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Heatsinks and Thermal Management
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Cooling unit takes the heat off data centre racks
American Power Conversion has announced the availability of InfraStruXure InRow RP, its new innovative cooling unit for data centres and small computer rooms.
News from American Power Conversion (30 January 2007)
Composite cools flip-chip packages
Metal matrix composite provides high-performance lids, or heat spreaders, for the flip-chip IC packaging and optoelectronic market.
News from CPS Corp ( 9 January 2007)
Liquid cooling systems retrofit server racks
To support existing air-conditioning systems, Rittal is now offering liquid-based cooling systems for retrofitting on server racks. Brochure available
News from Rittal ( 8 January 2007)
Cool answer for high-density server racks
The Liebert XDFN self-contained cooling module capacity is regulated by the use of digital control technology, an innovative solution exclusively offered by Liebert.
News from Emerson Network Power Precision Cooling (26 December 2006)
Acquisition adds to thermal management portfolio
Laird Technologies has acquired Supercool, a provider of custom designed thermoelectric based assemblies for thermal management across a wide range of markets.
News from Laird Technologies (20 December 2006)
Captive screws maximise heat dissipation
A new line of captive screws designed specifically for electronic heatsink applications provides a consistent, high-load mechanical fastening solution that maximises thermal conductivity
News from Southco (14 December 2006)
LED substrates are cool option in lighting
Anotherm technology is being specified for a variety of high-brightness LED illumination and display applications.
News from IRC Advanced Film Division (28 November 2006)
Thermal pads expand design options
Expanded range of products from Universal Science updates the choice of thermal pads and accessories available to the design engineer of today. Brochure available
News from Rapid Electronics (16 November 2006)
Thermal interface doesn't suffer from gas
Low-viscosity thermal interface material is designed to meet the challenges of the high-temperature and high-stress operating conditions in electronic packaging.
News from Polymer Systems Technology (13 November 2006)
Low-profile heatsinks cool tightly spaced boards
When compared with other heatsinks of equivalent size, low-height forged heatsinks have better thermal performance.
News from MRC Components (23 October 2006)
Franchise adds foils to thermal management options
Rutronik has signed a pan-European franchise with Balkhausen, the leading manufacturer of thermal management products.
News from Rutronik Elektronische Bauelemente (13 October 2006)
Screened vents balance cooling with EMC
Technical background article Ventilation openings often allow more in to them than just cool air; electromagnetic waves from surrounding devices can pass through the openings and cause interference.
News from Laird Technologies ( 9 October 2006)
Thermal interface material sticks to its task
Glass-fibre-reinforced silicon-based thermal interface material is designed specifically for high-volume automatic dispensing applications.
News from Bergquist Company ( 3 October 2006)
Greases enhance thermal reliability
T-grease high performance thermal greases help cool thermally stressed components in the most demanding electronics applications.
News from Laird Technologies (22 September 2006)
Liquid system keeps CPUs cool and dry
A novel liquid circulation cooling system provides improved thermal management while reducing the potential for leaks. Brochure available
News from Sunon ( 7 September 2006)
Substrates manage LED heat dissipation
Substrate material enables design engineers to mount visible LEDs and other components directly to it, eliminating the need for attached heatsinks, mounting hardware and assembly costs.
News from IRC Advanced Film Division ( 3 August 2006)
New UL94 V0 flame rated materials
Shielding materials combine microwave and RF absorption with design flexibility
News from Chomerics Europe (26 July 2006)
Cool connections at Converteam
User application article The inclusion of Staubli quick release connectors on the cooling circuits of the medium voltage inverters produced by Converteam at Kidsgrove significantly adds to the functionality and ease of use. Brochure available
News from Staubli UK (Connectors) (13 July 2006)
Recooling systems ensure central cooling
A new recooling series offers a ten-stage 4 to 150kW performance range. Brochure available
News from Rittal (15 June 2006)
Coated thermal plates aid safety-conscious cooling
The IsoEdge range of heatsink products can improve component packaging densities, reduce parts counts and cut the assembly costs of a wide range of electronic products.
News from Bergquist Company ( 5 June 2006)
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