Heatsinks and Thermal Management

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Softer gap filler boosts thermal performance

Material provides an industry-leading combination of specifications, including thermal conductivity, softness, robustness and ease of use, for demanding applications such as cooling laptop CPUs.

News from Bergquist Company ( 2 June 2006)

Filler bridges thermal gaps

High-performance, thermally conductive, electrically isolating, liquid gap filling material combines both an excellent conductivity of 3.6W/mK and exceptional softness.

News from Bergquist Company ( 1 May 2006)

Robinson takes charge of UK and Ireland sales

Chomerics Europe has appointed 34-year old Sam Robinson as Territory Sales Manager for the UK and Ireland.

News from Chomerics Europe (28 April 2006)

Thermal products add Turkish distribution

Aktif Neser Elektronik a specialist supplier for electronic components, test equipment and systems has been appointed by the Bergquist Company as its new representative in Turkey.

News from Bergquist Company (12 April 2006)

Heatsink software supports more devices

Forged heatsink supplier Alpha-Novatech has made its products available for download in HeatSinkDesigner format.

News from Mechanical Solutions (30 March 2006)

Tytgat takes on Germany, Austria and Switzerland

Chomerics Europe has appointed Jean-Claude Tytgat as Sales Manager for Germany, Austria and Switzerland.

News from Chomerics Europe (27 March 2006)

Software speeds heatsink sourcing

Heat Sink Designer is a software tool that focuses, as the name implies, exclusively on heatsinks.

News from Mechanical Solutions (20 March 2006)

Packaging systems take supervision onboard

Supervisory electronics provide flexible, adjustable security for monitoring parameters such as temperature, voltage and fan speed, as well as for supervising subracks and components. Brochure available

News from Rittal (17 March 2006)

Thermal interface takes heat off without pressure

Electrically insulating thermal interface material provides exceptionally high thermal performance, particularly in applications which use low contact pressures between components and heatsinks.

News from Bergquist Company (15 March 2006)

Metal matrix composite is RoHS compliant

AlSiC metal matrix composite is ideally suited for thermal management solutions for high brightness LEDs.

News from CPS Corp (14 March 2006)

Film-based insulator outperforms glass fibres

A thermally conductive low-cost film-based electronic insulator is designed for switch-mode power supply devices used in telecomms and computer networking products.

News from Laird Technologies ( 6 March 2006)

Thermal interface protects under the bonnet

T-gard 500 is a high-performance cost-effective flexible thermal interface material designed specifically for automotive applications.

News from Laird Technologies ( 3 March 2006)

Alliance aims to cool embedded systems

Hybricon and Parker Hannifin Advanced Cooling Systems are working together to provide advanced cooling technology in the embedded computing market.

News from Hybricon Corp (24 February 2006)

Substrates help LEDs burn brighter for longer

Anotherm substrate technology is ideal for LED display applications in gaming and vending machines, outdoor signage and display, emergency vehicle lighting, and architectural and general lighting.

News from IRC Advanced Film Division (23 February 2006)

Thermal grease improves heat dissipation

NanoFusion is a novel thermal grease compound claimed to offer the best cooling and overclocking performance with the thinnest amount of compound between the heatsink and CPU.

News from Cooler Master Europe (20 February 2006)

CPU cooler supports dual core processors

With its three embedded heat pipes, copper base and aluminium heatsink, the Hyper L3 delivers excellent heat dissipation.

News from Cooler Master Europe (30 January 2006)

Coolers keep notebooks under control

Notebook computers no longer risk getting hot and bothered with the new range of stylish Cooler Master NotePal all-aluminium notebook coolers.

News from Cooler Master Europe (19 January 2006)

Thermally conductive gap fillers prove their worth

User application article High volume applications adopt precured thermally conductive gap fillers as the preferred solution.

News from Chomerics Europe (16 January 2006)

Materials are a better fit for thermal management

Kunze thermal management solutions are designed to overcome imperfections in the surfaces of components to provide secure thermal performance while saving time and money in production.