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Heatsinks and Thermal Management
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Heater panels keep displays in top form
Avoiding condensation and degradation of display performance at lower temperatures can now be achieved by incorporating flexible or rigid flat heaters from Rowland Automation.
News from Rowland Automation (12 April 2005)
Insulating thermal interface is naturally tacky
Bergquist's new Sil-Pad 1500ST electrically insulating thermal interface material provides exceptionally high thermal performance, even at contact pressures as low as 69kPa.
News from Bergquist Company (17 March 2005)
Novel cooler pacifies processors quietly
Nexus has released its thermal management solution for the latest Intel Socket T LGA 775 processors.
News from Nexus Technology ( 4 March 2005)
Samsung opts for graphite-based thermal management
Samsung SDI is to manufacture its large screen plasma display panels using eGraf SpreaderShield natural graphite thermal heat spreaders.
News from GrafTech International ( 3 March 2005)
Composite is cool solution for high-power LEDs
Metal matrix composite is ideal for thermal management of high flux LED products, such as signal lamps, backlighting for signs, low profile luminaires, task lighting and display lighting.
News from CPS Corp ( 1 March 2005)
Composite promises cost-effective military cooling
AlSiC (aluminium silicon carbide) metal matrix composite is ideal for applications in military electronics.
News from CPS Corp ( 1 March 2005)
Cooling units suit smaller servers
Rittal has launched a new TopTherm range especially suited for small server applications. Brochure available
News from Rittal ( 4 February 2005)
Thermal test lab addresses cooling issues
A new thermal test lab is dedicated to the advancement of technology for solving the urgent cooling issues associated with increasing computer densities in today's data centres and server rooms.
News from American Power Conversion (25 January 2005)
Climate control for server racks
Climate control problems in server racks, created by the installation of blade and 1U servers, can be avoided by the installation of an LCP liquid cooling package from Rittal. Brochure available
News from Rittal (21 January 2005)
Substrates improve thermal management
AlSiC (aluminium silicon carbide) substrates from CPS Corp are ideal for power supply substrate applications, including carrier plates and heatsink materials for medical equipment power supplies.
News from CPS Corp (22 December 2004)
Fillers mind the (thermal) gap
Two new thermally conductive gap filling materials provide a thermally efficient interface between heat generating components and heat spreading or dissipating surfaces.
News from Chomerics Europe (13 December 2004)
Evaporation is easy answer to fuel-cell cooling
Cambridge Consultants has developed a novel "evaporative cooler" concept design for cooling the fuel cell powered laptop computers of the future.
News from Cambridge Consultants (10 December 2004)
Softest thermal management in sensitive situations
Bergquist has launched its Gap Pad S-Class thermally conductive gap-filling products providing exceptional thermal performance while applying little or no stress to pressure sensitive components
News from Bergquist Company (12 November 2004)
Alarm module watches over nine cooling fans
The SmartFan TachScan-9 digital fan speed alarm monitors tachometer pulses from up to nine DC fans or blowers and provides ORed pass/fail signals.
News from Control Resources (13 October 2004)
Novel approach improves CPU cooling
The SAN ACE MC Liquid is a novel high-performance liquid cooling system for CPU thermal management applications. Brochure available
News from EAO (14 September 2004)
Heaters keep enclosures warm and dry
Systems housed in enclosures going into extremely cold environments can now incorporate a 1kW heating solution with the ability to work in environments down to -33C. Brochure available
News from Rittal (13 September 2004)
Heat spreader keeps Sony's notebook cool
User application article The compact size and light weight of the Sony VAIO VGN-X505 PC are helped by the use of an innovative thermal management solution.
News from GrafTech International ( 7 September 2004)
Novel thermoelement promises "free" power sources
SDK has developed a novel high-performance thermoelement, a key component of modules that convert heat energy directly into electric energy.
News from SDK (20 August 2004)
Phase change material boosts thermal performance
Loctite PowerstrateXtreme is a reworkable phase-change thermal interface material ideally suited for use between a heatsink and a variety of heat dissipating components.
News from Henkel Technologies (18 August 2004)
Lightweight heat spreader makes the grade
For the second consecutive year R and D Magazine has included a product from the eGraf thermal management product line in its list of the most technologically significant products of the year.
News from GrafTech International (17 August 2004)
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