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Heatsinks and Thermal Management
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Diamond-copper composite can keep chips cooler
Heathru is a novel low-cost diamond-copper composite material with immediate thermal management applications for semiconductor devices with high power densities.
News from Advanced Diamond Solutions (23 September 2003)
Lightweight heatsinks keep Pentium 4 under control
CoolFin heatsinks allow designers to reduce weight and save space while maximising thermal efficiency.
News from Molex UK (23 September 2003)
Software speeds thermal specification
The latest Pfannenberg PC-based thermal calculation software is now available free of charge on CD.
News from Pfannenberg (UK) (20 August 2003)
Liquid-based system keeps processors cooler
Rittal reckons its innovative, ready-to-install PCS power cooling system is the ideal solution for liquid cooling in standard rack systems. Brochure available
News from Rittal (20 August 2003)
Good conduct helps keep power semis cool
Designers with challenging heat problems can look to a new silicone-gel-based thermal management solution.
News from Gel-Mec UK (31 July 2003)
Thermal interface material aids rework operations
Hi-Flow 225UF has been developed in response to the high power digital interface market's need for a high-performance, reworkable phase change material.
News from The Bergquist Company (16 July 2003)
Long life for heatsink thermal tape
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
News from The Bergquist Company ( 3 July 2003)
Diamond composite dissipates more heat
Available now from Advanced Diamond Solutions, DiaCu-II is the latest generation of the company's HeaThru product family.
News from Advanced Diamond Solutions ( 2 July 2003)
Software simplifies thermal specification
The Therm 4.1 software package takes care of the complex calculation of climate control requirements, and now includes the new generation of Rittal TopTherm cooling units. Brochure available
News from Rittal (26 June 2003)
Software sorts out enclosure cooling
Carrying out thermal calculations for enclosures is now easier and faster than ever with the new version of the popular Clima software package from Sarel.
News from Sarel (16 June 2003)
Composite has high thermal conductivity
Advanced Diamond Solutions announces the release of its second product line, DiaCu-I, a diamond-copper composite with twice the thermal conductivity of copper.
News from Advanced Diamond Solutions (16 May 2003)
Conductive thermal interface tape aids cooling
A new electrically insulating phase-change material simplifies and speeds the implementation of thermal management solutions.
News from The Bergquist Company (14 May 2003)
Thermal management software aids maintenance
Rittal's latest enclosure cooling units offer total flexibility for all types of enclosure and provide a new dimension in fault finding and proactive maintenance using RiDiag II software. Brochure available
News from Rittal ( 4 April 2003)
Thermal products are silicon-compatible
Advanced Diamond Solutions (formerly TetraThermal) has announced the release of DiaSil-I, the first product line in the HeaThru thermal products family.
News from Advanced Diamond Solutions (18 March 2003)
Thermal materials provide the best of both worlds
Engineered to provide a solution for thermal management and structural problems in severe environments, the Ixion range of thermal materials combines the best properties of both metals and ceramics.
News from Atek Technology (30 January 2003)
Interface materials bridge the thermal gap
Kemtron has been appointed to distribute the WL Gore Polarchip range of thermal interface materials.
News from Kemtron ( 9 January 2003)
Gap fillers provide thermal relief
Chomerics has two form-in-place thermal gap filler materials that provide a highly conformable path between hot components and heat spreaders.
News from Chomerics Europe (31 October 2002)
New facility dedicated to thermal management
Rittal has opened new premises dedicated to manufacturing and testing thermal management products. Brochure available
News from Rittal (30 September 2002)
Air con drops in for cabinet cooling
Pfannenberg has a new range of door- or side-panel-mounted air conditioners for cooling electrical and electronic enclosures.
News from Pfannenberg (UK) (24 September 2002)
Thermal tape sticks sinks to plastic BGAs
Thermattach T410 thermal tape from Chomerics has been developed to provide a reliable method for bonding heatsinks to hot-running devices.
News from Chomerics Europe (20 September 2002)
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