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Heatsinks and Thermal Management
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LED modules: taking the heat out of the situation
Technical background article Managing temperatures using appropriate packaging materials is essential to ensure the reliability of high-power LED applications, explains James Stratford of Universal Science.
News from Universal Science (26 December 2005)
MPU package lids build in thermal management
Technical background article Aluminium silicon carbide metal matrix composite materials meet the material property, design and pricing demands for MPU assemblies that require integrated heatsink thermal management solutions.
News from CPS Corp (15 December 2005)
Mastilock to focus on Silicon Valley
Anita Mastilock has joined Dimensions Consulting as Account Manager for the Silicon Valley area.
News from Dimensions Consulting (13 October 2005)
Thermoelectric temperature system comes together
A new range of assemblies from Electron Dynamics provide a fully integrated thermoelectric temperature system in an easy-to-use package.
News from Electron Dynamics ( 4 October 2005)
Patented tubing promises active cooling solutions
CPS has recently been awarded a patent for tubing integrally enveloped within AlSiC thermal management composite materials for active cooling solutions.
News from CPS Corp (15 August 2005)
Thermal grease fills wide and narrow gaps
T660 high performance thermal grease from Chomerics has been designed for use in high power applications that require maximum thermal performance.
News from Chomerics Europe (15 August 2005)
Thermal management line comes onboard
Symmetry Electronics is now authorised to promote and sell Andigilog's thermal management devices throughout the USA, Canada and Mexico.
News from Symmetry Electronics ( 8 August 2005)
Thermal management in ATCA compliant systems
Technical background article Nathan Lavoie, Vice President of Engineering at Control Resources, describes schemes for integrating fan control within the Advanced Telecom Computing Architecture.
News from Control Resources (12 July 2005)
Cabinets keep their cool outside
New air conditioning units are designed to create a stable temperature-controlled environment in electrical and electronic enclosures installed outside.
News from Pfannenberg (UK) ( 1 July 2005)
Front panels enhance thermal management
New thermal management front panels ensure that the cooling airflow across the width of the chassis cannot take the path of least resistance up through any unused slot positions.
News from APW Electronic Solutions ( 1 July 2005)
Free software simplifies thermal management
Free thermal calculation software enables engineers to calculate the cooling and heating requirements for an electrical or electronic enclosure.
News from Pfannenberg (UK) ( 6 June 2005)
European role for Delorme
Chomerics has appointed Lionel Delorme as its new European Sales Manager.
News from Chomerics Europe (16 May 2005)
Partnership agreements streamline Asian sourcing
Having recently monitored a 2 year trial period, Rowland Automation has now signed preferential partnership agreements (PPA) with three major manufacturers in China.
News from Rowland Automation ( 5 May 2005)
Acquisition aids thermal characterisation
Flomerics has acquired MicReD - a Hungarian based company formed in 1997 as a spinoff from Budapest University of Technology and Economics. Brochure available
News from Flomerics ( 3 May 2005)
Composite makes ideal housing for opto devices
AlSiC (aluminium silicon carbide) metal matrix composite is ideally suited for optoelectronic housings and lids.
News from CPS Corp ( 3 May 2005)
Metal matrix makes IGBT baseplates
The AlSiC (aluminium silicon carbide) metal matrix composite from CPS Corp is ideally suited as a thermal management material for insulated gate bipolar transistor (IGBT) baseplates.
News from CPS Corp ( 3 May 2005)
New office is dedicated to Southeast Asia
Dimensions Consulting has opened a full-time office in Singapore to support Southeast Asia.
News from Dimensions Consulting ( 3 May 2005)
Nokia is key for Reinikka
Chomerics has appointed Miika Reinikka as Key Account Manager for Finland and Estonia, he also has responsibility for the global coordination of the company's business with Nokia.
News from Chomerics Europe (29 April 2005)
Cool solution for 3.6MHz processors
The latest addition to the popular San Ace MC CPU cooling range is a long-life, low-noise and operationally efficient fan designed specifically for the latest 3.6GHz Intel Pentium 4 processor. Brochure available
News from EAO (25 April 2005)
Fillers improve package heat dissipation
PolarTherm XLR boron nitride fillers can deliver up to two times the thermal conductivity of other similar compounds.
News from GE Advanced Materials (22 April 2005)
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