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Heatsinks and Thermal Management
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Thermal interface materials available from stock
All Bergquist products available from Rapid electronics provide exceptional levels of performance and thermal conductivity. Brochure available
News from Rapid Electronics ( 4 April 2008)
Heatsinks deliver maximum heat dissipation
A huge range of standard components are available, and custom heatsinks can also be quickly and cost-effectively manufactured to suit individual applications. Brochure available
News from Live Electronics (21 March 2008)
Thermally conductive compound for US PCs
User application article TC-5121 gives customers robust thermal performance and high reliability at a better price than most other intermediate-performance compounds.
News from Dow Corning (12 March 2008)
Enclosure is cool choice for mission-critical kit
Integrated two-phase liquid cooling system means designers can package significantly more electronics capability into a smaller, lighter, more power efficient enclosure.
News from SprayCool (11 March 2008)
Thermal management complements EMC
Range encompasses single component PCB mounted heatsinks through to high-performance fan-cooled heatsink assemblies and liquid coolers. Brochure available
News from Schaffner (26 February 2008)
Memory coolers take heat pipes onboard
Heat pipe efficiently transports the heat from the memory module onto the detached aluminium heatsink on top of the module.
News from Nexus Technology (19 February 2008)
Quiet coolers keep latest processors in spec
Processor coolers combine heatsink structure with heat pipes that require only little airflow to perform, thereby keeping the noise level at a bare minimum.
News from Nexus Technology ( 8 February 2008)
Connectors link with liquid cooling
As part of the development Staubli modelled the thermal pressure and fluid dynamics of the system, to produce a thermal model of the cold wall. Brochure available
News from Staubli UK (Connectors) ( 1 February 2008)
Designs take the heat out of advanced electronics
Predefined, tested reference designs are customised to address intense heat and improve performance for specific engineering combinations.
News from Waytronx (17 January 2008)
Low-profile modules get active on cooling
Compact active cooling modules combine crossflow fans with special airfoil-fin heatsinks.
News from OLC (21 November 2007)
EMC specialist turns to thermal management
Range answers increasing demand from customers for a 'one-stop shop' for all their electronic, communication shielding and thermal needs.
News from Arka Technologies (16 November 2007)
Chillers keep quiet about rack cooling
Air-condensed water chillers very produce very little noise, which makes them ideal for urban areas subject to strict acoustic pollution regulations.
News from Emerson Network Power Adaptive Power and Cooling ( 5 November 2007)
Heat controllers improve IT reliability
Liebert HPM is particularly suitable to protect complex installations dedicated to the processing of huge data volumes
News from Emerson Network Power Adaptive Power and Cooling (17 October 2007)
Thermal interface is easy to apply
Silicone-based glass-fibre-reinforced thermal interface material comes with an optional adhesive coating.
News from Bergquist Company ( 8 October 2007)
Grease improves thermal management
Compound claims a new industry standard for thermal grease performance, with extremely low thermal resistance, high reliability and stability under adverse conditions.
News from Dow Corning (26 September 2007)
Heatsinks upgrade fan performance
Heatsinks allow designers to use compact crossflow fans as active cooling modules.
News from OLC (20 September 2007)
Thermal management keeps pace with fast processing
Technical background article The method of heat sink attachment can be crucial to the performance of the system.
News from Southco (13 September 2007)
Gaming PC chills CPU and graphics with liquid
User application article The new HP Blackbird 002 gaming PC illustrates the benefits of liquid cooling and shows how properly addressing system thermals can raise the performance limits and significantly reduce noise.
News from Asetek (11 September 2007)
Products keep LED heat down
The 8940 thermally conductive adhesive tape manages thermal transfer away from the LED into the designated heat sink.
News from 3M Electronic Materials ( 4 September 2007)
Thermal management covers the board
RS Components has compiled extensive range of thermal management products to create what it reckons is one of the most comprehensive offerings available.
News from RS Components UK (30 August 2007)
Compound boasts high thermal conductivity
Novel thermal transfer compound is particularly suited to many electrical and electronics applications.
News from Steadlands (27 August 2007)
Catalogue covers a range of cooling devices
The Kryotherm catalogue contains almost 50 pages of components designed for industrial applications, telecoms, domestic appliances, medical equipment and many other specialist areas.
News from Steadlands (24 August 2007)
Thermal interface includes fibre for strength
High-tensile-strength thermal interface material improves heat transfer between components and heatsinks, and provides durability for installation and long-term use.
News from MH+W International Corporation (17 August 2007)
Cooling technology addresses shrinking electronics
Technical background article The increased power densities of modern electronic products demand new approaches to thermal management: Michael Dreyer looks at advances in thermal interface materials.
News from Laird Technologies (17 July 2007)
Novel cooling technology wins patent recognition
A United States Letters Patent from the US Patent and Trademark Office covers proprietary WayCool thermal management technology.
News from OnScreen Technologies ( 4 July 2007)
The in(door)s and outs of thermal management
Catalogue covers comprehensive range of thermal management products for use in indoor and outdoor electrical and electronic cabinets.
News from Pfannenberg (UK) (25 June 2007)
Thermoelectric cooler aids astro imaging
User application article The new Artemis ART11002 charge coupled device camera uses a Kryotherm thermoelectric cooling device from Steadlands International.
News from Steadlands (24 May 2007)
Acquisition boosts shielding and thermal expertise
Parker Hannifin has acquired French EMI shielding and thermal management specialist Acofab, and will integrate the company within its Chomerics Division.
News from Chomerics Europe ( 2 April 2007)
Power products and heatsinks come together
Catalogue includes information on a range of embedded copper pipe heatsinks that can be custom drilled for isolated IGBT, MOSFET or thyristor/diode modules.
News from Power Products International (19 March 2007)
Uninterruptible supplies communicate with Cisco
UPS technology notifies system routers about minimum battery levels using a dedicated communication port that is completely isolated from the UPS circuit.
News from Emerson Network Power Precision Cooling (12 March 2007)
Metal core PCBs keep powerful LEDs cool
Dielectric material answers extreme thermal challenges of applications using high brightness LEDs.
News from Bergquist Company ( 8 March 2007)
High density racks cooled by liquid
Liquid cooling package solves problems of high power dissipation of up to 30kW as standard per rack. Brochure available
News from Rittal ( 7 March 2007)
Thermal management on show in San Jose
Metafoam Technologies will attend the Semi-Therm international forum dedicated to semiconductor thermal measurement and management.
News from Metafoam Technologies ( 7 March 2007)
Superconducting heat spreader packs a big punch
Patented thin planar thermal superconducting heat spreader boasts heat transfer performance 20 times greater than copper.
News from Novel Concepts (22 February 2007)
Cooling architecture addresses whole systems
The Liebert Adaptive Architecture is a set of solutions and services that include precision cooling, power protection and monitoring.
News from Emerson Network Power Precision Cooling (12 February 2007)
Composite material for high-power cooling fins
AlSiC (Aluminum Silicon Carbide) from CPS Corporation is a metal matrix composite that enables cost-effective integration of cooling pin fins for high-power applications.
News from CPS Corp ( 9 February 2007)
Piezoelectric pump powers liquid cooling
Alps Electric has completed development of a piezoelectric-type pump for liquid cooling of electronic devices that offers long operational life as well as high-discharge output.
News from Alps Electric (UK) (30 January 2007)
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