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Heatsinks and Thermal Management
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Free software aids enclosure design
A new software package helps designers to accurately and easily predict the thermal performance of enclosures of all types, and provides immediate recommendations for effective thermal management.
News from Sarel ( 2 September 2002)
Coolers run up to 200C ambient
Thermix has a range of high-performance thermoelectric microcoolers for cooling a wide range of microelectronic and optoelectronic devices.
News from Thermix (28 August 2002)
Clip is cleaner alternative for fixing heatsinks
Malico has developed a novel patented "Talon" snap-on clip as a complement to its MBH and EBH ranges of precision forged and extruded heatsinks.
News from European Thermodynamics (19 August 2002)
Thermoelectric modules control the climate onboard
A new range of miniature thermoelectric modules will provide accurate temperature control for electronic circuit elements such as ICs, waveguides, lasers, parametric amplifiers and photodetectors.
News from General Hybrid UK ( 5 August 2002)
Chillers aim for semiconductor manufacture
Julabo has a range of high-quality chillers covering wide temperature ranges from -95 to +250C.
News from Julabo UK (30 July 2002)
Diamond heat spreaders dissipate more than copper
Diamonex CVD diamond heat spreaders are ideal for high-power device applications, such as laser diodes, microwave FETs and MMICs, and advanced multichip modules.
News from Morgan Advanced Ceramics (26 July 2002)
Graphite interface shifts heat more efficiently
New eGraf Hitherm thermal interface products provide phase-change-like performance without the reflow or rework issue of phase-change interface materials.
News from European Thermodynamics (17 July 2002)
Thermoelectric elements heat and cool
Thermoelectric (or Peltier) elements are solid-state heat pumps that use the Peltier effect for reversible heating and cooling.
News from Hawco (16 July 2002)
Thermal interface simplifies heatsink removal
Thermflow T766 phase-change material provides a low thermal resistance interface between hot components and heatsinks.
News from Chomerics Europe ( 8 July 2002)
Software calculates enclosure cooling budgets
The latest version of Rittal's Therm software will calculate thermal parameters and choose the appropriate options for enclosure temperature control. Brochure available
News from Rittal (21 June 2002)
Clip gets a grip on thermal management
Micromark C and CD has a novel patented screwless clip to enhance the thermal performance and reliability of power electronic components when attached to heatsinks.
News from Micromark C and CD (10 June 2002)
Kings of cool extend heat components partnership
Micromark C and CD has agreed a new distribution partnership with Aavid Thermalloy, the thermal management specialist formed by the merger of Aavid Technologies and Redpoint Thermalloy.
News from Micromark C and CD (22 May 2002)
JMC to produce novel dual-flow heatsinks
JMC Products has become the first thermal supplier to license Agilent Technologies' patented dual-pass airflow technology for the server, workstation and desktop PC markets worldwide.
News from JMC Products (11 April 2002)
Cooling units for cabinet air conditioning
Schroff has a new family of cooling units for cabinet air conditioning.
News from Schroff UK ( 7 February 2002)
Thermal grease thinks it's a gel
New from Intertronics is an innovative thermal interface material.
News from Intertronics ( 7 November 2001)
Heatsinks generate 360-degree airflow
Molex is helping to offer maximum thermal performance and quieter PCs with its latest product - copper core radial fin heatsinks.
News from Molex UK (22 May 2001)
Ceramic heat spreaders replace heatsinks
Designed for EMI-sensitive applications, the latest low-profile heat spreaders from Chomerics provide a simple and effective method of cooling semiconductors.
News from Chomerics Europe ( 6 April 2001)
Tape sticks sinks without fasteners
The latest thermally conductive adhesive tape from Chomerics can significantly simplify PCB assembly by eliminating thermal grease and mechanical fasteners.
News from Chomerics Europe (22 March 2001)
Better conduction between component and heatsink
CM20 from Warth International provides thermal conduction between component and heatsink up to 85% more efficiently than standard silicone pads, or mica and grease solutions
News from Warth International ( 9 November 2000)
Free-standing air conditioning units available
WF Electrical has entered the air conditioning market with a range of free standing and wall-mounted units that are ideal for offices, conference facilities, hotels, clubs and domestic applications.
News from WF Electrical (17 August 2000)
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