wishing to enter the fast-growing ZigBee market.
News from Ember Europe, Feb 15, 2006
Edge RF subsystem yields efficient handsets
Sagem Communication has chosen to partner with Freescale to integrate Edge RF subsystems into its next-generation family of handsets to meet consumers' demand for performance and style.
News from Freescale Semiconductor, Feb 14, 2006
3G transceiver has all bands covered
A third-generation single-chip multistandard transceiver addresses 3G cellular applications worldwide across the 850MHz, 900MHz, 1.7GHz, 1.9GHz and 2GHz bands.
News from Sony Europe - Semiconductor Division, Feb 14, 2006
Platform addresses next generation components
Broadcom Corporation has announced its new CellAirity mobile platform to enable advanced, next generation cellular handsets.
News from Broadcom Corp, Feb 14, 2006
Chipset brings 3G phones down to $100
The CellAirity multimedia mobile phone platform is claimed to help manufacturers to develop handsets with leading-edge 3G functionality at 2G price points.
News from Broadcom Corp, Feb 14, 2006
Dual low-noise amp suits all cellular basestations
The CGY2109HV is a very-low-noise very-high-linearity amplifier for all GSM, DCS, PCS and W-CDMA basestations.
News from Ommic, Feb 13, 2006
Demonstration proves Bluetooth/Wi-Fi coexistance
CSR will demonstrate a VoIP call using its single-chip Wi-Fi silicon for consumer electronic devices, UniFi-1, while simultaneously co-existing with a Bluetooth HV3 connection to a headset at 3GSM.
News from Cambridge Silicon Radio, Feb 13, 2006
Positioning system finds home in PND design
The s SE8088L high-performance positioning system features in a reference platform that provides a cost-effective and fast route to designing feature-rich GPS-enabled multimedia devices.
News from SiGe Semiconductor, Feb 13, 2006
Arrow takes ZigBee range to Southern Europe
Arrow Europe has signed a distribution agreement to market Ember Corporation's ZigBee wireless mesh networking systems throughout Southern Europe.
News from Ember Europe, Feb 10, 2006
SAW devices to help with explosives detection
RF Monolithics is participating in a Small Business Innovation Research contract to develop an improved system to detect improvised explosive devices.
News from RF Monolithics, Feb 9, 2006
Chipset enables wideband featurephones
Analog Devices will demonstrate its first W-CDMA/Edge (W-Edge) chipset at the 3GSM World Congress in Barcelona.
News from Analog Devices, Feb 9, 2006
Second-generation IC cuts handset TV system size
Kino 2 is a second-generation mobile TV device, set to bring TV to smaller phones with longer battery life and lower cost.
News from Frontier Silicon, Feb 9, 2006
Near field communication on trial at 3GSM
3GSM will be the setting for the latestest ever demonstration of near field communication technology (NFC) - the easy-to-use short range wireless technology.
News from Philips Semiconductors, Feb 8, 2006
Top technical role for Huomo
Innovision Research and Technology has appointed Heikki Huomo as Technical Director.
News from Innovision Research and Technology, Feb 7, 2006
RF module brings wireless standards together
A new module is billed as the world's first complete RF front-end for Wi-Fi products designed to comply with the IEEE802.11n draft specification.
News from SiGe Semiconductor, Feb 7, 2006
Radio chip has universal appeal
The CMX7041 is a full-function half-duplex audio, signalling and data processing IC that is suitable for implementation in professional and leisure radio applications.
News from CML Microcircuits, Feb 7, 2006
TV tuner finds first handset niche
Microtune has received its first volume purchase order for its new DVB-H tuner.
News from Microtune, Feb 7, 2006
Colombatto takes more active role
Marty Colombatto, current Chairman of the Board of Staccato, has now become Chairman and Chief Executive Officer following the resignation of Rick Kornfeld.
News from Staccato Communications, Feb 6, 2006
Low-noise amp aims for brown goods applications
A new GaAs pHEMT MMIC low noise amplifier is ideal for 75ohm applications in CATV, set top box, home gateway and digital television applications.
News from MRC Components, Feb 3, 2006
Amplifiers have basestation bands covered
Two new GaAs pHEMT MMIC low noise amplifiers are intended for cellular/3G basestation and repeater applications.
News from MRC Components, Feb 3, 2006
Easy DSP/RF integration speeds headset to market
Gennum is using CSR's BlueCore technology in its nXZEN Bluetooth noise cancelling headset.
News from Cambridge Silicon Radio, Feb 3, 2006
Showing 876-900 of 1608 articles
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What is it?
Communications ICs (wireless):
Communications ICs are dedicated devices that may be used for the transmission, reception or processing of signals in a communications system, either wirelessly or wired.
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