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    <title>Heatsinks and Thermal Management latest news on Electronicstalk</title>
    <link>http://www.electronicstalk.com/indexes/categorybrowseeh.html</link>
    <description>Heatsinks and Thermal Management latest news on Electronicstalk</description>
    <language>en-gb</language>
    <copyright>Copyright (C)2008 Pro-Talk Ltd. All rights reserved.</copyright>
    <pubDate>Thu, 15 May 2008 08:00:00 UT</pubDate>
    <lastBuildDate>Thu, 15 May 2008 08:00:00 UT</lastBuildDate>
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    <item>
      <title>Thermal interface materials available from stock</title>
      <description>All Bergquist products available from Rapid electronics provide exceptional levels of performance and thermal conductivity.</description>
      <pubDate>Fri, 04 Apr 2008 08:00:00 UT</pubDate>
      <category>Rapid Electronics</category>
      <link>http://www.electronicstalk.com/news/rpi/rpi144.html</link>
    </item>
    <item>
      <title>Heatsinks deliver maximum heat dissipation</title>
      <description>A huge range of standard components are available, and custom heatsinks can also be quickly and cost-effectively manufactured to suit individual applications.</description>
      <pubDate>Fri, 21 Mar 2008 08:00:00 UT</pubDate>
      <category>Live Electronics</category>
      <link>http://www.electronicstalk.com/news/lid/lid111.html</link>
    </item>
    <item>
      <title>Thermally conductive compound for US PCs</title>
      <description>TC-5121 gives customers robust thermal performance and high reliability at a better price than most other intermediate-performance compounds.</description>
      <pubDate>Wed, 12 Mar 2008 08:00:00 UT</pubDate>
      <category>Dow Corning</category>
      <link>http://www.electronicstalk.com/news/doo/doo106.html</link>
    </item>
    <item>
      <title>Enclosure is cool choice for mission-critical kit</title>
      <description>Integrated two-phase liquid cooling system means designers can package significantly more electronics capability into a smaller, lighter, more power efficient enclosure.</description>
      <pubDate>Tue, 11 Mar 2008 08:00:00 UT</pubDate>
      <category>SprayCool</category>
      <link>http://www.electronicstalk.com/news/spf/spf100.html</link>
    </item>
    <item>
      <title>Thermal management complements EMC</title>
      <description>Range encompasses single component PCB mounted heatsinks through to high-performance fan-cooled heatsink assemblies and liquid coolers.</description>
      <pubDate>Tue, 26 Feb 2008 08:00:00 UT</pubDate>
      <category>Schaffner</category>
      <link>http://www.electronicstalk.com/news/sca/sca204.html</link>
    </item>
    <item>
      <title>Memory coolers take heat pipes onboard</title>
      <description>Heat pipe efficiently transports the heat from the memory module onto the detached aluminium heatsink on top of the module.</description>
      <pubDate>Tue, 19 Feb 2008 08:00:00 UT</pubDate>
      <category>Nexus Technology</category>
      <link>http://www.electronicstalk.com/news/neu/neu102.html</link>
    </item>
    <item>
      <title>Quiet coolers keep latest processors in spec</title>
      <description>Processor coolers combine heatsink structure with heat pipes that require only little airflow to perform, thereby keeping the noise level at a bare minimum.</description>
      <pubDate>Fri, 08 Feb 2008 08:00:00 UT</pubDate>
      <category>Nexus Technology</category>
      <link>http://www.electronicstalk.com/news/neu/neu101.html</link>
    </item>
    <item>
      <title>Connectors link with liquid cooling</title>
      <description>As part of the development Staubli modelled the thermal pressure and fluid dynamics of the system, to produce a thermal model of the cold wall.</description>
      <pubDate>Fri, 01 Feb 2008 08:00:00 UT</pubDate>
      <category>Staubli UK (Connectors)</category>
      <link>http://www.electronicstalk.com/news/sau/sau102.html</link>
    </item>
    <item>
      <title>Designs take the heat out of advanced electronics</title>
      <description>Predefined, tested reference designs are customised to address intense heat and improve performance for specific engineering combinations.</description>
      <pubDate>Thu, 17 Jan 2008 08:00:00 UT</pubDate>
      <category>Waytronx</category>
      <link>http://www.electronicstalk.com/news/ons/ons102.html</link>
    </item>
    <item>
      <title>Low-profile modules get active on cooling</title>
      <description>Compact active cooling modules combine crossflow fans with special airfoil-fin heatsinks.</description>
      <pubDate>Wed, 21 Nov 2007 08:00:00 UT</pubDate>
      <category>OLC</category>
      <link>http://www.electronicstalk.com/news/olc/olc102.html</link>
    </item>
    <item>
      <title>EMC specialist turns to thermal management</title>
      <description>Range answers increasing demand from customers for a 'one-stop shop' for all their electronic, communication shielding and thermal needs.</description>
      <pubDate>Fri, 16 Nov 2007 08:00:00 UT</pubDate>
      <category>Arka Technologies</category>
      <link>http://www.electronicstalk.com/news/anv/anv101.html</link>
    </item>
    <item>
      <title>Chillers keep quiet about rack cooling</title>
      <description>Air-condensed water chillers very produce very little noise, which makes them ideal for urban areas subject to strict acoustic pollution regulations.</description>
      <pubDate>Mon, 05 Nov 2007 08:00:00 UT</pubDate>
      <category>Emerson Network Power Adaptive Power and Cooling</category>
      <link>http://www.electronicstalk.com/news/emg/emg105.html</link>
    </item>
    <item>
      <title>Heat controllers improve IT reliability</title>
      <description>Liebert HPM is particularly suitable to protect complex installations dedicated to the processing of huge data volumes</description>
      <pubDate>Wed, 17 Oct 2007 08:00:00 UT</pubDate>
      <category>Emerson Network Power Adaptive Power and Cooling</category>
      <link>http://www.electronicstalk.com/news/emg/emg104.html</link>
    </item>
    <item>
      <title>Thermal interface is easy to apply</title>
      <description>Silicone-based glass-fibre-reinforced thermal interface material comes with an optional adhesive coating.</description>
      <pubDate>Mon, 08 Oct 2007 08:00:00 UT</pubDate>
      <category>Bergquist Company</category>
      <link>http://www.electronicstalk.com/news/brg/brg120.html</link>
    </item>
    <item>
      <title>Grease improves thermal management</title>
      <description>Compound claims a new industry standard for thermal grease performance, with extremely low thermal resistance, high reliability and stability under adverse conditions.</description>
      <pubDate>Wed, 26 Sep 2007 08:00:00 UT</pubDate>
      <category>Dow Corning</category>
      <link>http://www.electronicstalk.com/news/doo/doo105.html</link>
    </item>
    <item>
      <title>Heatsinks upgrade fan performance</title>
      <description>Heatsinks allow designers to use compact crossflow fans as active cooling modules.</description>
      <pubDate>Thu, 20 Sep 2007 08:00:00 UT</pubDate>
      <category>OLC</category>
      <link>http://www.electronicstalk.com/news/olc/olc101.html</link>
    </item>
    <item>
      <title>Thermal management keeps pace with fast processing</title>
      <description>The method of heat sink attachment can be crucial to the performance of the system.</description>
      <pubDate>Thu, 13 Sep 2007 08:00:00 UT</pubDate>
      <category>Southco</category>
      <link>http://www.electronicstalk.com/news/soq/soq103.html</link>
    </item>
    <item>
      <title>Gaming PC chills CPU and graphics with liquid</title>
      <description>The new HP Blackbird 002 gaming PC illustrates the benefits of liquid cooling and shows how properly addressing system thermals can raise the performance limits and significantly reduce noise. </description>
      <pubDate>Tue, 11 Sep 2007 08:00:00 UT</pubDate>
      <category>Asetek</category>
      <link>http://www.electronicstalk.com/news/asz/asz100.html</link>
    </item>
    <item>
      <title>Products keep LED heat down</title>
      <description>The 8940 thermally conductive adhesive tape manages thermal transfer away from the LED into the designated heat sink. </description>
      <pubDate>Tue, 04 Sep 2007 08:00:00 UT</pubDate>
      <category>3M Electronic Materials</category>
      <link>http://www.electronicstalk.com/news/mez/mez106.html</link>
    </item>
    <item>
      <title>Thermal management covers the board</title>
      <description>RS Components has compiled extensive range of thermal management products to create what it reckons is one of the most comprehensive offerings available.</description>
      <pubDate>Thu, 30 Aug 2007 08:00:00 UT</pubDate>
      <category>RS Components UK</category>
      <link>http://www.electronicstalk.com/news/rsc/rsc141.html</link>
    </item>
    <item>
      <title>Compound boasts high thermal conductivity</title>
      <description>Novel thermal transfer compound is particularly suited to many electrical and electronics applications. </description>
      <pubDate>Mon, 27 Aug 2007 08:00:00 UT</pubDate>
      <category>Steadlands</category>
      <link>http://www.electronicstalk.com/news/stb/stb113.html</link>
    </item>
    <item>
      <title>Catalogue covers a range of cooling devices</title>
      <description>The Kryotherm catalogue contains almost 50 pages of components designed for industrial applications, telecoms, domestic appliances, medical equipment and many other specialist areas.</description>
      <pubDate>Fri, 24 Aug 2007 08:00:00 UT</pubDate>
      <category>Steadlands</category>
      <link>http://www.electronicstalk.com/news/stb/stb112.html</link>
    </item>
    <item>
      <title>Thermal interface includes fibre for strength</title>
      <description>High-tensile-strength thermal interface material improves heat transfer between components and heatsinks, and provides durability for installation and long-term use.</description>
      <pubDate>Fri, 17 Aug 2007 08:00:00 UT</pubDate>
      <category>MH+W International Corporation</category>
      <link>http://www.electronicstalk.com/news/mhw/mhw100.html</link>
    </item>
    <item>
      <title>Cooling technology addresses shrinking electronics</title>
      <description>The increased power densities of modern electronic products demand new approaches to thermal management: Michael Dreyer looks at advances in thermal interface materials.</description>
      <pubDate>Tue, 17 Jul 2007 08:00:00 UT</pubDate>
      <category>Laird Technologies</category>
      <link>http://www.electronicstalk.com/news/lir/lir137.html</link>
    </item>
    <item>
      <title>Novel cooling technology wins patent recognition</title>
      <description>A United States Letters Patent from the US Patent and Trademark Office covers proprietary WayCool thermal management technology.</description>
      <pubDate>Wed, 04 Jul 2007 08:00:00 UT</pubDate>
      <category>OnScreen Technologies</category>
      <link>http://www.electronicstalk.com/news/ons/ons100.html</link>
    </item>
    <item>
      <title>The in(door)s and outs of thermal management</title>
      <description>Catalogue covers comprehensive range of thermal management products for use in indoor and outdoor electrical and electronic cabinets.</description>
      <pubDate>Mon, 25 Jun 2007 08:00:00 UT</pubDate>
      <category>Pfannenberg (UK)</category>
      <link>http://www.electronicstalk.com/news/pfa/pfa109.html</link>
    </item>
    <item>
      <title>Thermoelectric cooler aids astro imaging</title>
      <description>The new Artemis ART11002 charge coupled device camera uses a Kryotherm thermoelectric cooling device from Steadlands International.</description>
      <pubDate>Thu, 24 May 2007 08:00:00 UT</pubDate>
      <category>Steadlands</category>
      <link>http://www.electronicstalk.com/news/stb/stb111.html</link>
    </item>
    <item>
      <title>Acquisition boosts shielding and thermal expertise</title>
      <description>Parker Hannifin has acquired French EMI shielding and thermal management specialist Acofab, and will integrate the company within its Chomerics Division.</description>
      <pubDate>Mon, 02 Apr 2007 08:00:00 UT</pubDate>
      <category>Chomerics Europe</category>
      <link>http://www.electronicstalk.com/news/cho/cho143.html</link>
    </item>
    <item>
      <title>Power products and heatsinks come together</title>
      <description>Catalogue includes information on a range of embedded copper pipe heatsinks that can be custom drilled for isolated IGBT, MOSFET or thyristor/diode modules.</description>
      <pubDate>Mon, 19 Mar 2007 08:00:00 UT</pubDate>
      <category>Power Products International</category>
      <link>http://www.electronicstalk.com/news/poz/poz102.html</link>
    </item>
    <item>
      <title>Uninterruptible supplies communicate with Cisco</title>
      <description>UPS technology notifies system routers about minimum battery levels using a dedicated communication port that is completely isolated from the UPS circuit.</description>
      <pubDate>Mon, 12 Mar 2007 08:00:00 UT</pubDate>
      <category>Emerson Network Power Precision Cooling</category>
      <link>http://www.electronicstalk.com/news/emg/emg102.html</link>
    </item>
    <item>
      <title>Metal core PCBs keep powerful LEDs cool</title>
      <description>Dielectric material answers extreme thermal challenges of applications using high brightness LEDs.</description>
      <pubDate>Thu, 08 Mar 2007 08:00:00 UT</pubDate>
      <category>Bergquist Company</category>
      <link>http://www.electronicstalk.com/news/brg/brg119.html</link>
    </item>
    <item>
      <title>High density racks cooled by liquid</title>
      <description>Liquid cooling package solves problems of high power dissipation of up to 30kW as standard per rack.</description>
      <pubDate>Wed, 07 Mar 2007 08:00:00 UT</pubDate>
      <category>Rittal</category>
      <link>http://www.electronicstalk.com/news/rit/rit213.html</link>
    </item>
    <item>
      <title>Thermal management on show in San Jose</title>
      <description>Metafoam Technologies will attend the Semi-Therm international forum dedicated to semiconductor thermal measurement and management.</description>
      <pubDate>Wed, 07 Mar 2007 08:00:00 UT</pubDate>
      <category>Metafoam Technologies</category>
      <link>http://www.electronicstalk.com/news/mxl/mxl100.html</link>
    </item>
    <item>
      <title>Superconducting heat spreader packs a big punch</title>
      <description>Patented thin planar thermal superconducting heat spreader boasts heat transfer performance 20 times greater than copper.</description>
      <pubDate>Thu, 22 Feb 2007 08:00:00 UT</pubDate>
      <category>Novel Concepts</category>
      <link>http://www.electronicstalk.com/news/nol/nol100.html</link>
    </item>
    <item>
      <title>Cooling architecture addresses whole systems</title>
      <description>The Liebert Adaptive Architecture is a set of solutions and services that include precision cooling, power protection and monitoring.</description>
      <pubDate>Mon, 12 Feb 2007 08:00:00 UT</pubDate>
      <category>Emerson Network Power Precision Cooling</category>
      <link>http://www.electronicstalk.com/news/emg/emg101.html</link>
    </item>
    <item>
      <title>Composite material for high-power cooling fins</title>
      <description>AlSiC (Aluminum Silicon Carbide) from CPS Corporation is a metal matrix composite that enables  cost-effective integration of cooling pin fins for high-power applications.</description>
      <pubDate>Fri, 09 Feb 2007 08:00:00 UT</pubDate>
      <category>CPS Corp</category>
      <link>http://www.electronicstalk.com/news/csc/csc114.html</link>
    </item>
    <item>
      <title>Piezoelectric pump powers liquid cooling</title>
      <description>Alps Electric has completed development of a piezoelectric-type pump for liquid cooling of electronic devices that offers long operational life as well as high-discharge output.</description>
      <pubDate>Tue, 30 Jan 2007 08:00:00 UT</pubDate>
      <category>Alps Electric (UK)</category>
      <link>http://www.electronicstalk.com/news/awo/awo133.html</link>
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